MCP3021 Description Microchip Technology Inc. MCP3021 succes
|
|
|
Top Searches for this datasheet
10-bit resolution DNL, max. conversion current typical standby current, max. I2Ccompatible serial interface Standard mode Fast mode devices single 2-wire 22.3 ksps Fast mode Single-ended analog input channel On-chip sample hold On-chip conversion clock Single supply specified operation: 2.7V 5.5V Temperature range: Extended: -40°C +125°C Small SOT-23 package
MCP3021
Description
Microchip Technology Inc. MCP3021 successive approximation converter (ADC) with 10-bit resolution. Available SOT-23 package, this device provides single-ended input with very power consumption. Based advanced CMOS technology, MCP3021 provides maximum conversion current standby current respectively. current consumption, combined with small SOT-23 package, make this device ideal battery-powered remote data acquisition applications. Communication MCP3021 performed using 2-wire compatible interface. Standard (100 kHz) Fast (400 kHz) modes available with device. on-chip conversion clock enables independent timing conversion clocks. device also addressable, allowing eight devices single 2-wire bus. MCP3021 runs single supply voltage that operates over broad range 2.7V 5.5V. This device also provides excellent linearity differential non-linearity (DNL) integral nonlinearity (INL), maximum.
Power 10-Bit Converter With I2CInterface
Applications
Data Logging Multi-zone Monitoring Hand Held Portable Applications Battery Powered Test Equipment Remote Isolated Data Acquisition
Functional Block Diagram
Package Type 5-Pin SOT-23A
Sample Hold Clock Control Logic I2CInterface Comparator 10-Bit
2003 Microchip Technology Inc.
MCP3021
DS21805A-page
MCP3021
ELECTRICAL CHARACTERISTICS FUNCTION TABLE
Name Ground Analog Input Serial Data In/Out Serial Clock Function +2.7V 5.5V Power Supply
Absolute Maximum Ratings
VDD.7.0V Analog input w.r.t. -0.6V +0.6V pins w.r.t. VSS. .-0.6V +1.0V Storage temperature .-65°C +150°C Ambient temp. with power applied .-65°C +125°C Maximum Junction Temperature .150°C protection pins (HBM) Stresses above those listed under "Maximum ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise noted, parameters apply 5.0V, GND, -40°C +85°C, Fast Mode Timing: fSCL (Note Parameters Accuracy Resolution Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error Dynamic Performance Total Harmonic Distortion Signal Noise Distortion Spurious Free Dynamic Range Analog Input Input Voltage Range Leakage Current SDA/SCL (open-drain output) Data Coding Format High-level input voltage Low-level input voltage Low-level output voltage Hysteresis Schmitt trigger inputs Note VHYST Straight Binary 0.05VDD 1.53 fSCL only VSS-0.3 VDD+0.3 2.7V 5.5V SINAD SFDR 0.1V 4.9V 0.1V 4.9V 0.1V 4.9V ±0.25 ±0.25 ±0.75 bits missing codes Units Conditions
Sample time time between conversions after address byte been sent converter. Refer Figure 5-6. This parameter periodically sampled 100% tested. Pull-up resistor SCL. kHz. tACQ tCONV dependent internal oscillator timing. Figure Figure relation SCL.
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, parameters apply 5.0V, GND, -40°C +85°C, Fast Mode Timing: fSCL (Note Parameters Input leakage current Output leakage current capacitance (all inputs/outputs) Capacitance Power Requirements Operating Voltage Conversion Current Standby Current Active current Conversion Rate Conversion Time Analog Input Acquisition Time Sample Rate Note tCONV tACQ fSAMP 8.96 1.12 22.3 ksps Note Note fSCL (Note IDDS IDDA 0.005 SDA, Note CIN, Units Conditions VOUT TAMB 25°C, MHz; (Note drive low, 0.4V
Sample time time between conversions after address byte been sent converter. Refer Figure 5-6. This parameter periodically sampled 100% tested. Pull-up resistor SCL. kHz. tACQ tCONV dependent internal oscillator timing. Figure Figure relation SCL.
