MCP3004/3008 Description Microchip Technology Inc. MCP3004/3
|
|
|
Top Searches for this datasheet
10-bit resolution (MCP3004) (MCP3008) input channels Analog inputs programmable single-ended pseudo-differential pairs On-chip sample hold serial interface (modes 1,1) Single supply operation: 2.7V 5.5V ksps max. sampling rate ksps max. sampling rate 2.7V power CMOS technology typical standby current, max. max. active current Industrial temp range: -40°C +85°C Available PDIP, SOIC TSSOP packages
MCP3004/3008
Description
Microchip Technology Inc. MCP3004/3008 devices successive approximation 10-bit Analogto-Digital (A/D) converters with on-board sample hold circuitry. MCP3004 programmable provide pseudo-differential input pairs four singleended inputs. MCP3008 programmable provide four pseudo-differential input pairs eight singleended inputs. Differential Nonlinearity (DNL) Integral Nonlinearity (INL) specified LSB. Communication with devices accomplished using simple serial interface compatible with protocol. devices capable conversion rates ksps. MCP3004/3008 devices operate over broad voltage range (2.7V 5.5V). current design permits operation with typical standby currents only typical active currents MCP3004 offered 14-pin PDIP, SOIC TSSOP packages, while MCP3008 offered 16pin PDIP SOIC packages.
2.7V 4-Channel/8-Channel 10-Bit Converters with SPISerial Interface
Applications
Sensor Interface Process Control Data Acquisition Battery Operated Systems
Functional Block Diagram
VREF CH7* VREF AGND DOUT CS/SHDN Sample Hold Control Logic Input Channel
Package Types
PDIP, SOIC, TSSOP
DGND
Comparator 10-Bit
MCP3004
Shift Register
DOUT
CS/SHDN
PDIP, SOIC
VREF AGND DOUT CS/SHDN DGND
Note: Channels available MCP3008 Only
2002 Microchip Technology Inc.
MCP3008
DS21295B-page
MCP3004/3008
ELECTRICAL CHARACTERISTICS FUNCTION TABLE
Name DGND AGND CH0-CH7 DOUT CS/SHDN VREF Function +2.7V 5.5V Power Supply Digital Ground Analog Ground Analog Inputs Serial Clock Serial Data Serial Data Chip Select/Shutdown Input Reference Voltage Input
Absolute Maximum Ratings*
.7.0V inputs outputs w.r.t. .-0.6V +0.6V Storage temperature -65°C +150°C Ambient temp. with power applied -65°C +125°C Soldering temperature leads seconds) +300°C protection pins
*Notice: Stresses above those listed under "Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operation listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise noted, parameters apply TAMB -40°C +85°C, fSAMPLE ksps fCLK 18*fSAMPLE. Unless otherwise noted, typical values apply TAMB 25°C. Parameter Conversion Rate Conversion Time Analog Input Sample Time Throughput Rate Accuracy Resolution Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error Dynamic Performance Total Harmonic Distortion Signal Noise Distortion (SINAD) Spurious Free Dynamic Range Reference Input Voltage Range Current Drain 0.25 0.001 Note 0.1V 4.9V@1 0.1V 4.9V@1 0.1V 4.9V@1 ±0.5 ±0.25 ±1.5 ±1.0 bits missing codes over temperature tCONV tSAMPLE fSAMPLE clock cycles clock cycles ksps ksps VREF VREF 2.7V Units Conditions
Note This parameter established characterization 100% tested. graphs that relate linearity performance VREF levels. Because sample will eventually lose charge, effective clock rates below affect linearity performance, especially elevated temperatures. Section 6.2, "Maintaining Minimum Clock Speed", more information.
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, parameters apply TAMB -40°C +85°C, fSAMPLE ksps fCLK 18*fSAMPLE. Unless otherwise noted, typical values apply TAMB 25°C. Parameter Analog Inputs Input Voltage Range Single-Ended Mode Input Voltage Range pseudo-differential mode Input Voltage Range pseudo-differential mode Leakage Current Switch Resistance Sample Capacitor Digital Input/Output Data Coding Format High Level Input Voltage Level Input Voltage High Level Output Voltage Level Output Voltage Input Leakage Current Output Leakage Current Capacitance (All Inputs/Outputs) Timing Parameters Clock Frequency Clock High Time Clock Time Fall First Rising Edge Fall Falling Edge Data Input Setup Time Data Input Hold Time Fall Output Data Valid Fall Output Enable Rise Output Disable Disable Time DOUT Rise Time DOUT Fall Time fCLK tSUCS tCSD tDIS tCSH 1.35 Test Circuits, Figure (Note Test Circuits, Figure (Note Figure 2.7V, Figure Figure 2.7V, Figure Test Circuits, Figure (Note 2.7V (Note CIN, COUT Straight Binary 4.5V 4.5V VOUT 5.0V (Note TAMB 25°C, INVSS-100 0.001 1000 VREF VREF+INVSS+100 Figure Figure Units Conditions
Note This parameter established characterization 100% tested. graphs that relate linearity performance VREF levels. Because sample will eventually lose charge, effective clock rates below affect linearity performance, especially elevated temperatures. Section 6.2, "Maintaining Minimum Clock Speed", more information.
