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CDB4352 Cirrus Logic Evaluation, Design Tools Eval Bd 192kHz DAC w/LD visit Digikey
WM8255SEFL Cirrus Logic IC 12MSPS 16 BIT AFE WITH LED DR visit Digikey
WM8255SEFL/R Cirrus Logic IC 12MSPS 16 BIT AFE WITH LED DR visit Digikey

diode GDP AA

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: -MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates - 3.3-, 4.4-, 5-, 6-Instruction Cycle Times - 2400/1800 , (GDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) (300 MHz only) Please be aware that an important notice , Contents GDP 272-Ball BGA package (bottom view) . . . . . . . . . . . . . 3 PYP PowerPAD QFP package (top , DIGITAL SIGNAL PROCESSORS SPRS186I - DECEMBER 2001 - REVISED MAY 2004 GDP 272-Ball BGA package (bottom Texas Instruments
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TMS320C6713 TMS320C6713B TMS32C6713BGDPA200 6713 SPRU266 TMS320C6713GDP225 ed13 diode C6713/C6713B 32/64-B 200-MH 167-MH
Abstract: -MHz (GDP), and 225-, 200-, 167-MHz (PYP) Clock Rates - 3.3-, 4.4-, 5-, 6-Instruction Cycle Times - 2400 , -Pin PowerPAD Plastic (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] Please be aware that an important notice concerning availability, standard warranty , . . . . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD Texas Instruments
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SPRS186J c6713 platform TMS320C6713BGDP300 TMS320C6713 with gpio pin details S-PBGA-N272 pad S-PBGA-N272 TMS320C67 256K-B 64K-B 192K-B
Abstract: -MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates - 3.3-, 4.4-, 5-, 6-Instruction Cycle Times - 2400/1800 , (GDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) (300 MHz only) Please be aware that an important notice , Contents GDP 272-Ball BGA package (bottom view) . . . . . . . . . . . . . 3 PYP PowerPAD QFP package (top , DIGITAL SIGNAL PROCESSORS SPRS186I - DECEMBER 2001 - REVISED MAY 2004 GDP 272-Ball BGA package (bottom Texas Instruments
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MAR8 SPRU197 IEC60958-1 ED13 C67x C6713
Abstract: -MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates - 3.3-, 4.4-, 5-, 6-Instruction Cycle Times - 2400/1800 , (GDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (PYP) 3.3-V I/Os, 1.26-V , 1.4-V (300 MHz only) Internal (GDP) Please be aware that an important notice , SPRS186H - DECEMBER 2001 - REVISED MARCH 2004 Table of Contents GDP 272-Ball BGA package (bottom view , DECEMBER 2001 - REVISED MARCH 2004 GDP 272-Ball BGA package (bottom view) Y VSS VSS ED18 Texas Instruments
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6713 I2S AC97 application of dsp tms320c6713
Abstract: /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet Texas Instruments
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Abstract: /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet Texas Instruments
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Abstract: /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet Texas Instruments
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c6713 eeprom
Abstract: -1149.1 (JTAGâ' ) Boundary-Scan-Compatible 272-Pin Ball Grid Array (BGA) Package (GDP and ZDP Suffixes) CMOS , revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP , Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP 31 Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to â'recommendedâ') â' [Revision A] Updated/changed Description for RSV Signal Name, B11 GDP (to â'recommendedâ') â Texas Instruments
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TMS320C6711D SPRS292A 250-MH 32K-B 512K-B
Abstract: -1149.1 (JTAG) Boundary-Scan-Compatible 272-Pin Ball Grid Array (BGA) Package (GDP and ZDP Suffixes) CMOS , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages , section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP 31 Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to "recommended") - [Revision A] Updated/changed Description for RSV Signal Texas Instruments
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256k x8 SRAM TMS320C6711 TMS320C6711B TMS320C6711C
Abstract: /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet Texas Instruments
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RJP 30 h1
Abstract: /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet Texas Instruments