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: parameters apply across operating voltage range. Parameters Temperature Ranges Extended Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT23A °C/W +125 +125 +150 Symbol Units Conditions
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
TIMING SPECIFICATIONS
Electrical Characteristics: parameters apply 2.7V 5.5V, GND, -40°C +85°C. Parameters
fSCL THIGH TLOW THD:STA TSU:STA TSU:DAT TSU:STO THD:STD TBUF FSCL THIGH TLOW THD:STA TSU:STA THD:DAT TSU:DAT TSU:STO THD:STD TBUF
4000 4700 4000 4700 4000 4000 4700 1300 0.1CB 0.1CB 1300
1000 3500
Units Note Note
Conditions
Standard Mode
Clock frequency Clock high time Clock time rise time fall time START condition hold time START condition setup time Data input setup time STOP condition setup time STOP condition hold time Output valid from clock free time Input filter spike suppression Fast Mode Clock frequency Clock high time Clock time rise time fall time START condition hold time START condition setup time Data input hold time Data input setup time STOP condition setup time STOP condition hold time Output valid from clock free time Input filter spike suppression Note
From (Note From (Note
pins (Note
From (Note From (Note
pins (Note
This parameter periodically sampled 100% tested. Time must free before transmission start.
THIGH VHYS
TSU:STA TLOW THD:DAT TSU:DAT TSU:STO THD:STA TBUF
FIGURE 1-1:
Standard Fast Mode Timing Data.
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, Fast Mode Timing (SCL kHz), Continuous Conversion Mode (fSAMP 22.3 ksps), +25°C.
0.25 0.20 0.15 0.10 (LSB) 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25 Rate (kHz) Negative
(LSB) 0.25
0.20 Positive 0.15 0.10 0.005
Positive
-0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25
Negative
Rate (kHz)
FIGURE 2-1:
Clock Rate.
FIGURE 2-4: (VDD 2.7V).
0.25
Clock Rate
0.25 0.20 0.15 0.10 (LSB)
(LSB)
Positive
0.20 0.15 0.10 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25 Negative Positive
0.005
-0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25
Negative
FIGURE 2-2: Standard Mode (fSCL kHz).
(LSB) -0.1 -0.2 -0.3 -0.4 -0.5 Digital Code 1024
FIGURE 2-5: (fSCL kHz).
(LSB) -0.1 -0.2 -0.3 -0.4 -0.5
Fast Mode
Digital Code
1024
FIGURE 2-3: Code (Representative Part).
FIGURE 2-6: Code (Representative Part, 2.7V).
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
Note: Unless otherwise indicated, Fast Mode Timing (SCL kHz), Continuous Conversion Mode (fSAMP 22.3 ksps), +25°C.
0.25 0.20 0.15 0.10 (LSB) 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25 Temperature (°C)
Negative
0.25
Positive
0.20 0.15 0.10 (LSB) 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25 Temperature (°C)
Negative Positive
FIGURE 2-7:
Temperature.
FIGURE 2-10: (VDD 2.7V).
0.25 0.20 0.15
Temperature
0.25 0.20 0.15 0.10 (LSB) 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25
Positive (LSB)
0.10 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25 Negative Positive
Negative
Rate (kHz)
Rate (kHz)
FIGURE 2-8:
Clock Rate.
FIGURE 2-11: (VDD 2.7V).
0.25 0.20 0.15 0.10 (LSB) 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25
Clock Rate
0.25 0.20 0.15 0.10 (LSB) 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25 Negative Positive
Positive
Negative
FIGURE 2-9: Standard Mode (fSCL kHz).
FIGURE 2-12: Fast Mode (fSCL kHz).
