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L6234 THREE PHASE MOTOR DRIVER SUPPLY VOLTAGE FROM PEAK


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SGS-THOMSON
L6234
THREE PHASE MOTOR DRIVER
SUPPLY VOLTAGE FROM
PEAK CURRENT
CURRENT
1.5A(SO(16+2+2))
(PowerS020)
0.30 VALUE
CROSS CONDUCTION PROTECTION
COMPATIBLE DRIVER
OPERATING FREQUENCY 50KHz
THERMAL SHUTDOWN
INTRINSIC FAST FREE WHEELING DIODES
INPUT ENABLE FUNCTION
EVERY HALF BRIDGE
EXTERNAL REFERENCE AVAILABLE
UNDERVOLTAGE LOCKOUT
DESCRIPTION
L6234 triple half bridge drive brushless motor.
realized Multipower technology wich combines isolated DMOS power transistors with CMOS Bipolar circuits same chip. using mixed technology been possible optimize logic circuitry power stage achieve best possible performances. output DMOS transistors sustain very
CONNECTION (Top view)
(16+2+2)
PowerS020
(Jedec MO-166)
ORDERING NUMERS: L6234D (16+2+2)) L6234 (PowerS020)
high current fact that DMOS structure affected second breakdown effect, maximum maximum current practically limited dissipation capabilies package. logic inputs TTL, CMOS compatible. Each channel controlled separate logic input.
L6234 available package (16+2+2; L6234D) PowerS020.
OUT1 OUT3
GUT2
SENSE SENSE
Vboot
SENSE
OUT2 Vref
OUT1 OUT3
SENSE
UBOOT
UREF
B334 (16+2+2)
PowerS020
October 1995
This advanced information product developm undergoing evaluafon. Details subject change without notice.
7T2S237 00b7701
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L6234
BLOCK DIAGRAM
0.22jlF
SGS-THOMSON_
7^2^237 00fc>77D2
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L6234
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
Power Supply Voltage
Vin.Ven Input Enable Voltage
'peak Pulsed Output Current (note) L6234D
VsENSE Sensing Voltage
Bootstrap Peak Voltage
Differential Output Voltage (between pins)
Ptot Total Power Dissipation L6234D Tpins
Ptot Total Power Dissipation L6234D Tamb
Tstg, Storage Junction Temperature Range
Note Pulse width limited only junction temperature transient thermal impedance Mounted board with minimized copper area
THERMAL DATA
Symbol Description PowerS020 Unit
j-piris Thermal Resistance Junction-pins
Rthj-amb Thermal Resistance Junction-ambient (**)13
Mounted board with minimized copper area (**) Mounted aluminium substrate
FUNCTIONS
DIP/SO PowerSO-20 Name Function
Output channels 11213.
Logic input channels 1/2/3. logic HIGH level (when corresponding HIGH) switches upper DMOS Power Transistor, while logic switches corresponding side DMOS Power.
Enable channels 1/2/3. logic level this switches both power DMOS related channel.
9,12 Power Supply Voltage.
14,17 2,19 SENSE resistance Rsense connected this provides feedback motor current control (the pins must connected together).
Vref Internal Voltage Reference. capacitor connected from this increases stability Power DMOS drive circuit.
Bootstrap Oscillator. Oscillator output external charge pump.
Vboot Overvoltage input drive upper DMOS
15,16 1,10 11,20 Common Ground Terminal. Powerdip packages these pins used dissipate heat forward PCB.
SGS-THOMSON_
7121237 4flE
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L6234
ELECTRICAL CHARACTERISTICS unless otherwise specified)
Symbol Parameter Test Condition Min. Typ. Max. Unit
Supply Voltage
Vref Reference Voltage
Quiescent Supply Current
Commutation Frequency
Thermal Shutdown
Dead Time Protection
Under Voltage
Under Voltage
OUTPUT DMOSTRANSISTOR
Symbol Parameter Test Condition Min. Typ- Max. Unit
Leakage Current
(on) Resistance
Sensing Voltage
SOURCE DRAIN DIODE
Symbol Parameter Test Condition Min. Typ. Max. Unit
Forward Voltage 1-2A;
Reverse Recovery Time
Forward Recovery Time
LOGIC LEVELS
Symbol Parameter Test Condition Min. Typ. Max. Unit
V|nl, Venl Input Voltage -0.3
V|nh, Venh Input HIGH Voltage
llnl, Ienl Input Current Vin.Ven
llnh, Ieimh Input HIGH Current VIN.Ven
CIRCUIT DESCRIPTION
L6234 triple half bridge designed drive brushless motors.
Each half bridge power DMOS transistors with RdsON 0.3a half bridges controlled independently means inputs IN1, IN2, inputs EN1, EN2,
EN3. external connection common side DMOS sources provided connect sensing resistor constant current chopping application.
driving stage logic stage designed work from 52V.
SGS-THOMSON_
HiaRSSLEORtaOOOCS
712^37 00b7704
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L6234
Figure PowerSO-20 Transient Thermal Resistance
Tranaient Thermal Impedance (C/W)
Mounted Aluminum wbetrate- 1-Oe Copper-Ml ThlcknaM: Board alza:
um_I .I_I linn.
0.01 1000 Tim* PuIm Width
Figure PowerSO-20 Thermal Resistance (Mounted Aluminum substrate)
Thermal Bealstanca (C/W)
Teat P638 mila
Alumlrtum Copiar -TMckheafc'lAiftm-.Board alza aqj.
23480789101112 Dlaalpatod Power (Writ)
Figure PowerSO-20 Thermal Resistance
(Mounted monolayer substrate)
Rth(|-a) C/W)
Teat bhifk PS3ff mila
DlaalpAtlng area:'8000
Mounted mqrtotayar Copiar foil
Tnlckneaa: atea
Dlaalpatad Power (Watt)
Figure PowerSO-20: with external heatsink
(c/w
1000 TIME PULSE WIDTH (millimd
10000
Figure Thermal Impedance PowerS020 standard S020
SGS-THOMSON_
7=12=1237 00b77DS
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L6234
PowerSO-20 PACKAGE MECHANICAL DATA
DIM. inch
MIN. TYP. MAX. MIN. TYP. MAX.
3.60 0.1417
0.10 0.30 0.0039 0.0118
3.30 0.1299
0.10 0.0039
0.40 0.53 0.0157 0.0209
0.23 0.32 0.009 0.0126
D(1) 15.80 16.00 0.6220 0-6299
13.90 14.50 0.5472 0.570
1.27 0.050
11.43 0.450
10.90 11.10 0.4291 0.437
2.90 0.1141
0.10 0.0039
1.10 0.0433
0.80 1.10 0.0314 0.0433
(max.)
(max.)
10.0 0.3937
include mold flash protrusions Mold flash protrusions shall exceed 0.15mm (0.006")
_/TT SCS-THOMSON_
7^2^237 0GL.77Gb
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L6234
S020 PACKAGE MECHANICAL DATA
DIM. inch
MIN. TYP. MAX. MIN. TYP. MAX.
2.65 0.104
0.004 0.012
2.45 0.096
0.35 0.49 0.014 0.019
0.23 0.32 0.009 0.013
0.020
(typ.)
12.6 13.0 0.496 0.512
10.65 0.394 0.419
1.27 0.050
11.43 0.450
0.291 0.299
1.27 0.020 0.050
0.75 0.030
(max.)
nnnnnnnnn
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SGS-1HOMSON_
7^2^237 00b7?D7
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