L6234 THREE PHASE MOTOR DRIVER SUPPLY VOLTAGE FROM PEAK
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SGS-THOMSON
L6234
THREE PHASE MOTOR DRIVER
SUPPLY VOLTAGE FROM
PEAK CURRENT
VALUE
CROSS CONDUCTION PROTECTION
COMPATIBLE DRIVER
OPERATING FREQUENCY 50KHz
THERMAL SHUTDOWN
INTRINSIC FAST FREE WHEELING DIODES
INPUT ENABLE FUNCTION
EVERY HALF BRIDGE
EXTERNAL REFERENCE AVAILABLE
UNDERVOLTAGE LOCKOUT
DESCRIPTION
L6234 triple half bridge drive brushless motor.
realized Multipower technology wich combines isolated DMOS power transistors with CMOS Bipolar circuits same chip. using mixed technology been possible optimize logic circuitry power stage achieve best possible performances. output DMOS transistors sustain very high current fact that DMOS structure affected second breakdown
ADVANCE DATA
POWER (16+2+2)
PowerS020
(Jedec MO-166)
ORDERING NUMERS: L6234 (POWER 16+2+2) L6234PD (PowerS020)
feet, maximum maximum current practically limited dissipation capabilies package. logic inputs TTL, CMOS compatible. Each channel controlled separate logic input.
L6234 available POWER package (16+2+2) PowerS020.
CONNECTION (Top view)
0UT1 0UT2
SENSE SENSE
VBOOT
SENSE
OUT2 Vref
OUT1 OUT3
SENSE
UREF
H31LBJT3J D94IN129
POWER (16+2+2) PowerS020
January 1996
This advanced information product development undergoing evaluation. Details subject change without notice.
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L6234
BLOCK DIAGRAM
0.22^F
_X=T SCS-IHOMSON_
7R2R23?
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L6234
THERMAL DATA
Symbol Parameter DIP16+2+2 PowerS020 Unit
j-pin Thermal Resistance, Junction
j-amb1 Thermal Resistance, Junction Ambient (see Thermal Characteristics)
j-amb2 Thermal Resistance, Junction Ambient (see Thermal Characteristics)
j-case Thermal Residance Junction-case
THERMAL CHARACTERISTICS
j-pins
DIP16+2+2. thermal resistance referred thermal path from dissipating region surface silicon chip, points along four central pins package, distance away from stand-offs.
j-amt>1
dissipating surface, thick least ^im, with surface similar bigger than shown, created making printed circuit.
Such heatsinking surface considered bottom side horizontal (worst case).
Rthj-amb2
power dissipating pins (the four central
ones), well others, have minimum thermal connection with external world (very thin strips only) that dissipation takes place through still through itself.
same situation point above, without heatsinking surface created purpose board.
Additional data PowerDip PowerS020 package found Application Note AN467: Thermal Characteristics PowerDip 20,24 Packages Soldered 1,2,3 Copper
Application Note AN668:
High Power Surface Mount Package: PowerS020 Power Packaging from Insertion Surface Mounting.
Figure Printed Heatslnk
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MCMMUCnUMCS
7*^237 0070301
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L6234
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
Power Supply Voltage
Vin,Ven Input Enable Voltage
(peak Pulsed Output Current (note)
VsENSE Sensing Voltage
Bootstrap Peak Voltage
Differential Output Voltage (between pins)
Ptot Total Power Dissipation L6234D Tpins
Ptot Total Power Dissipation L6234D Tamb
Tstg, Storage Junction Temperature Range
Note Pulse width limited only junction temperature transient thermal impedance Mounted board with minimized copper area
FUNCTIONS
DIP/SO PowerSO-20 Name Function
Output channels 1/2/3.
Logic input channels 1/2/3. logic HIGH level (when corresponding HIGH) switches upper DMOS Power Transistor, while logic switches corresponding side DMOS Power.
Enable channels 1/2/3. logic level this switches both power DMOS related channel.
Power Supply Voltage.
14,17 2,19 SENSE resistance Rsense connected this provides feedback motor current control (the pins must connected together).
Vref Internal Voltage Reference. capacitor connected from this increases stability Power DMOS drive circuit.
