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Package SOT23L-8 Embossed Carrier Tape Material Polystyrene Carbon Static Protection Conductive (Unit ...
Package SOT23L-8 Embossed Carrier Tape Material Carbon

Package SOT89-5 Embossed Carrier Tape Material Polystyrene Carbon Static Protection Conductive 2.4max ...
Package SOT89-5 Embossed Carrier Tape Material Carbon

Package Specifications 4-Pin Half-Pitch Mini-Flat Package (White) 4-Pin Full-Pitch Mini-Flat Package (White) ...
Package Specifications 4-Pin Half-Pitch Mini-Flat

Package SSOP-10 -0.05 Unit -0.05 Package Dimensions 1.7max ...
Package SSOP-10 -0.05 Unit Dimensions 1.7max

Package SSOP-10 Embossed Carrier Tape Material Polystyrene Carbon Static Protection Conductive 2.4max ...
Package SSOP-10 Embossed Carrier Tape Material Carbon

PACKAGE STANDARD LAMPs Description MVL-511HR lamp made with GaAsP / on light emitingdiode Phoshide ...
PACKAGE STANDARD LAMPs Description MVL-511HR lamp made

Package Style / Part Number Reference Packaging Part Number Suffix -000 -001 -003 -004 ...
Package Style Part Number Reference Packaging Suffix

Package Style: Surface Mount Gull Wing Available TO-8B ...
Package Style: Surface Mount Gull Wing Available

Package Styles CHIP ONLY DO-7 GLASS AXIAL LEAD SOD-323 PLASTIC SURFACE MOUNT ...
Package Styles CHIP ONLY DO-7 GLASS AXIAL LEAD SOD-323

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCH A3212 integrated circuit ultra-sensitive ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCH A3212 integrated circuit ultra-sensitive ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCH A3212 integrated circuit ultra-sensitive ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCH A3212 integrated circuit ultra-sensitive ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCHES A3209Ex A3210Ex integrated circuits ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCHES A3209Ex A3210Ex integrated circuits ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCHES A3209Ex A3210Ex integrated circuits ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCHES A3209Ex A3210Ex integrated circuits ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning (SOT23W) MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCHES A3209Ex A3210Ex integrated circuits ...
Package Suffix Pinning SOT23W MICROPOWER

Package Suffix Pinning MICROPOWER ULTRA-SENSITIVE HALL-EFFECT SWITCHES A3209Ex A3210Ex integrated circuits ultra-sensitive ...
Package Suffix Pinning MICROPOWER ULTRA-SENSITIVE

Package Systems There package classified insertion type surface mount type TCP. OUTLINE ...
Package Systems There package classified insertion type

PACKAGE SYSTEMS There package classified insertion type surface mount type TCP. Ver.2009-05-26 ...
PACKAGE SYSTEMS There package classified insertion type

PACKAGE TAPE DIMENSIONS PART ORIENTATION TERMINAL REMAINING PORT NAME OUTPUT SUPPLY VOLTAGE ...
PACKAGE TAPE DIMENSIONS PART ORIENTATION TERMINAL PORT

PACKAGE There three types packaging chip monolithic ceramic capacitors. Please specify packaging ...
PACKAGE There three types packaging chip monolithic

PACKAGE THERMAL CHARACTERISTICS PACKAGE INFORMATION PACKAGE THERMAL CHARACTERISTICS Qty-Type Terminals 14-Pin 16-Pin ...
PACKAGE THERMAL CHARACTERISTICS INFORMATION Qty-Type

Package Thermal Characterization August Package Thermal Characterization Introduction Effective heat removal from ...
Package Thermal Characterization August Introduction

Package Thermal Characterization Methodologies Application Report Printed U.S.A SZZA003 Package Thermal Characterization ...
Package Thermal Characterization Methodologies Report

Package Thermal Considerations Darla Wellheuser Advanced System Logic Semiconductor Group SCZA002B IMPORTANT ...
Package Thermal Considerations Darla Wellheuser System

Package Thermal Considerations SCZA002C June Revised August IMPORTANT NOTICE Texas Instruments (TI) ...
Package Thermal Considerations SCZA002C June Revised

Package Thermal Information P-DSO-14-4 Footprint / Dimensions max. -0.2 max. Package P-DSO-14-4 -0.1 -0.2 ...
Package Thermal Information P-DSO-14-4 Footprint max.

Package Thermal Information P-DSO-16-1 Footprint / Dimensions max. -0.1 -0.2 Reflow soldering -0.21) Dimensions ...
Package Thermal Information P-DSO-16-1 Footprint max.

