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TPD4E004DSFR Texas Instruments UNIDIRECTIONAL, SILICON, TVS DIODE visit Texas Instruments
TPD3E001DRY Texas Instruments UNIDIRECTIONAL, SILICON, TVS DIODE visit Texas Instruments
TPD2E001YFPR Texas Instruments DIODE UNIDIRECTIONAL, SILICON, TVS DIODE, LEAD FREE, DSBGA-4, Transient Suppressor visit Texas Instruments
ISL99125BDRZ-T Intersil Corporation 25A DrMOS Module with Diode Emulation and PS4; QFN24; Temp Range: 0° to 70° visit Intersil
ISL99135BDRZ-T Intersil Corporation 35A DrMOS Module with Diode Emulation and PS4; QFN24; Temp Range: 0° to 70° visit Intersil
UC1610J/883B Texas Instruments SILICON, BRIDGE RECTIFIER DIODE visit Texas Instruments

diode GDP AA

Catalog Datasheet MFG & Type PDF Document Tags

TMS32C6713BGDPA200

Abstract: 6713 SPRU266 -MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates - 3.3-, 4.4-, 5-, 6-Instruction Cycle Times - 2400/1800 , (GDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) (300 MHz only) Please be aware that an important notice , Contents GDP 272-Ball BGA package (bottom view) . . . . . . . . . . . . . 3 PYP PowerPAD QFP package (top , DIGITAL SIGNAL PROCESSORS SPRS186I - DECEMBER 2001 - REVISED MAY 2004 GDP 272-Ball BGA package (bottom
Texas Instruments
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TMS320C6713 TMS320C6713B TMS32C6713BGDPA200 6713 SPRU266 TMS320C6713GDP225 ed13 diode 6713 I2S C6713/C6713B 32/64-B 200-MH 167-MH

c6713 platform

Abstract: SPRS186J -MHz (GDP), and 225-, 200-, 167-MHz (PYP) Clock Rates - 3.3-, 4.4-, 5-, 6-Instruction Cycle Times - 2400 , -Pin PowerPAD Plastic (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] Please be aware that an important notice concerning availability, standard warranty , . . . . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD
Texas Instruments
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SPRS186J c6713 platform AC97 IEC60958-1 8284 clock generator AES-3 TMS320C67 256K-B 64K-B 192K-B

MAR8

Abstract: Architecture of TMS320C6713 -MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates - 3.3-, 4.4-, 5-, 6-Instruction Cycle Times - 2400/1800 , (GDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) (300 MHz only) Please be aware that an important notice , Contents GDP 272-Ball BGA package (bottom view) . . . . . . . . . . . . . 3 PYP PowerPAD QFP package (top , DIGITAL SIGNAL PROCESSORS SPRS186I - DECEMBER 2001 - REVISED MAY 2004 GDP 272-Ball BGA package (bottom
Texas Instruments
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MAR8 Architecture of TMS320C6713 boot mode tms320c6713 C6713 C67x ED13

6713 SPRU266

Abstract: AC97 -MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates - 3.3-, 4.4-, 5-, 6-Instruction Cycle Times - 2400/1800 , (GDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (PYP) 3.3-V I/Os, 1.26-V , 1.4-V (300 MHz only) Internal (GDP) Please be aware that an important notice , SPRS186H - DECEMBER 2001 - REVISED MARCH 2004 Table of Contents GDP 272-Ball BGA package (bottom view , DECEMBER 2001 - REVISED MARCH 2004 GDP 272-Ball BGA package (bottom view) Y VSS VSS ED18
Texas Instruments
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application of dsp tms320c6713

S-PBGA-N272

Abstract: 6713 SPRU266 /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet
Texas Instruments
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S-PBGA-N272

6713 SPRU266

Abstract: EXTERNAL MEMORY INTERFACE IN TMS320C6713 /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet
Texas Instruments
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EXTERNAL MEMORY INTERFACE IN TMS320C6713

TMS320C6713 with gpio pin details

Abstract: S-PBGA-N272 pad /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet
Texas Instruments
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TMS320C6713 with gpio pin details S-PBGA-N272 pad c6713 eeprom
Abstract: -1149.1 (JTAGâ' ) Boundary-Scan-Compatible 272-Pin Ball Grid Array (BGA) Package (GDP and ZDP Suffixes) CMOS , revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP , Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP 31 Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to â'recommendedâ') â' [Revision A] Updated/changed Description for RSV Signal Name, B11 GDP (to â'recommendedâ') â Texas Instruments
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TMS320C6711D SPRS292A 250-MH 32K-B 512K-B

256k x8 SRAM

Abstract: TMS320C6711 -1149.1 (JTAG) Boundary-Scan-Compatible 272-Pin Ball Grid Array (BGA) Package (GDP and ZDP Suffixes) CMOS , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages , section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP 31 Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to "recommended") - [Revision A] Updated/changed Description for RSV Signal
Texas Instruments
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256k x8 SRAM TMS320C6711 TMS320C6711B TMS320C6711C