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, parameters apply TAMB -40°C +85°C, fSAMPLE ksps fCLK 18*fSAMPLE. Unless otherwise noted, typical values apply TAMB 25°C. Parameter Power Requirements Operating Voltage Operating Current VREF DOUT unloaded VREF 2.7V, DOUT unloaded 5.0V Units Conditions
Standby Current Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistance Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Thermal Resistance, 16L-PDIP Thermal Resistance, 16L-SOIC
IDDS
0.005
+150
°C/W °C/W °C/W °C/W °C/W
Note This parameter established characterization 100% tested. graphs that relate linearity performance VREF levels. Because sample will eventually lose charge, effective clock rates below affect linearity performance, especially elevated temperatures. Section 6.2, "Maintaining Minimum Clock Speed", more information.
TCSH TSUCS
NULL TDIS
DOUT
FIGURE 1-1:
Serial Interface Timing.
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
1.4V DOUT Test Point Test Point DOUT tDIS Waveform Waveform tDIS Waveform
Voltage Waveforms Voltage Waveforms DOUT DOUT
Voltage Waveforms
Voltage Waveforms tDIS TDIS DOUT Waveform Waveform output with internal conditions such that output high, unless disabled output control. Waveform output with internal conditions such that output low, unless disabled output control.
FIGURE 1-2:
Load Circuit tDO.
DOUT Waveform
FIGURE 1-3:
Load circuit tDIS tEN.
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
Note:
TYPICAL PERFORMANCE CHARACTERISTICS
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, VREF fCLK fSAMPLE, 25°C.
-0.2 -0.4 -0.6 -0.8 -1.0 Negative Positive VREF
(LSB)
-0.2 -0.4 -0.6 -0.8 -1.0
Negative
Sample Rate (ksps)
(LSB)
Positive
Sample Rate (ksps)
FIGURE 2-1: Sample Rate.
Integral Nonlinearity (INL)
FIGURE 2-4: Integral Nonlinearity (INL) Sample Rate (VDD 2.7V).
INL(LSB)
-0.2 -0.4 -0.6 -0.8 -1.0
Positive -0.2 -0.4 -0.6 -0.8 -1.0 Negative Positive
VREF fSAMPLE ksps
Negative
INL(LSB)
VREF
VREF
FIGURE 2-2: VREF.
Integral Nonlinearity (INL)
FIGURE 2-5: Integral Nonlinearity (INL) VREF (VDD 2.7V).
VREF fSAMPLE ksps
VREF fSAMPLE ksps
(LSB)
(LSB)
-0.1 -0.2 -0.3 -0.4 -0.5 1024
-0.1 -0.2 -0.3 -0.4 -0.5 1024
Digital Code
Digital Code
FIGURE 2-3: Integral Nonlinearity (INL) Code (Representative Part).
FIGURE 2-6: Integral Nonlinearity (INL) Code (Representative Part, 2.7V).
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
Note: Unless otherwise indicated, fCLK fSAMPLE, 25°C.
Positive VREF fSAMPLE ksps Positive
(LSB)
(LSB)
-0.2 Negative -0.4 -0.6
-0.2 -0.4 -0.6
Negative
Temperature (°C)
Temperature (°C)
FIGURE 2-7: Temperature.
Integral Nonlinearity (INL)
FIGURE 2-10: Integral Nonlinearity (INL) Temperature (VDD 2.7V).
VREF
(LSB)
(LSB)
-0.2 -0.4 -0.6
Positive
-0.2 -0.4 -0.6
Positive
Negative
Negative
Sample Rate (ksps)
Sample Rate (ksps)
FIGURE 2-8: Differential Nonlinearity (DNL) Sample Rate.
FIGURE 2-11: Differential Nonlinearity (DNL) Sample Rate (VDD 2.7V).
-0.2 -0.4 -0.6 -0.8 -1.0 Negative Positive
Positive
VREF fSAMPLE ksps
(LSB)
(LSB)
-0.2 -0.4 -0.6 -0.8 -1.0 Negative
VREF
VREF(V)
FIGURE 2-9: VREF.