Package Thermal Information P-DSO-20-1 Footprint / Dimensions max. -0.1 -0.2 -0.21) Reflow soldering -0.2 ...
Package Thermal Information P-DSO-20-1 Footprint max.

Package Thermal Information P-DSO-20-10 max. Footprint / Dimensions -0.3 Package P-DSO-20-10 -0.027 (Heatsink) Heatsink ...
Package Thermal Information P-DSO-20-10 max. Footprint

Package Thermal Information P-DSO-20-6 Footprint / Dimensions max. -0.1 -0.2 -0.21) 8°max. Package P-DSO-20-6 ...
Package Thermal Information P-DSO-20-6 Footprint max.

Package Thermal Information P-DSO-24-3 Footprint / Dimensions max. -0.1 -0.2 -0.21) 8°max. Package P-DSO-24-3 ...
Package Thermal Information P-DSO-24-3 Footprint max.

Package Thermal Information P-DSO-28-6 Footprint / Dimensions max. -0.1 -0.2 -0.21) 8°max. Package P-DSO-28-6 ...
Package Thermal Information P-DSO-28-6 Footprint max.

Package Thermal Information P-DSO-36-10 max. Footprint / Dimensions Package P-DSO-36-10 -0.027 (Heatsink) Heatsink Reflow ...
Package Thermal Information P-DSO-36-10 max. Footprint

Package Thermal Information P-DSO-8-1 Footprint / Dimensions max. -0.1 -0.2 -0.21) Reflow soldering -0.21) ...
Package Thermal Information P-DSO-8-1 Footprint max.

Package Thermal Information P-TO252-3-1 Footprint / Dimensions -0.10 -0.10 -0.04 -0.2 Reflow soldering side ...
Package Thermal Information P-TO252-3-1 Footprint -0.10

Package Thermal Information P-TO263-5-1 Footprint / Dimensions 5x0.8 4x1.7 Reflow soldering 8°max. Dimensions PC-Board ...
Package Thermal Information P-TO263-5-1 Footprint 5x0.8

Package Thermal Information SCT595-5-1 Footprint / Dimensions -0.05 10°max acc. -0.05 Dimensions 10°max Reflow ...
Package Thermal Information SCT595-5-1 Footprint -0.05

Package Thermal Information SOT223-4-2 Footprint / Dimensions acc. 15°max Reflow soldering Dimensions PC-Board SOT223 ...
Package Thermal Information SOT223-4-2 Footprint acc.

Package TO-220AB Thermotab (Isolated Mounting Tab) Package TO-220AB (Non-Isolated) Product Description sensitive ...
Package TO-220AB Thermotab Isolated Mounting

Package TO252-5 BOTTOM VIEW Unit Package Dimensions ...
Package TO252-5 BOTTOM VIEW Unit Dimensions

Package TO252-5 Embossed Carrier Tape Material Polycarbonate Carbon Static Protection Conductive (Unit ...
Package TO252-5 Embossed Carrier Tape Material Carbon

Package TO92-2 R2.3 2.5max -0.5 Unit Package Dimensions ...
Package TO92-2 R2.3 2.5max -0.5 Unit Dimensions

Package TO92-2 Radial Taping Product Hold down tape Carrier tape Unit Symbol ...
Package TO92-2 Radial Taping Product Hold down tape

Package TO92-3 R2.3 -0.05 -0.05 -0.5 Unit Package Dimensions ...
Package TO92-3 R2.3 -0.05 -0.5 Unit Dimensions

Package TO92-3 Radial Taping Product Hold down tape Carrier tape Unit Symbol ...
Package TO92-3 Radial Taping Product Hold down tape

PACKAGE TRENDS Packaging Trends Needs electronic equipment Optimized System Integration Performance Multiple ...
PACKAGE TRENDS Packaging Trends Needs electronic System

Package TSSOP-14 -0.05 Unit Package Dimensions -0.05 ...
Package TSSOP-14 -0.05 Unit Dimensions

Package TSSOP-14 Embossed Carrier Tape Material Polystyrene Carbon Static Protection Conductive 2.1max ...
Package TSSOP-14 Embossed Carrier Tape Material Carbon

Package TSSOP-16 -0.05 Unit Package Dimensions -0.05 ...
Package TSSOP-16 -0.05 Unit Dimensions

Package TSSOP-16 Embossed Carrier Tape Material Polystyrene Carbon Static Protection Conductive 2.1max ...
Package TSSOP-16 Embossed Carrier Tape Material Carbon

Package TSSOP-20 -0.05 Unit Package Dimensions -0.05 ...
Package TSSOP-20 -0.05 Unit Dimensions