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ea8 diode
Abstract: /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-um/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet Texas Instruments
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00A7
Abstract: ) Package (GDP and ZDP Suffixes) CMOS Technology - 0.13-um/6-Level Copper Metal Process 3.3-V I/O, 1.4 , . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages (bottom view) . . . . . . . . . . , [4:3] Terminal Functions, Reserved for Test section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to "recommended") - [Revision A] Updated/changed Texas Instruments
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Abstract: ) Package (GDP and ZDP Suffixes) CMOS Technology - 0.13-um/6-Level Copper Metal Process 3.3-V I/O, 1.4 , . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages (bottom view) . . . . . . . . . . , [4:3] Terminal Functions, Reserved for Test section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to "recommended") - [Revision A] Updated/changed Texas Instruments
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Abstract: -MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates â' 3.3-, 4.4-, 5-, 6-Instruction Cycle , ' ) Boundary-Scan-Compatible 208-Pin PowerPADâ"¢ PQFP (PYP) 272-BGA Packages (GDP and ZDP) 0.13-Âum/6-Level Copper Metal Process â' CMOS Technology 3.3-V I/Os, 1.2â'¡-V Internal (GDP/ZDP/ PYP) 3.3-V I/Os, 1.4-V Internal (GDP/ZDP) [300 MHz] Please be aware that an important notice concerning availability, standard , . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 Texas Instruments
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SPRS294B
Abstract: -, 200-MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates â' 3.3-, 4.4-, 5-, 6 , ' ) Boundary-Scan-Compatible 208-Pin PowerPAD PQFP (PYP) 272-BGA Packages (GDP and ZDP) 0.13-Âum/6-Level Copper Metal Process â' CMOS Technology 3.3-V I/Os, 1.2â'¡-V Internal (GDP/ZDP/ PYP) 3.3-V I/Os, 1.4-V Internal (GDP/ZDP) [300 MHz] Please be aware that an important notice concerning availability, standard , . . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . Texas Instruments
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SPRS294A
Abstract: ) Package (GDP and ZDP Suffixes) CMOS Technology - 0.13-um/6-Level Copper Metal Process 3.3-V I/O, 1.4 , . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages (bottom view) . . . . . . . . . . , [4:3] Terminal Functions, Reserved for Test section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to "recommended") - [Revision A] Updated/changed Texas Instruments
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Abstract: -MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates â' 3.3-, 4.4-, 5-, 6-Instruction Cycle , ' ) Boundary-Scan-Compatible 208-Pin PowerPAD PQFP (PYP) 272-BGA Packages (GDP and ZDP) 0.13-Âum/6-Level Copper Metal Process â' CMOS Technology 3.3-V I/Os, 1.2â'¡-V Internal (GDP/ZDP/ PYP) 3.3-V I/Os, 1.4-V Internal (GDP/ZDP) [300 MHz] Please be aware that an important notice concerning availability, standard , . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 Texas Instruments
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Abstract: ) Package (GDP and ZDP Suffix) [C6712C Only] CMOS Technology - 0.13-um/6-Level Copper Metal Process (C6712C , . . . . . . . . 3 GFN BGA package (bottom view) [C6712 only] . . . . . . . . . . 4 GDP and ZDP BGA , P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 GDP and ZDP BGA package (bottom view) [C6712C only] GDP and ZDP 272-PIN BALL GRID ARRAY (BGA) PACKAGE ( BOTTOM VIEW ) Y W , , /3, ., /32 272-Pin BGA (GDP and ZDP) 0.13 um PD CPU ID+ CPU Rev ID Frequency Cycle Time Voltage Texas Instruments
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TMS320C6712 TMS320C6712C SPRS148K 150-MH 12/12C
Abstract: ) Boundary-Scan-Compatible 272-Pin Ball Grid Array (BGA) Package (GDP and ZDP Suffixes) CMOS Technology - 0.13-um/6 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages , Test section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP Device Support, device and development-support tool nomenclature: Updated figure for , TMS320C6711D FLOATINGPOINT DIGITAL SIGNAL PROCESSOR SPRS292 - SEPTEMBER 2005 GDP and ZDP BGA packages Texas Instruments
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256M-B
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