Differential Nonlinearity (DNL)
FIGURE 2-12: Differential Nonlinearity (DNL) VREF (VDD 2.7V).
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
Note: Unless otherwise indicated, fCLK fSAMPLE, 25°C.
-0.2 -0.4 -0.6 -0.8 -1.0 1024 VREF fSAMPLE ksps -0.2 -0.4 -0.6 -0.8 -1.0 1024 VREF fSAMPLE ksps
(LSB)
Digital Code
(LSB)
Digital Code
FIGURE 2-13: Differential Nonlinearity (DNL) Code (Representative Part).
Positive
FIGURE 2-16: Differential Nonlinearity (DNL) Code (Representative Part, 2.7V).
VREF fSAMPLE ksps
(LSB)
(LSB)
-0.2 Negative -0.4 -0.6
-0.2 -0.4 -0.6
Positive
Negative
Temperature (°C)
Temperature (°C)
FIGURE 2-14: Differential Nonlinearity (DNL) Temperature.
FIGURE 2-17: Differential Nonlinearity (DNL) Temperature (VDD 2.7V).
fSAMPLE ksps
Offset Error (LSB)
Gain Error (LSB)
-0.5 -1.0 -1.5 -2.0
fSAMPLE ksps fSAMPLE ksps
fSAMPLE ksps
VREF(V)
VREF
FIGURE 2-15: Gain Error VREF.
FIGURE 2-18: Offset Error VREF.
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
Note: Unless otherwise indicated, fCLK fSAMPLE, 25°C.
-0.1 VREF SAMPLE ksps VREF fSAMPLE ksps
Offset Error (LSB)
Gain Error (LSB)
-0.2 -0.3 -0.4 -0.5 -0.6
VREF fSAMPLE ksps
VREF fSAMPLE ksps
Temperature (°C)
Temperature (°C)
FIGURE 2-19: Gain Error Temperature.
VREF SAMPLE ksps
FIGURE 2-22: Offset Error Temperature.
VREF fSAMPLE ksps
(dB)
VREF fSAMPLE ksps
SINAD (dB)
VREF fSAMPLE ksps
Input Frequency (kHz)
Input Frequency (kHz)
FIGURE 2-20: Signal Noise (SNR) Input Frequency.
-100 VREF SAMPLE ksps
FIGURE 2-23: Signal Noise Distortion (SINAD) Input Frequency.
SINAD (dB)
(dB)
VREF fSAMPLE ksps
VREF fSAMPLE ksps
VREF fSAMPLE ksps
Input Frequency (kHz)
Input Signal Level (dB)
FIGURE 2-21: Total Harmonic Distortion (THD) Input Frequency.
FIGURE 2-24: Signal Noise Distortion (SINAD) Input Signal Level.
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
Note: Unless otherwise indicated, fCLK fSAMPLE, 25°C.
10.00 10.0 9.75 VREF fSAMPLE ksps VREF fSAMPLE ksps VREF fSAMPLE ksps
ENOB (rms)
9.50
9.25 VREF fSAMPLE ksps 9.00
VREF
ENOB (rms)
Input Frequency (kHz)
FIGURE 2-25: Effective Number Bits (ENOB) VREF.
VREF fSAMPLE ksps
FIGURE 2-28: Effective Number Bits (ENOB) Input Frequency.
VREF fSAMPLE ksps
Power Supply Rejection (dB)
VREF fSAMPLE ksps
SFDR (dB)
1000
10000
Input Frequency (kHz)
Ripple Frequency (kHz)
FIGURE 2-26: Spurious Free Dynamic Range (SFDR) Input Frequency.
-100 -110 -120 -130 20000 40000 VREF FSAMPLE ksps FINPUT 10.0097 4096 points
FIGURE 2-29: Power Supply Rejection (PSR) Ripple Frequency.
-100 -110 -120 -130 5000 VREF fSAMPLE ksps fINPUT 1.00708 4096 points
Amplitude (dB)
60000
80000
100000
Amplitude (dB)
Frequency (Hz)
10000 15000 20000 25000 30000 35000
Frequency (Hz)
FIGURE 2-27: Frequency Spectrum Input (Representative Part).
FIGURE 2-30: Frequency Spectrum Input (Representative Part, 2.7V).
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
Note: Unless otherwise indicated, fCLK fSAMPLE, 25°C.
VREF points fCLK except VREF fCLK 1.35 VREF points fCLK except VREF 1.35
(µA)
(µA)
FIGURE 2-31: VDD.
FIGURE 2-34: IREF VDD.