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
Note: Unless otherwise indicated, Fast Mode Timing (SCL kHz), Continuous Conversion Mode (fSAMP 22.3 ksps), +25°C.
(LSB) -0.1 -0.2 -0.3 -0.4 -0.5 Digital Code 1024 (LSB) -0.1 -0.2 -0.3 -0.4 -0.5 Digital Code 1024
FIGURE 2-13: Code (Representative Part).
0.25 0.20 0.15 0.10 (LSB) 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25 Temperature (°C)
Negative Positive
FIGURE 2-16: Code (Representative Part, 2.7V).
0.25 0.20 0.15 0.10 (LSB) 0.005 -0.005 -0.2 -0.10 -0.4 -0.15 -0.6 -0.20 -0.8 -0.25
Negative Positive
Temperature (°C)
FIGURE 2-14:
Temperature.
FIGURE 2-17: (VDD 2.7V).
0.251 0.225 Offset Error (LSB) 0.175 0.15 0.125 0.075 0.05 0.025
Temperature
-0.025 -0.1 -0.05 -0.2
Gain Error (LSB)
fSCL
-0.075 -0.3 -0.1 -0.4 -0.125 -0.5 -0.15 -0.6 -0.175 -0.7 -0.2 -0.8 -0.225 -0.9 -0.25
Fast Mode SCL=100 kHz)
Standard Mode SCL=400 kHz)
FIGURE 2-15:
Gain Error VDD.
FIGURE 2-18:
Offset Error VDD.
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
Note: Unless otherwise indicated, Fast Mode Timing (SCL kHz), Continuous Conversion Mode (fSAMP 22.3 ksps), +25°C.
0.375 0.250 Offset Error (LSB) Gain Error (LSB) 0.125 -0.125 -0.5 -0.250 2.7V 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 Temperature (°C) 2.7V
-0.375 -1.5
Temperature (°C)
FIGURE 2-19:
Gain Error Temperature.
FIGURE 2-22: Temperature.
Offset Error
Input Frequency (kHz)
SINAD (dB) 2.7V Input Frequency (kHz) 2.7V
FIGURE 2-20:
(dB)
Input Frequency.
FIGURE 2-23:
SINAD (dB)
SINAD Input Frequency.
(dB)
2.7V
2.7V
Input Frequency (kHz)
Input Signal Level (dB)
FIGURE 2-21:
Input Frequency.
FIGURE 2-24: Level.
SINAD Input Signal
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
Note: Unless otherwise indicated, Fast Mode Timing (SCL kHz), Continuous Conversion Mode (fSAMP 22.3 ksps), +25°C.
9.95 11.95 9.90 11.9 9.85 11.85 ENOB (rms) 9.80 11.8 9.75 11.75 9.70 11.7 9.65 11.65 9.60 11.6 9.55 11.55 9.50 11.5 ENOB (rms) 11.5 10.5 Input Frequency (kHz) 2.7V
FIGURE 2-25:
ENOB VDD.
FIGURE 2-28:
Amplitude (dB) -110 -130
ENOB Input Frequency.
SFDR (dB)
2.7V
Input Frequency (kHz)
1000
1500
2000
2500
Frequency (Hz)
FIGURE 2-26:
SFDR Input Frequency.
FIGURE 2-29: Spectrum Using Standard Mode (Representative Part, Input Frequency).
-100 -110 -120 -130 2000 4000 6000 8000 10000 Frequency (Hz)
Amplitude (dB)
(µA)
FIGURE 2-27: Spectrum Using Fast Mode (Representative Part, Input Frequency).
FIGURE 2-30:
(Conversion) VDD.
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
Note: Unless otherwise indicated, Fast Mode Timing (SCL kHz), Continuous Conversion Mode (fSAMP 22.3 ksps), +25°C.
IDDA (µA) (µA)
2.7V Clock Rate (kHz)
2.7V
Clock Rate (kHz)
FIGURE 2-31: Rate.