RJP 30 h1

Abstract: 6713 SPRU266 /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet
Texas Instruments
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RJP 30 h1

ea8 diode

Abstract: 6713 SPRU266 /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet
Texas Instruments
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ea8 diode

00A7

Abstract: 6713 SPRU266 /C6713B - Eight 32-Bit Instructions/Cycle - 32/64-Bit Data Word - 300-, 225-, 200-MHz (GDP), and 225-, 200 , (Low-Profile) Quad Flatpack (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process - CMOS Technology 3.3-V I/Os, 1.2-V Internal (GDP & PYP) 3.3-V I/Os, 1.4-V Internal (GDP) [300 MHz] D D D D , . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 PYP PowerPAD QFP , Features section: Added 225 for PYP to "300-, 200-MHz (GDP), and 200-, 167-MHz (PYP) Clock Rates" bullet
Texas Instruments
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00A7
Abstract: ) Package (GDP and ZDP Suffixes) CMOS Technology - 0.13-µm/6-Level Copper Metal Process 3.3-V I/O, 1.4 , . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages (bottom view) . . . . . . . . . . , [4:3] Terminal Functions, Reserved for Test section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to "recommended") - [Revision A] Updated/changed Texas Instruments
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Abstract: ) Package (GDP and ZDP Suffixes) CMOS Technology - 0.13-µm/6-Level Copper Metal Process 3.3-V I/O, 1.4 , . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages (bottom view) . . . . . . . . . . , [4:3] Terminal Functions, Reserved for Test section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to "recommended") - [Revision A] Updated/changed Texas Instruments
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Abstract: -MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates â' 3.3-, 4.4-, 5-, 6-Instruction Cycle , ' ) Boundary-Scan-Compatible 208-Pin PowerPADâ"¢ PQFP (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process â' CMOS Technology 3.3-V I/Os, 1.2â'¡-V Internal (GDP/ZDP/ PYP) 3.3-V I/Os, 1.4-V Internal (GDP/ZDP) [300 MHz] Please be aware that an important notice concerning availability, standard , . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 Texas Instruments
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SPRS294B
Abstract: -, 200-MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates â' 3.3-, 4.4-, 5-, 6 , ' ) Boundary-Scan-Compatible 208-Pin PowerPAD PQFP (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process â' CMOS Technology 3.3-V I/Os, 1.2â'¡-V Internal (GDP/ZDP/ PYP) 3.3-V I/Os, 1.4-V Internal (GDP/ZDP) [300 MHz] Please be aware that an important notice concerning availability, standard , . . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . Texas Instruments
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SPRS294A
Abstract: ) Package (GDP and ZDP Suffixes) CMOS Technology - 0.13-µm/6-Level Copper Metal Process 3.3-V I/O, 1.4 , . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages (bottom view) . . . . . . . . . . , [4:3] Terminal Functions, Reserved for Test section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP Terminal Functions, Reserved for Test section: Updated/changed Description for RSV Signal Name, A12 GDP (to "recommended") - [Revision A] Updated/changed Texas Instruments
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Abstract: -MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates â' 3.3-, 4.4-, 5-, 6-Instruction Cycle , ' ) Boundary-Scan-Compatible 208-Pin PowerPAD PQFP (PYP) 272-BGA Packages (GDP and ZDP) 0.13-µm/6-Level Copper Metal Process â' CMOS Technology 3.3-V I/Os, 1.2â'¡-V Internal (GDP/ZDP/ PYP) 3.3-V I/Os, 1.4-V Internal (GDP/ZDP) [300 MHz] Please be aware that an important notice concerning availability, standard , . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP 272-Ball BGA package (bottom view) . . . . . 5 Texas Instruments
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Abstract: ) Package (GDP and ZDP Suffix) [C6712C Only] CMOS Technology - 0.13-µm/6-Level Copper Metal Process (C6712C , . . . . . . . . 3 GFN BGA package (bottom view) [C6712 only] . . . . . . . . . . 4 GDP and ZDP BGA , P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 GDP and ZDP BGA package (bottom view) [C6712C only] GDP and ZDP 272-PIN BALL GRID ARRAY (BGA) PACKAGE ( BOTTOM VIEW ) Y W , , /3, ., /32 272-Pin BGA (GDP and ZDP) 0.13 µm PD CPU ID+ CPU Rev ID Frequency Cycle Time Voltage Texas Instruments
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TMS320C6712 TMS320C6712C SPRS148K 150-MH 12/12C
Abstract: ) Boundary-Scan-Compatible 272-Pin Ball Grid Array (BGA) Package (GDP and ZDP Suffixes) CMOS Technology - 0.13-µm/6 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 GDP and ZDP BGA packages , Test section: Updated Description for RSV Signal Name, A12 GDP/ZDP Updated Description for RSV Signal Name, B11 GDP/ZDP Device Support, device and development-support tool nomenclature: Updated figure for , TMS320C6711D FLOATINGPOINT DIGITAL SIGNAL PROCESSOR SPRS292 - SEPTEMBER 2005 GDP and ZDP BGA packages Texas Instruments
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256M-B
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