VREF
(µA)
VREF
IREF (µA)
VREF
VREF
1000
10000
1000
10000
Clock Frequency (kHz)
Clock Frequency (kHz)
FIGURE 2-32: Clock Frequency.
VREF fCLK 1.35 VREF fCLK
FIGURE 2-35: IREF Clock Frequency.
VREF fCLK
(µA)
IREF (µA)
VREF 1.35
Temperature (°C)
Temperature (°C)
FIGURE 2-33: Temperature.
FIGURE 2-36: IREF Temperature.
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
Note: Unless otherwise indicated, fCLK fSAMPLE, 25°C.
Analog Input Leakage (nA)
VREF
VREF
IDDS (pA)
Temperature (°C)
FIGURE 2-37: IDDS VDD.
100.00 VREF 10.00
FIGURE 2-39: Analog Input Leakage Current Temperature.
IDDS (nA)
1.00
0.10
0.01
Temperature (°C)
FIGURE 2-38: IDDS Temperature.
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
DESCRIPTIONS
FUNCTION TABLE
Function +2.7V 5.5V Power Supply Digital Ground Analog Ground Analog Inputs Serial Clock Serial Data Serial Data Chip Select/Shutdown Input Reference Voltage Input Name DGND AGND CH0-CH7 DOUT CS/SHDN VREF
DEVICE OPERATION
TABLE 3-1:
MCP3004/3008 converters employ conventional architecture. With this architecture, sample acquired internal sample/hold capacitor clock cycles starting first rising edge serial clock once been pulled low. Following this sample time, device uses collected charge internal sample hold capacitor produce serial 10-bit digital output code. Conversion rates ksps possible MCP3004/3008. Section 6.2, "Maintaining Minimum Clock Speed", information minimum clock rates. Communication with device accomplished using 4-wire SPIcompatible interface.
Analog Inputs
DGND
Digital ground connection internal digital circuitry.
AGND
Analog ground connection internal analog circuitry.
Analog inputs channels respectively, multiplexed inputs. Each pair channels programmed used independent channels single-ended mode single pseudo-differential input where channel channel Section 4.1, "Analog Inputs", Section 5.0, "Serial Communication", information programming channel configuration.
MCP3004/3008 devices offer choice using analog input channels configured single-ended inputs pseudo-differential pairs. MCP3004 configured provide pseudo-differential input pairs four single-ended inputs. MCP3008 configured provide four pseudo-differential input pairs eight single-ended inputs. Configuration done part serial command before each conversion begins. When used pseudo-differential mode, each channel pair (i.e., CH1, etc.) programmed inputs part command string transmitted device. input range from (VREF IN-). input limited ±100 from rail. INinput used cancel small signal commonmode noise, which present both INinputs. When operating pseudo-differential mode, voltage level equal less than IN-, resultant code will 000h. voltage equal greater than {[VREF (IN-)] LSB}, then output code will 3FFh. voltage level INis more than below VSS, voltage level input will have below 000h output code. Conversely, more than above VSS, 3FFh code will seen unless input level goes above VREF level. converter meet specification, charge holding capacitor (CSAMPLE) must given enough time acquire 10-bit accurate voltage level during clock cycle sampling period. analog input model shown Figure 4-1. This diagram illustrates that source impedance (RS) adds internal sampling switch (RSS) impedance, directly affecting time that required charge capacitor (CSAMPLE). Consequently, larger source impedances increase offset, gain integral linearity errors conversion (see Figure 4-2).
Serial Clock (CLK)
clock used initiate conversion clock each conversion takes place. Section 6.2, "Maintaining Minimum Clock Speed", constraints clock speed.
Serial Data Input
port serial data input used load channel configuration data into device.
Serial Data Output (DOUT)
serial data output used shift results conversion. Data will always change falling edge each clock conversion takes place.
Chip Select/Shutdown (CS/SHDN)
CS/SHDN used initiate communication with device when pulled low. When pulled high, will conversion device power standby. CS/SHDN must pulled high between conversions.
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
Reference Input
EQUATION
1024 Digital Output Code analog input voltage VREF reference voltage When using external voltage reference device, system designer should always refer manufacturer's recommendations circuit layout. instability operation reference device will have direct effect operation converter. each device family, reference input (VREF) determines analog input voltage range. reference input reduced, size reduced accordingly.
EQUATION
Size -1024 theoretical digital output code produced converter function analog input signal reference input, shown below. 0.6V
Sampling Switch SAMPLE capacitance
CPIN
0.6V
ILEAKAGE
Legend Signal Source Source Impedance Input Channel Input Capacitance Threshold Voltage ILEAKAGE Leakage Current Various Junctions sampling switch sampling switch resistor CSAMPLE sample/hold capacitance
FIGURE 4-1:
Analog Input Model.