(Conversion) Clock
FIGURE 2-34: Rate.
IDDA (Active Bus) Clock
IDDA (µA) (µA) Temperature (°C)
Temperature (°C) 2.7V
2.7V
FIGURE 2-32: Temperature.
IDDA (µA)
(Conversion)
FIGURE 2-35: Temperature.
IDDS (pA)
IDDA (Active Bus)
FIGURE 2-33:
IDDA (Active Bus) VDD.
FIGURE 2-36:
IDDS (Standby) VDD.
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
Note: Unless otherwise indicated, Fast Mode Timing (SCL kHz), Continuous Conversion Mode (fSAMP 22.3 ksps), +25°C.
1000 IDDS (nA) 0.01 0.001 0.0001 Temperature (°C)
Test Circuit
MCP3021
FIGURE 2-37: Temperature.
Analog Input Leakage (nA)
IDDS (Standby)
2.5V
FIGURE 2-39:
Typical Test Configuration.
Temperature (°C)
FIGURE 2-38: Temperature.
Analog Input Leakage
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
FUNCTIONS
FUNCTION TABLE
Function +2.7V 5.5V Power Supply Ground Analog Input Serial Data In/Out Serial Clock Name
Serial Data (SDA)
TABLE 3-1:
This bidirectional used transfer addresses data into device. open-drain terminal, therefore, requires pull-up resistor (typically clock speeds (refer Section 6.2, "Connecting Bus"). normal data transfer, allowed change only during low. Changes during high reserved indicating START STOP conditions (refer Section 5.1, "I2C Characteristics").
Serial Clock (SCL)
pin, with respect VSS, provides power device, well voltage reference conversion process. Refer Section 6.4, "Device Power Layout Considerations", tips power grounding.
Analog Input (AIN)
input used synchronize data transfer from device open-drain terminal. Therefore, requires pull-up resistor (typically, clock speeds. Refer Section 6.2, "Connecting Bus"). normal data transfer, allowed change only during low. Changes during high reserved indicating START STOP conditions (refer Section 6.1, "Driving Analog Input").
input sample hold circuitry Successive Approximation Register (SAR) converter. Care should taken driving this pin. Refer Section 6.1, "Driving Analog Input". proper conversions, voltage this vary from VDD.
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
DEVICE OPERATION
Conversion Time (tCONV)
MCP3021 employs classic architecture. This architecture uses internal sample hold capacitor store analog input while conversion taking place. acquisition time, input switch converter opens device uses collected charge internal sample hold capacitor produce serial 10-bit digital output code. acquisition time conversion self-timed using internal clock. After each conversion, results stored 10-bit register that read time. Communication with device accomplished with 2-wire interface. Maximum sample rates 22.3 ksps possible with MCP3021 continuous conversion mode clock rate kHz. conversion time time required obtain digital result once analog input disconnected from holding capacitor. With MCP3021, specified conversion time typically 8.96 This time dependent internal oscillator independent SCL.
Acquisition Time (tACQ)
acquisition time amount time sample array acquiring charge. acquisition time typically, 1.12 This time dependent internal oscillator independent SCL.
Sample Rate
Digital Output Code
digital output code produced MCP3021 function input signal power supply voltage (VDD). level reduced, size reduced accordingly. theoretical size shown below.
Sample rate inverse maximum amount time that required from point acquisition first conversion point acquisition second conversion. sample rate measured either single continuous conversions. single conversion includes Start Bit, Address Byte, Data Bytes Stop bit. This sample rate measured from Start next Start Bit. continuous conversions (requested Master issuing acknowledge after conversion), maximum sample rate measured from conversion conversion, total clocks (two data bytes Acknowledge bits). Refer Section 5-2, "Device Addressing".
EQUATION
SIZE -1024 Supply voltage output code MCP3021 transmitted serially with first, format code being straight binary.
