L6234 THREE PHASE MOTOR DRIVER POWER (16+2+2) PowerS020
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-IHOMSON
L6234
THREE PHASE MOTOR DRIVER
POWER (16+2+2)
PowerS020
ORDERING NUMBERS: L6234 (POWER 16+2+2) L6234PD (PowerS020)
SUPPLY VOLTAGE FROM PEAK CURRENT
VALUE
CROSS CONDUCTION PROTECTION
COMPATIBLE DRIVER
OPERATING FREQUENCY 50KHz
THERMALSHUTDOWN
INTRINSIC FAST FREE WHEELING DIODES
INPUT ENABLE FUNCTION EVERY HALF BRIDGE
EXTERNAL REFERENCE AVAILABLE
DESCRIPTION
L6234 triple half bridge drive brushless motor.
realized Multipower technology which combines isolated DMOS power transistors with CMOS Bipolar circuits same chip. using mixed technology been possible optimize logic circuitry power stage achieve best possible performance. output DMOS transistors sustain very high current fact that DMOS structure affected second breakdown
fect, maximum current practically limited dissipation capability package. logic inputs TTL, CMOS |j,P compatible. Each channel controlled separate logic input.
L6234 available POWER package (16+2+2) PowerS020.
CONNECTION (Top view)
DUT1 0UT2
SENSE SENSE
Vboot
SENSE
OUT2 Vref
OUT1 OUT3
SENSE
UBOOT
DUT3 UREF
-D94IN129
POWER (16+2+2) PowerS020
November 1997
This Material Copyrighted Respective Manufacturer
L6234
BLOCK DIAGRAM
10nF
VREF
CHARGE PUMP
THERMAL PROTECTION
OUT1
0.22^F
100jiF
OUT2
SENSE1
OUT3
SCS-THOMSON
This Material Copyrighted Respective Manufacturer
L6234
THERMAL DATA
Symbol Parameter DIP16+2+2 PowerS020 Unit
j-pin Thermal Resistance, Junction
j-amb1 Thermal Resistance, Junction Ambient (see Thermal Characteristics)
j-amb2 Thermal Resistance, Junction Ambient (see Thermal Characteristics)
j-case Thermal Residance Junction-case
THERMAL CHARACTERISTICS
j-pins
DIP16+2+2. thermal resistance referred thermal path from dissipating region surface silicon chip, points along four central pins package, distance away from stand-offs.
j-amb1
dissipating surface, thick least jim, with surface similar bigger than shown, created making printed circuit.
Such heatsinking surface considered bottom side horizontal (worst case).
j-amb2
power dissipating pins (the four central
ones), well others, have minimum thermal connection with external world (very thin strips only) that dissipation takes place through still through itself.
same situation point above, without heatsinking surface created purpose board.
Additional data PowerDip PowerS020 package found
Application Note AN467: Thermal Characteristics PowerDip 20,24 Packages Soldered 1,2,3 Copper
Application Note AN668:
High Power Surface Mount Package: PowerS020 Power Packaging from Insertion Surface Mounting.
Figure Printed Heatsink
This Material Copyrighted Respective Manufacturer
L6234
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
Power Supply Voltage
VIN.Ven Input Enable Voltage
peak Pulsed Output Current (note)
VsENSE Sensing Voltage Voltage)
Bootstrap Peak Voltage
Differential Output Voltage (between pins)
Vref Reference Voltage
Ptot Total Power Dissipation L6234PD Tamb
Ptot Total Power Dissipation L6234 Tamb
Tstg, Storage Junction Temperature Range
Note Pulse width limited only junction temperature transient thermal impedance Mounted board with minimized copper area
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
Supply Voltage
Peak Peak Differential Voltage (between pins)
lout Output Current Power S020 (Tamb
Output Current Power (Tamb with infinite heatsink
VsENSE Sensing Voltage (pulsed 300nsec)
Sensing Voltage (DC)
Junction Temperature Range
FUNCTIONS
DIP/SO PowerSO-20 Name Function
Output channels 1/2/3.
Logic input channels 1/2/3. logic HIGH level (when corresponding HIGH) switches upper DMOS Power Transistor, while logic switches corresponding side DMOS Power.
Enable channels 1/2/3. logic level this switches both power DMOS related channel.
Power Supply Voltage.
14,17 2,19 SENSE resistance Rsense connected this provides feedback motor current control (the pins must connected together).