Clock Frequency (Mhz)
VREF fSAMPLE ksps
VREF fSAMPLE ksps
1000
10000
Input Resistance (Ohms)
FIGURE 4-2: Maximum Clock Frequency Input resistance (RS) maintain less than deviation from nominal conditions.
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
SERIAL COMMUNICATION
TABLE 5-1:
Communication with MCP3004/3008 devices accomplished using standard SPI-compatible serial interface. Initiating communication with either device done bringing line (see Figure 5-1). device powered with low, must brought high back initiate communication. first clock received with high will constitute start bit. SGL/DIFF follows start will determine conversion will done using single-ended differential input mode. next three bits (D0, used select input channel configuration. Table Table show configuration bits MCP3004 MCP3008, respectively. device will begin sample analog input fourth rising edge clock after start been received. sample period will falling edge fifth clock following start bit. Once input, more clock required complete sample hold period "don't care" this clock). falling edge next clock, device will output null bit. next clocks will output result conversion with first, shown Figure 5-1. Data always output from device falling edge clock. data bits have been transmitted device continues receive clocks while held low, device will output conversion result first, shown Figure 5-2. more clocks provided device while still (after first data been transmitted), device will clock zeros indefinitely. necessary, possible bring clock leading zeros line before start bit. This often done when dealing with microcontroller-based ports that must send bits time. Refer Section 6.1, "Using MCP3004/3008 with Microcontroller (MCU) Ports", more details using MCP3004/3008 devices with hardware ports.
CONFIGURE BITS MCP3004
Channel Selection INCH0 INCH1 INCH2 INCH3
Input Configuration Single/ Diff single-ended single-ended single-ended single-ended differential differential differential differential
Control Selections
"don't care" MCP3004
TABLE 5-2:
Control Selections Single /Diff
CONFIGURE BITS MCP3008
Input Configuration single-ended single-ended single-ended single-ended single-ended single-ended single-ended single-ended differential differential differential differential differential differential differential differential Channel Selection INCH0 INCH1 INCH2 INCH3 INCH4 INCH5 INCH6 INCH7
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
tCYC tCSH tSUCS tCYC
Start
SGL/ DIFF
Don't Care
Start
SGL/ DIFF
DOUT
HI-Z
Null tCONV
HI-Z
tSAMPLE
tDATA
After completing data transfer, further clocks applied with low, converter will output first data, then followed with zeros indefinitely. Figure below. tDATA: during this time, bias current comparator powers down while reference input becomes high impedance node.
FIGURE 5-1:
Communication with MCP3004 MCP3008.
tCYC tSUCS Start SGL/ DIFF
HI-Z Don't Care Power Down
tCSH
DOUT
HI-Z Null (MSB)
tSAMPLE
tCONV
tDATA
After completing data transfer, further clocks applied with low, converter will output zeros indefinitely. tDATA: During this time, bias circuit comparator powers down while reference input becomes high impedance node, leaving running clock first data zeroes.
FIGURE 5-2:
Communication with MCP3004 MCP3008 First Format.
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
APPLICATIONS INFORMATION
Using MCP3004/3008 with Microcontroller (MCU) Ports
With most microcontroller ports, required send groups eight bits. also required that microcontroller port configured clock data falling edge clock latch data rising edge. Because communication with MCP3004/ 3008 devices need multiples eight clocks, will necessary provide more clocks than required. This usually done sending `leading zeros' before start bit. example, Figure Figure shows MCP3004/3008 interfaced with hardware port. Figure depicts operation shown Mode 0,0, which requires that SCLK from idles `low' state, while Figure shows similar case Mode 1,1, where clock idles `high' state. shown Figure 6-1, first byte transmitted converter contains seven leading zeros before start bit. Arranging leading zeros this induces data bits fall positions easily manipulated MCU. clocked converter falling edge clock number Once second eight clocks have been sent device, receive buffer will contain five unknown bits (the output high impedance first clocks), null highest order bits conversion. Once third byte been sent device, receive register will contain lowest order eight bits conversion results. Employing this method ensures simpler manipulation converted data. Figure shows same thing Mode 1,1, which requires that clock idles high state. with mode 0,0, converter outputs data falling edge clock latches data from converter rising edge clock.
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
SCLK latches data from converter rising edges SCLK
Data clocked converter falling edges SGL/ Start DIFF HI-Z NULL
Don't Care
DOUT
Start Transmitted Data (Aligned with falling edge clock) Received Data (Aligned with rising edge clock) Data stored into receive register after transmission first bits
SGL/ DIFF
(Null)
Data stored into receive register after transmission last bits
"Don't Care" Bits
Data stored into receive register after transmission second bits
FIGURE 6-1:
Communication with MCP3004/3008 using 8-bit segments (Mode 0,0: SCLK idles low).