Output Code 1111 1111 1111 1110 (1023) (1022)
0000 0011 0000 0010 0000 0001 0000 0000 VDD-1.5 VDD-2.5
FIGURE 4-1:
Transfer Function.
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
Differential Non-Linearity (DNL) Gain Error
ideal transfer function, each code uniform width. That difference analog input voltage constant from code transition point next. specifies deviation code transfer function from ideal code width LSB. determined subtracting locations successive code transition points after compensating gain offset errors. positive implies that code longer than ideal code width, while negative implies that code shorter than ideal width. gain error determines amount deviation from ideal slope transfer function. Before gain error determined, offset error measured subtracted from conversion result. gain error then determined finding location last code transition comparing that location ideal location. ideal location last code transition LSBs below full-scale VDD.
Conversion Current (IDD)
Integral Non-Linearity (INL)
average amount current over time required perform 10-bit conversion.
result cumulative errors specifies much overall transfer function deviates from linear response. method measurement used MCP3021 determine "end-point" method.
4.10
Active Current (IDDA)
average amount current over time required monitor bus. current device consumes while being addressed referred Active current.
Offset Error
4.11
Offset error defined deviation code transition points that present across output codes. This effect shifting entire transfer function. offset error measured finding difference between actual location first code transition desired location first transition. ideal location first code transition located above VSS.
Standby Current (IDDS)
average amount current required while conversion occurring while data being output (i.e., lines quiet).
4.12
Standard Mode Timing
specification where frequency kHz.
4.13
Fast Mode Timing
specification where frequency kHz.
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
SERIAL COMMUNICATIONS
Characteristics
following protocol been defined: Data transfer initiated only when busy. During data transfer, data line must remain stable whenever clock line high. Changes data line while clock line high will interpreted START STOP condition. Accordingly, following conditions have been defined (refer Figure 5-1).
Each data transfer initiated with START condition terminated with STOP condition. number data bytes transferred between START STOP conditions determined master device unlimited.
5.1.5
ACKNOWLEDGE
Each receiving device, when addressed, obliged generate acknowledge after reception each byte. master device must generate extra clock pulse that associated with this acknowledge bit. device that acknowledges pull down line during acknowledge clock pulse such that line stable during high period acknowledge-related clock pulse. Setup hold times must taken into account. During reads, master device must signal data slave generating acknowledge last byte that been clocked slave (NAK). this case, slave (MCP3021) will release allow master device generate STOP condition. MCP3021 supports bidirectional 2-wire data transmission protocol. device that sends data onto transmitter device receiving data receiver. controlled master device that generates serial clock (SCL), controls access generates START STOP conditions, while MCP3021 works slave device. Both master slave devices operate either transmitter receiver, master device determines which mode activated.
5.1.1
BUSY
Both data clock lines remain high.
5.1.2
START DATA TRANSFER
high-to-low transition line while clock (SCL) high determines START condition. commands must preceded START condition.
5.1.3
STOP DATA TRANSFER
low-to-high transition line while clock (SCL) high determines STOP condition. operations must ended with STOP condition.
5.1.4
DATA VALID
state data line represents valid data when, after START condition, data line stable duration high period clock signal. data line must changed during period clock signal. There clock pulse data.
START CONDITION
ADDRESS DATA ACKNOWLEDGE ALLOWED VALID CHANGE
STOP CONDITION
FIGURE 5-1:
Data Transfer Sequence Serial Bus.