Vref Internal Voltage Reference. capacitor connected from this increases stability Power DMOS drive circuit.
Bootstrap Oscillator. Oscillator output external charge pump.
Vboot Overvoltage input drive upper DMOS
15,16 1,10 11,20 Common Ground Terminal. Powerdipand packages these pins used dissipate heat forward PCB.
SGS-THOMSON
This Material Copyrighted Respective Manufacturer
L6234
ELECTRICAL CHARACTERISTICS unless otherwise specified)
Symbol Parameter Test Condition Min. Typ. Max. Unit
Supply Voltage
Vref Reference Voltage
Quiescent Supply Current
Commutation Frequency
Thermal Shutdown
Dead Time Protection
OUTPUT DMOS TRANSISTOR
Symbol Parameter Test Condition Min. Typ. Max. Unit
Idss Leakage Current
(ON) Resistance
SOURCE DRAIN DIODE
Symbol Parameter Test Condition Min. Typ. Max. Unit
Forward Voltage
Reverse Recovery Time
Forward Recovery Time
LOGIC LEVELS
Symbol Parameter Test Condition Min. Typ. Max. Unit
VlNL, VENL Input Voltage -0.3
V|NH, VeNH Input HIGH Voltage
l|NL, IENL Input Current Vin,Ven=
IINH, IENH Input HIGH Current VIN.Ven
CIRCUIT DESCRIPTION
L6234 triple half bridge designed drive brushlessDC motors.
Each half bridge power DMOS transistors with RdsON 0.3Q. half bridges controlled independently means inputs IN1, IN2, inputs EN1, EN2,
EN3. external connection common side DMOS sources provided connect sensing resistor constant current chopping application.
driving stage logic stage designed work from 52V.
SGS-THOMSON
HJiOBSfflOGS
This Material Copyrighted Respective Manufacturer
L6234
Figure PowerSO-20 Transient Thermal Resistance
Transient Thermal Impedance (C/W)
Mounted Aluminum substrate Copper-foil Thickness: Board size:
0.001
0.01
Time Pulse Width
1000
Figure PowerSO-20 Thermal Resistance (Mounted Aluminium substrate)
Thermal Resistance (C/W)
test phip: ^638 jnils Dissipating area:.6000 mils
nted Aluminum substrate Copper foil
Thickness:-1.5 -.Board size
Dissipated Power (Watt)
Figure PowerSC)-20 Thermal Resistance
(Mounted monolayer substrate)
Rth(l-a) C/W)
Test chip: P638 mils Dissipating area: 6000 mils
Mounted monolayer substrate Copper foil
Thickness:
Board size
Dissipated Power (Watt)
Figure PowerSO-20: with external heatsink
(C/W)
1000 TIME PULSE WIDTH (millisec.)
10000
Figure Thermal Impedance PowerSO-2C) standard S020
Thermal impedance
SINGLE PULSE
size SOZO 12+4*4
dissipating area
Watts
PSO-20
0.01
Time
SGS-THOMSON
This Material Copyrighted Respective Manufacturer
L6234
PowerSO-20 PACKAGE MECHANICAL DATA
DIM. inch
MIN. TYP. MAX. MIN. TYP. MAX.
3.60 0.1417
0.10 0.30 0.0039 0.0118
3.30 0.1299
0.10 0.0039
0.40 0.53 0.0157 0.0209
0.23 0.32 0.009 0.0126
15.80 16.00 0.6220 0.6299
13.90 14.50 0.5472 0.570
1.27 0.050
11.43 0.450
10.90 11.10 0.4291 0.437
2.90 0.1141
0.10 0.0039
1.10 0.0433
0.80 1.10 0.0314 0.0433
(max.)
(max.)
10.0 0.3937
(1)"Dand include mold flash protrusions Mold flash protrusions shall exceed 0.15mm (0.006")
SGS-THOMSON
This Material Copyrighted Respective Manufacturer
L6234
POWERDIP PACKAGE MECHANICAL DATA
DIM. inch
MIN. TYP. MAX. MIN. TYP. MAX.
0.51 0.020
0.85 1.40 0.033 0.055
0.50 0.020
0.38 0.50 0.015 0.020
24.80 0.976
8.80 0.346
2.54 0.100
22.86 0.900
7.10 0.280
5.10 0.201
3.30 0.130
1.27 0.050
SGS-THOMSON
This Material Copyrighted Respective Manufacturer
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