SCLK
latches data from converter rising edges SCLK
Data clocked converter falling edges HI-Z Start Start
SGL/ DIFF
Don't Care NULL
DOUT Transmitted Data (Aligned with falling edge clock) Received Data (Aligned with rising edge clock)
SGL/ DIFF
(Null)
Data stored into receive register after transmission last bits
"Don't Care" Bits
Data stored into receive register after transmission first bits
Data stored into receive register after transmission second bits
FIGURE 6-2:
Communication with MCP3004/3008 using 8-bit segments (Mode 1,1: SCLK idles high).
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
Maintaining Minimum Clock Speed
4.096V Reference MCP1541 MCP601
When MCP3004/3008 initiates sample period, charge stored sample capacitor. When sample period complete, device converts each clock that received. important user note that slow clock rate will allow charge bleed sample capacitor while conversion taking place. 85°C (worst case condition), part will maintain proper charge sample capacitor least after sample period ended. This means that time between sample period time that data bits have been clocked must exceed (effective clock frequency kHz). Failure meet this criterion introduce linearity errors into conversion outside rated specifications. should noted that during entire conversion cycle, converter does require constant clock speed duty cycle, long timing specifications met.
MCP3004
FIGURE 6-3: MCP601 Operational Amplifier used implement second order anti-aliasing filter signal being converted MCP3004.
Layout Considerations
Buffering/Filtering Analog Inputs
signal source converter impedance source, will have buffered inaccurate conversion results occur (see Figure 4-2). also recommended that filter used eliminate signals that aliased back conversion results, illustrated Figure 6-3, where used drive, filter gain analog input MCP3004/3008. This amplifier provides impedance source converter input, plus pass filter, which eliminates unwanted high frequency noise. pass (anti-aliasing) filters designed using Microchip's free interactive FilterLabsoftware. FilterLab will calculate capacitor resistors values, well determine number poles that required application. more information filtering signals, AN699, "Anti-Aliasing Analog Filters Data Acquisition Systems".
When laying printed circuit board with analog components, care should taken reduce noise wherever possible. bypass capacitor should always used with this device should placed close possible device pin. bypass capacitor value recommended. Digital analog traces should separated much possible board, with traces running underneath device bypass capacitor. Extra precautions should taken keep traces with high frequency signals (such clock lines) possible from analog traces. analog ground plane recommended order keep ground potential same devices board. Providing connections devices "star" configuration also reduce noise eliminating return current paths associated errors (see Figure 6-4). more information layout tips when using converters, refer AN688, "Layout Tips 12-Bit Converter Applications".
Connection
Device
Device
Device Device
FIGURE 6-4: traces arranged `Star' configuration order reduce errors caused current return paths.
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
Utilizing Digital Analog Ground Pins
MCP3004/3008 devices provide both digital analog ground connections provide additional means noise reduction. shown Figure 6-5, analog digital circuitry separated internal device. This reduces noise from digital portion device being coupled into analog portion device. grounds connected internally through substrate which resistance -10. ground plane utilized, both grounds must connected board. ground plane available, both digital analog ground pins should connected analog ground plane. both analog digital ground plane available, both digital analog ground pins should connected analog ground plane. Following these steps will reduce amount digital noise from rest board being coupled into converter. MCP3004/08 Digital Side -SPI Interface -Shift Register -Control Logic Analog Side -Sample -Capacitor Array -Comparator
Substrate DGND AGND
Analog Ground Plane
FIGURE 6-5: Ground Pins.
Separation Analog Digital
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
PACKAGING INFORMATION
Package Marking Information
14-Lead PDIP (300 mil) Example:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP3004-I/P 0212027
14-Lead SOIC (150 mil)
Example:
XXXXXXXXXXX XXXXXXXXXXX YYWWNNN
MCP3004ISL XXXXXXXXXXX 0212027
14-Lead TSSOP (4.4mm)
Example:
XXXXXXXX YYWW
3004 I212
Please contact Microchip Factory B-Grade TSSOP devices
Legend:
XX.X
Customer specific information* Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code
Note:
event full Microchip part number cannot marked line, will carried over next line thus limiting number available characters customer specific information.