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
Device Addressing Executing Conversion
address byte first byte received following START condition from master device. first part control byte consists 4-bit device code, which 1001 MCP3021. device code followed three address bits: default address bits (contact Microchip factory additional address options).The address bits allow eight MCP3021 devices same used determine which device accessed. eighth slave address determines master device wants read conversion data write MCP3021. When `1', read operation selected. When `0', write operation selected. There writable registers MCP3021, therefore, this must initiate conversion. MCP3021 slave device that compatible with 2-wire serial interface protocol. hardware connection diagram shown Figure 6-2. Communication initiated microcontroller (master device), which sends START followed address byte. completion conversion(s) performed MCP3021, microcontroller must send STOP stop communication. last device address byte bit. When this logic `1', conversion will executed. Setting this logic will also result "acknowledge" (ACK) from MCP3021, with device then releasing bus. This used device polling (refer Section 6.3, "Device Polling"). START READ/WRITE
SLAVE ADDRESS
This section will describe details communicating with MCP3021 device. Initiating sample hold acquisition, reading conversion data executing multiple conversions will discussed.
5.3.1
INITIATING SAMPLE HOLD
acquisition conversion input signal begins with falling edge address byte. this point, internal clock initiates sample, hold conversion cycle, which internal ADC.
tACQ tCONV initiated here Address Byte
Start
Device bits
Address bits
FIGURE 5-3: Address Byte.
Initiating Conversion,
tACQ tCONV initiated here Lower Data Byte
Device Code
Address Bits1
Contact Microchip additional address bits.
FIGURE 5-4: Initiating Conversion, Continuous Conversions.
FIGURE 5-2:
Device Addressing.
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
input signal will initially sampled with first falling edge clock following transmission logic-high bit. Additionally, with rising edge SCL, will transmit acknowledge (ACK master must release data during this clock pulse allow MCP3021 pull line (refer Figure 5-3). consecutive samples, sampling begins last lower data byte. Refer Figure timing diagram.
5.3.2
READING CONVERSION DATA
After MCP3021 acknowledges address byte, device will transmit four bits followed upper four data bits conversion. master device will then acknowledge this byte with low. With following clock pulses, MCP3021 will transmit lower data bits from conversion. last bits "don't cares", contain valid data. master then sends high, indicating MCP3021 that more data requested. master then send stop transmission.
tACQ tCONV initiated here Address Byte Upper Data Byte Lower Data Byte
Device bits Address bits
FIGURE 5-5: 5.3.3
Executing Conversion.
CONSECUTIVE CONVERSIONS
consecutive samples, sampling begins falling edge last lower data byte. Figure timing. tACQ tCONV initiated here tACQ CONV initiated here fSAMP 22.3 ksps (fCLK kHz)
Address Byte
Upper Data Byte
Lower Data Byte
Device bits Address bits
FIGURE 5-6:
Continuous Conversion.
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
APPLICATIONS INFORMATION
Driving Analog Input
MCP3021 single-ended analog input (AIN). proper conversion results, voltage must kept between VDD. converter offset error, gain error, errors voltage level equal less than LSB, resultant code will 000h. Additionally, voltage equal greater than LSB, output code will 1FFh. 0.6V
analog input model shown Figure 6-1. this diagram, source impedance (RSS) adds internal sampling switch (RS) impedance, directly affecting time required charge capacitor (CSAMPLE). Consequently, larger source impedance increases offset error, gain error integral linearity errors conversion. Ideally, impedance signal source should near zero. This achievable with operational amplifier such MCP6022, which closed-loop output impedance tens ohms.
Sampling Switch SAMPLE capacitance
CPIN
0.6V
ILEAKAGE
Legend CPIN ILEAKAGE CSAMPLE
signal source source impedance analog input analog input capacitance threshold voltage leakage current various junctions sampling switch sampling switch resistor sample/hold capacitance
FIGURE 6-1:
Analog Input Model, AIN.
number devices connected limited only maximum capacitance possible configuration using multiple devices shown Figure 6-3. PIC16F876 Microcontroller
Connecting
open collector bus, requiring pull-up resistors connected lines. This configuration shown Figure 6-2. PICmicro® Microcontroller
MCP3021
24LC01 EEPROM Analog Input Signal MCP3021 10-bit TC74 Temperature Sensor
typically: fSCL fSCL
FIGURE 6-2: Bus.