Package TSSOP-24 -0.05 Unit Package Dimensions -0.05 ...
Package TSSOP-24 -0.05 Unit Dimensions

Package TSSOP-24 Embossed Carrier Tape Material Polystyrene Carbon Static Protection Conductive 2.1max ...
Package TSSOP-24 Embossed Carrier Tape Material Carbon

Package Type Line Test Pitch 0.8 / 0.65 / 0.5mm Pitch Stack Cellular ...
Package Type Line Test Pitch 0.65 0.5mm Stack Cellular

Package type means theoretical dimensions. dimensions terminals defined bottom. Notes Package Outline ...
Package type means theoretical dimensions. terminals

PACKAGE TYPICAL FORM SPECIFICATION TABLE OPTION FORM FACING CB228 OPTION FORM FACING ...
PACKAGE TYPICAL FORM SPECIFICATION TABLE OPTION FACING

Package / Module / PC Card Outlines Dimensions CHAPTER PACKAGE / MODULE / PC CARD OUTLINES DIMENSIONS Intel Product Identification ...
Package Module Card Outlines Dimensions CHAPTER PACKAGE

Package: HSON1414-6 Unit:mm Package Dimension ...
Package: HSON1414-6 Unit:mm Dimension

Package: HSOP-8 Unit Package Dimension ...
Package: HSOP-8 Unit Dimension

Package: Unit Package Dimension ...
Package: Unit Dimension

package:DO-35 Zener Voltage Range Dynamic resistance Reverse Leakage Current TYPE Temp.Coeffcient Zener ...
package:DO-35 Zener Voltage Range Dynamic Reverse

Packaged Diodes RoHS Compliant Features High Power Fast Speed Voltage Ratings Volts ...
Packaged Diodes RoHS Compliant Features High Power Fast

PACKAGED HIGH DYNAMIC RANGE PHEMT FEATURES Output Power 1-dB Compression Power Gain ...
PACKAGED HIGH DYNAMIC RANGE PHEMT FEATURES Output Power

PACKAGED HIGH DYNAMIC RANGE PHEMT FEATURES Output Power 1-dB Compression Power Gain ...
PACKAGED HIGH DYNAMIC RANGE PHEMT FEATURES Output Power

Packaged High Efficiency Divide-by-8 Prescaler Technical Data HMMC-3128 Features Wide Frequency Range: ...
Packaged High Efficiency Divide-by-8 Prescaler Data

Packaged LEDS / PCB Mount Indicators acka Indicator tors FEATURES FEATURES Current Requirements High ...
Packaged LEDS Mount Indicators FEATURES Current High

PACKAGED MEDIUM POWER PHEMT FEATURES Output Power 1-dB Compression Power Gain Power-Added ...
PACKAGED MEDIUM POWER PHEMT FEATURES Output Power 1-dB

PACKAGED NOISE PHEMT FEATURES Noise Figure Associated Gain Noise Figure Associated Gain ...
PACKAGED NOISE PHEMT FEATURES Noise Figure Associated

Packaged Phase Shifter Base Stations PS094-315 Features Designed Band Degree Phase Shift ...
Packaged Phase Shifter Base Stations PS094-315 Features

PACKAGED POWER PHEMT FEATURES Linear Output Power Power Gain Maximum Stable Gain ...
PACKAGED POWER PHEMT FEATURES Linear Output Power Gain

PACKAGED POWER PHEMT FEATURES Linear Output Power Power Gain Maximum Stable Gain ...
PACKAGED POWER PHEMT FEATURES Linear Output Power Gain

PACKAGED POWER PHEMT FEATURES Output Power 1-dB Compression Power Gain Output 15GHz ...
PACKAGED POWER PHEMT FEATURES Output Power 1-dB Gain

PACKAGED POWER PHEMT FEATURES Output Power 1-dB Compression Power Gain Power-Added Efficiency ...
PACKAGED POWER PHEMT FEATURES Output Power 1-dB Gain

PACKAGED ULTRA NOISE PHEMT FEATURES Noise Figure Associated Gain Noise Figure Associated ...
PACKAGED ULTRA NOISE PHEMT FEATURES Noise Figure Gain

Packaged Voltage Controlled Oscillators Features Extremely Linear Tuning High Tuning Speed Phase ...
Packaged Voltage Controlled Oscillators Features Linear

Packages 8-Pin Package 14-Pin Package individual data sheets more specific ordering information. ...
Packages 8-Pin 14-Pin individual data sheets more

Packages Available Packing Methods Quantities Atmel provides four different packing methods provide ...
Packages Available Packing Methods Quantities Atmel