Standard marking consists Microchip part number, year code, week code, traceability code (facility code, mask rev#, assembly code). marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
Package Marking Information (Continued)
16-Lead PDIP (300 mil) (MCP3308) Example:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP3008-I/P 0212030
16-Lead SOIC (150 mil) (MCP3308)
Example:
XXXXXXXXXXXXX XXXXXXXXXXXXX YYWWNNN
MCP3008-I/SL XXXXXXXXXX 0212030
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
14-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane .140 .170 Molded Package Thickness .115 .145 Base Seating Plane .015 Shoulder Shoulder Width .300 .313 .325 Molded Package Width .240 .250 .260 Overall Length .740 .750 .760 Seating Plane .125 .130 .135 Lead Thickness .008 .012 .015 Upper Lead Width .045 .058 .070 Lower Lead Width .014 .018 .022 Overall Spacing .310 .370 .430 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-005
Units Dimension Limits
INCHES* .100 .155 .130
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
14-Lead Plastic Small Outline (SL) Narrow, (SOIC)
Units Dimension Limits INCHES* .050 .061 .056 .007 .236 .154 .342 .015 .033 .009 .017 MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0.20 0.23 0.36 0.42
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
.053 .052 .004 .228 .150 .337 .010 .016 .008 .014
.069 .061 .010 .244 .157 .347 .020 .050 .010 .020
1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-065
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
14-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026 .035 .004 .251 .173 .197 .024 .006 .010
.033 .002 .246 .169 .193 .020 .004 .007
.043 .037 .006 .256 .177 .201 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-087
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
16-Lead Plastic Dual In-line (PDIP)
Units Dimension Limits INCHES* .100 .140 .155 .115 .130 .015 .300 .313 .240 .250 .740 .750 .125 .130 .008 .012 .045 .058 .014 .018 .310 .370 MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 .036 0.46 7.87 9.40
Number Pins Pitch Seating Plane .170 Molded Package Thickness .145 Base Seating Plane Shoulder Shoulder Width .325 Molded Package Width .260 Overall Length .760 Seating Plane .135 Lead Thickness .015 Upper Lead Width .070 Lower Lead Width .022 Overall Spacing .430 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-017
4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/3008
16-Lead Plastic Small Outline (SL) Narrow (SOIC)
Units Dimension Limits INCHES* .050 .053 .061 .052 .057 .004 .007 .228 .237 .150 .154 .386 .390 .010 .015 .016 .033 .008 .009 .013 .017 MILLIMETERS 1.27 1.35 1.55 1.32 1.44 0.10 0.18 5.79 6.02 3.81 3.90 9.80 9.91 0.25 0.38 0.41 0.84 0.20 0.23 0.33 0.42
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
.069 .061 .010 .244 .157 .394 .020 .050 .010 .020
1.75 1.55 0.25 6.20 3.99 10.01 0.51 1.27 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-108
2002 Microchip Technology Inc.
DS21295B-page
MCP3004/3008
NOTES:
DS21295B-page
2002 Microchip Technology Inc.
MCP3004/008
ON-LINE SUPPORT
Microchip provides on-line support Microchip World Wide site. site used Microchip means make files information easily available customers. view site, user must have access Internet browser, such Netscape® Microsoft® Internet Explorer. Files also available download from site.
SYSTEMS INFORMATION UPGRADE LINE
Systems Information Upgrade Line provides system users listing latest versions Microchip's development systems software products. Plus, this line provides information customers receive most current upgrade kits.The Line Numbers are: 1-800-755-2345 U.S. most Canada, 1-480-792-7302 rest world.
Connecting Microchip Internet Site
Microchip site available following URL: www.microchip.com file transfer site available using service connect ftp://ftp.microchip.com site file transfer site provide variety services. Users download files latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles Sample Programs. variety Microchip specific business information also available, including listings Microchip sales offices, distributors factory representatives. Other data available consideration Latest Microchip Press Releases Technical Support Section with Frequently Asked Questions Design Tips Device Errata Postings Microchip Consultant Program Member Listing Links other useful sites related Microchip Products Conferences products, Development Systems, technical information more Listing seminars events
092002
2002 Microchip Technology Inc.
DS21295B-page29
MCP3004/008
READER RESPONSE
intention provide with best documentation possible ensure successful your Microchip product. wish provide your comments organization, clarity, subject matter, ways which documentation better serve you, please your comments Technical Publications Manager (480) 792-4150. Please list following information, this outline provide with your comments about this document. Technical Publications Manager Reader Response Total Pages Sent
From: Name Company Address City State Country Telephone: Application (optional): Would like reply? Device: MCP3004/008 Questions: What best features this document? Literature Number: DS21295B FAX:
does this document meet your hardware software development needs?
find organization this document easy follow? not, why?
What additions document think would enhance structure subject?