Pull-up Resistors
FIGURE 6-3:
Multiple Devices Bus.
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
Device Polling
some instances, necessary test MCP3021 presence without performing conversion, described Figure 6-4. Here setting address byte zero. MCP3021 will then acknowledge pulling during clock then release back master. stop repeated start then issued from master communication continue.
Address Byte
precautions should taken keep traces with high frequency signals (such clock lines) possible from analog traces. MCP3021 should connected entirely analog ground place, well analog power trace. pull-up resistors placed close microcontroller tied digital power VCC. analog ground plane recommended order keep ground potential same devices board. Providing connections devices "star" configuration also reduce noise eliminating current return paths associated errors (Figure 6-6). more information layout tips when using MCP3021 other devices, refer AN688, "Layout Tips 12-Bit Converter Applications".
Connection
Start
Device bits
Address bits
Start
MCP3021 response
FIGURE 6-4:
Device Polling.
Device Device
6.4.1
Device Power Layout Considerations
POWERING MCP3021
supplies power device well reference voltage. bypass capacitor value recommended. Adding capacitor parallel recommended attenuate higher frequency noise present some systems.
MCP3021 Microcontroller
Device
Device
FIGURE 6-6: traces arranged `Star' configuration order reduce errors caused current return paths. 6.4.3 USING REFERENCE SUPPLY
MCP3021 uses power also reference. some applications, necessary stable reference achieve required accuracy. Figure shows example using MCP1541 4.096V reference.
FIGURE 6-5: 6.4.2
Powering MCP3021.
LAYOUT CONSIDERATIONS
When laying printed circuit board with analog components, care should taken reduce noise wherever possible. bypass capacitor from ground should always used with this device should placed close possible device pin. bypass capacitor value recommended. Digital analog traces should separated much possible board, with traces running underneath device bypass capacitor. Extra
MCP1541 4.096V Reference
MCP3021
FIGURE 6-7: Stable Power Reference Configuration.
2003 Microchip Technology Inc.
DS21805A-page
Microcontroller
MCP3021
PACKAGING INFORMATION
Package Marking Information
5-Pin SOT-23A (EIAJ SC-74) Device
Part Number MCP3021A0T-E/OT MCP3021A1T-E/OT MCP3021A2T-E/OT MCP3021A3T-E/OT MCP3021A4T-E/OT MCP3021A5T-E/OT MCP3021A6T-E/OT MCP3021A7T-E/OT
Address Option
SOT-23
Default option. Contact Microchip Factory other address options.
Legend:
Part Number code temperature range Part Number code temperature range Year work week
Note:
event full Microchip part number cannot marked line, will carried over next line thus limiting number available characters customer specific information.
Standard device marking consists Microchip part number, year code, week code, traceability code.
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
Number Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES* .038 .075 .046 .043 .003 .110 .064 .116 .018 .006 .017
.035 .035 .000 .102 .059 .110 .014 .004 .014
.057 .051 .006 .118 .069 .122 .022 .008 .020
MILLIMETERS 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0.09 0.15 0.35 0.43
1.45 1.30 0.15 3.00 1.75 3.10 0.55 0.20 0.50
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MO-178 Drawing C04-091
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
NOTES:
DS21805A-page
2003 Microchip Technology Inc.
MCP3021
PRODUCT IDENTIFICATION SYSTETo order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Address Options Temperature Range Package Examples:
Temperature Range: Address Options: -40°C +125°C
Device:
MCP3021T: 10-Bit 2-Wire Serial Converter (Tape Reel)
MCP3021A0T-E/OT: Tape Reel MCP3021A1T-E/OT: Tape Reel MCP3021A2T-E/OT: Tape Reel MCP3021A3T-E/OT: Tape Reel MCP3021A4T-E/OT: Tape Reel MCP3021A5T-E/OT: Tape Reel MCP3021A6T-E/OT: Tape Reel MCP3021A7T-IE/OT: Tape Reel
Extended, Address, Extended, Address, Extended, Address, Extended, Address, Extended, Address, Extended, Address, Extended, Address, Extended, Address,
Default option. Contact Microchip factory other address options Package: SOT-23, 5-lead (Tape Reel)
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2003 Microchip Technology Inc.