Bootstrap Oscillator. Oscillator output external charge pump.
Vboot Overvoltage input drive upper DMOS
15,16 1,10 11,20 Common Ground Terminal. Powerdip packages these pins used dissipate heat forward PCB.
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7^2^237 0076362
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L6234
ELECTRICAL CHARACTERISTICS unless otherwise specified)
Symbol Parameter Test Condition Min. Typ. Max. Unit
Supply Voltage
Vref Reference Voltage
Quiescent Supply Current
Commutation Frequency
Thermal Shutdown
Dead Time Protection
Under Voltage Upper Threshold
Under Voltage Lower Threshold
OUTPUT DMOS TRANSISTOR
Symbol Parameter Test Condition Min. Typ. Max. Unit
Idss Leakage Current
(on) Resistance
Vsense Sensing Voltage
SOURCE DRAIN DIODE
Symbol Parameter Test Condition Min. Typ. Max. Unit
Forward Voltage 1.2A;
Reverse Recovery Time 1.2A
Forward Recovery Time
LOGIC LEVELS
Symbol Parameter Test Condition Min. Typ. Max. Unit
vlnl, venl Input Voltage -0.3
v|nhi venh Input HIGH Voltage
llnl, Ienl Input Current Vin,VEN=L
llnh, Ienh Input HIGH Current VIN.Ven
CIRCUIT DESCRIPTION
L6234 triple half bridge designed drive brushless motors.
Each half bridge power DMOS transistors with RdsON 0.3ft. half bridges controlled independently means inputs IN1, IN2, inputs EN1, EN2,
EN3. external connection common side DMOS sources provided connect sensing resistor constant current chopping application.
driving stage logic stage designed work from 52V.
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L6234
Figure PowerSO-20 Transient Thermal Resistance
Tharmal hnpaOanca (C/W)
Mowntad Aluminum aubatrata- 1-Oe Coppar-loll Thloknaaa: Board
0.001
inn_I linn.
0.01
Tim* PuIm Width
1000
Figure PowerSO-20 Thermal Resistance
(Mounted monolayer substrate)
Rth(J-a> (C/W)
Mounted mqnolayor aijbatrata Copiar
ThnkiMM:' Botard
Dlaaipatad Power (Watt)
Figure PowerSO-20 Thermal Resistance (Mounted Aluminium substrate)
Thaemal Raalatinoa (C/W)
Tfcat fihlp: P638 tola
MottnM Aluminum aUbatrtrta Copfter -Thlckhaaa:' rfon -Il'1'' Board
123486789101112 Diati patad Powar (Watt)
Figure PowerSO-20: with external heatsink
(C/W
1000 TIME PULSE WIDTH (mllllwc.)
10000
Figure Thermal Impedance PowerSO-20 standard S020
Thermal C/W)
0.01
SINQLE PULSE
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SCS-THOMSON
7S21237 0070304
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L6234
PowerSO-20 PACKAGE MECHANICAL DATA
DIM. inch
MIN. TYP. MAX. MIN. TYP. MAX.
3.60 0.1417
0.10 0.30 0.0039 0.0118
3.30 0.1299
0.10 0.0039
0.40 0.53 0.0157 0.0209
0.23 0.32 0.009 0.0126
D(1) 15.80 16.00 0.6220 0.6299
13.90 14.50 0.5472 0.570
1.27 0.050
11.43 0.450
10.90 11.10 0.4291 0.437
2.90 0.1141
0.10 0.0039
1.10 0.0433
0.80 1.10 0.0314 0.0433
(max.)
(max.)
10.0 0.3937
include mold flash protrusions Mold flash protrusions shall exceed 0.15mm (0.006")
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mcrquctromc*
7^2^237 0070305 7flT
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L6234
POWER PACKAGE MECHANICAL DATA
DIM. inch
MIN. TYP. MAX. MIN. TYP. MAX.
0.51 0.020
0.85 1.40 0.033 0.055
0.50 0.020
0.38 0.50 0.015 0.020
24.80 0.976
8.80 0.346
2.54 0.100
22.86 0.900
7.10 0.280
5.10 0.201
3.30 0.130
1.27 0.050
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