What deletions from document could made without affecting overall usefulness?
there incorrect misleading information (what where)?
would improve this document?
DS21295B-page30
2002 Microchip Technology Inc.
MCP3004/3008
PRODUCT IDENTIFICATION SYSTETo order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples:
Device: MCP3004: 4-Channel 10-Bit Serial MCP3004T: 4-Channel 10-Bit Serial (Tape Reel) MCP3008: 8-Channel 10-Bit Serial MCP3008T: 8-Channel 10-Bit Serial (Tape Reel) -40°C +85°C Converter Converter Converter Converter
MCP3004-I/P: Industrial Temperature, PDIP package. MCP3004-I/SL: Industrial Temperature, SOIC package. MCP3004-I/ST: Industrial Temperature, TSSOP package. MCP3004T-I/ST: Industrial Temperature, TSSOP package, Tape Reel. MCP3008-I/P: Industrial Temperature, PDIP package. MCP3008-I/SL: Industrial Temperature, SOIC package.
Temperature Range: Package:
Plastic (300 Body), 14-lead, 16-lead Plastic SOIC (150 Body), 14-lead, 16-lead Plastic TSSOP (4.4mm), 14-lead
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2002 Microchip Technology Inc.
DS21295B-page31
MCP3004/3008
NOTES:
DS21295B-page
2002 Microchip Technology Inc.
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, EELOQ, MPLAB, PIC, PICmicro, PICSTART MATE registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode Total Endurance trademarks Microchip Technology Incorporated U.S.A. other countries. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2002, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
Printed recycled paper.
Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2002 Microchip Technology Inc.
DS21295B page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Address: http://www.microchip.com
ASIA/PACIFIC
Australia
Microchip Technology Australia Suite Rawson Street Epping 2121, Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Japan
Microchip Technology Japan K.K. Benex 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Rocky Mountain
2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338
China Beijing
Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit Bldg. Chaoyangmen Beidajie Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934
Atlanta
Sugar Mill Road, Suite 200B Atlanta, 30350 Tel: 770-640-0034 Fax: 770-640-0307
Singapore
Microchip Technology Singapore Ltd. Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
Boston
Drive, Suite Westford, 01886 Tel: 978-692-3848 Fax: 978-692-3821
China Chengdu
Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office 2401, 24th Floor, Ming Xing Financial Tower TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599
Taiwan
Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, Tung North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
Pierce Road, Suite Itasca, 60143 Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite Addison, 75001 Tel: 972-818-7423 Fax: 972-818-2924
China Fuzhou
Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
Detroit
Tri-Atria Office Building 32255 Northwestern Highway, Suite Farmington Hills, 48334 Tel: 248-538-2250 Fax: 248-538-2260
EUROPE
Austria
Microchip Technology Austria GmbH Durisolstrasse A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
China Shanghai
Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. East International Plaza Xian Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
2767 Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387
Denmark
Microchip Technology Nordic Regus Business Centre Lautrup Ballerup DK-2750 Denmark Tel: 4420 9895 Fax: 4420 9910
Angeles
18201 Karman, Suite 1090 Irvine, 92612 Tel: 949-263-1888 Fax: 949-263-1338
China Shenzhen
Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office 1315, 13/F, Shenzhen Kerry Centre, Renminnan Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086
York
Motor Parkway, Suite Hauppauge, 11788 Tel: 631-273-5305 Fax: 631-273-5335
France
Microchip Technology SARL Parc d'Activite Moulin Massy Saule Trapu Batiment Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Jose
Microchip Technology Inc. 2107 North First Street, Suite Jose, 95131 Tel: 408-436-7950 Fax: 408-436-7955
China Hong Kong
Microchip Technology Hongkong Ltd. Unit 901-6, Tower Metroplaza Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
Germany
Microchip Technology GmbH Steinheilstrasse D-85737 Ismaning, Germany Tel: 49-89-627-144 Fax: 49-89-627-144-44
Toronto
6285 Northam Drive, Suite Mississauga, Ontario 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc. India Liaison Office Divyasree Chambers Floor, Wing (A3/A4) O'Shaugnessey Road Bangalore, 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
Italy
Microchip Technology Centro Direzionale Colleoni Palazzo Taurus Colleoni 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd. Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 Tel: 5869 Fax: 44-118 921-5820
08/01/02
DS21295B-page
2002 Microchip Technology Inc.
Other recent searches
SP6641B-5V - SP6641B-5V SP6641B-5V Datasheet
S3C4 - S3C4 S3C4 Datasheet
GSC2128 - GSC2128 GSC2128 Datasheet
CNY70 - CNY70 CNY70 Datasheet
ATS640JSB - ATS640JSB ATS640JSB Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