DS21805A-page
MCP3021
NOTES:
DS21805A-page
2003 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, MATE PowerSmart registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel Total Endurance trademarks Microchip Technology Incorporated U.S.A. other countries. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2003, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
Printed recycled paper. Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2003 Microchip Technology Inc.
DS21805A-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Address: http://www.microchip.com
ASIA/PACIFIC
Australia
Microchip Technology Australia Marketing Support Division Suite Rawson Street Epping 2121, Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Japan
Microchip Technology Japan K.K. Benex 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Atlanta
3780 Mansell Road, Suite Alpharetta, 30022 Tel: 770-640-0034 Fax: 770-640-0307
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934
China Beijing
Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit Bldg. Chaoyangmen Beidajie Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104
Boston
Drive, Suite Westford, 01886 Tel: 978-692-3848 Fax: 978-692-3821
Singapore
Microchip Technology Singapore Ltd. Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
Chicago
Pierce Road, Suite Itasca, 60143 Tel: 630-285-0071 Fax: 630-285-0075
China Chengdu
Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office 2401-2402, 24th Floor, Ming Xing Financial Tower TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599
Taiwan
Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, Tung North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Dallas
4570 Westgrove Drive, Suite Addison, 75001 Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building 32255 Northwestern Highway, Suite Farmington Hills, 48334 Tel: 248-538-2250 Fax: 248-538-2260
China Fuzhou
Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
EUROPE
Austria
Microchip Technology Austria GmbH Durisolstrasse A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
Kokomo
2767 Albright Road Kokomo, 46902 Tel: 765-864-8360 Fax: 765-864-8387
China Hong Kong
Microchip Technology Hongkong Ltd. Unit 901-6, Tower Metroplaza Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
Angeles
18201 Karman, Suite 1090 Irvine, 92612 Tel: 949-263-1888 Fax: 949-263-1338
Denmark
Microchip Technology Nordic Regus Business Centre Lautrup Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910
China Shanghai
Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. East International Plaza Xian Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Phoenix
2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338
France
Microchip Technology SARL Parc d'Activite Moulin Massy Saule Trapu Batiment Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Jose
Microchip Technology Inc. 2107 North First Street, Suite Jose, 95131 Tel: 408-436-7950 Fax: 408-436-7955
China Shenzhen
Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office 1812, 18/F, Building United Plaza 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393
Toronto
6285 Northam Drive, Suite Mississauga, Ontario 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
Germany
Microchip Technology GmbH Steinheilstrasse D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
China Qingdao
B505A, Fullhope Plaza, Hong Kong Central Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205
Italy
Microchip Technology Quasimodo, 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781
India
Microchip Technology Inc. India Liaison Office Marketing Support Division Divyasree Chambers Floor, Wing (A3/A4) O'Shaugnessey Road Bangalore, 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
United Kingdom
Microchip Ltd. Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 Tel: 44-118-921-5869 Fax: 44-118-921-5820
05/30/03
DS21805A-page
2003 Microchip Technology Inc.
Other recent searches
ST7MDT1 - ST7MDT1 ST7MDT1 Datasheet
2-EMU2 - 2-EMU2 2-EMU2 Datasheet
MSE177E - MSE177E MSE177E Datasheet
MAAM-009116 - MAAM-009116 MAAM-009116 Datasheet
M12x1 - M12x1 M12x1 Datasheet
DG201B - DG201B DG201B Datasheet
202B - 202B 202B Datasheet
500gand2000gfullscaleranges - 500gand2000gfullscaleranges 500gand2000gfullscaleranges Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
