OM6213 pixels matrix driver Product specification File under Inte

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OM6213 pixels matrix driver
Product specification File under Integrated Circuits, IC17 2001
Philips Semiconductors
Product specification
pixels matrix driver
CONTENTS 7.10 7.11 7.12 7.13 10.1 11.1 11.2 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONS driver outputs column driver outputs VSS1 VSS2: negative power supply rails VDD1 VDD3: positive power supply rails VLCDOUT, VLCDIN VLCDSENSE: power supplies VOS0 VOS4 test pads SDIN: serial data line SCLK: serial clock line D/C: mode select SCE: chip enable OSC: oscillator RES: reset BLOCK DIAGRAM FUNCTIONS Oscillator Address counter (AC) Display Data (DDRAM) Timing generator Display address counter column drivers VLCD generator INITIALIZATION ADDRESSING Data structure INSTRUCTIONS Reset function Function 11.2.1 11.2.2 11.2.3 11.3 11.3.1 11.4 11.5 11.6 11.7 11.8 20.1 20.2 20.3 20.4 20.5 20.6 20.7 Display Control address address Temperature Control Bias value: VLCD generator
OM6213
TEMPERATURE COMPENSATION LIMITING VALUES HANDLING CHARACTERISTICS CHARACTERISTICS SERIAL INTERFACE RESET APPLICATION INFORMATION MODULE MAKER PROGRAMMING VLCD calibration Charge pump multiplication factor Bias system selected when BS[2:0] VLCD temperature coefficient selected when TC[1:0] (TC1) Seal Module Maker parameter programming Example VLCD calibration flow CHIP INFORMATION BONDING LOCATIONS DEVICE PROTECTION DIAGRAM TRAY INFORMATION DEFINITIONS LIFE SUPPORT APPLICATIONS
2001
Philips Semiconductors
Product specification
pixels matrix driver
FEATURES APPLICATIONS
OM6213
Single-chip controller/driver row, column outputs Display data bits On-chip: Generation supply voltage (external supply also possible) Generation intermediate bias voltages Oscillator requires external components (external clock also possible). External reset (RES) input Serial interface maximum Mbit/s CMOS compatible inputs rate: Logic supply voltage range VDD1 VSS: Supply voltage range high voltage part VDD2 VSS: Display supply voltage range VLCD VSS: power consumption (typically µA), suitable battery operated systems Temperature compensation VLCD Temperature range: Tamb Module Maker programmable parameters. ORDERING INFORMATION
Telecommunications equipment. GENERAL DESCRIPTION
OM6213 power CMOS controller driver, designed drive graphic display rows columns. necessary functions display provided single chip, including on-chip generation supply bias voltages, resulting minimum external components power consumption. OM6213 interfaces microcontrollers serial interface.
PACKAGE TYPE NUMBER NAME OM6213U TRAY chip with bumps tray DESCRIPTION VERSION
2001
Philips Semiconductors
Product specification
pixels matrix driver
BLOCK DIAGRAM
OM6213
handbook, full pagewidth
VDD1
VDD2
VDD3
COLUMN DRIVERS
DRIVERS
VLCDIN
BIAS VOLTAGE GENERATOR DATA LATCHES
SHIFT REGISTER
VLCDSENSE VLCDOUT VSS1 VSS2 [4:0]
VLCD GENERATOR
RESET DISPLAY DATA (DDRAM) bits
OSCILLATOR
TIMING GENERATOR ADDRESS COUNTER DISPLAY ADDRESS COUNTER
DATA REGISTER
OM6213
BUFFER
MGT840
SDIN
SCLK
Fig.1 Block diagram.
2001
Philips Semiconductors
Product specification
pixels matrix driver
PINNING SYMBOL VOS4 VOS3 VOS2 VOS1 VOS0 VDD1 VDD3 VDD2 SCLK SDIN VSS2 VSS1 DESCRIPTION VLCD offset input VLCD offset input VLCD offset input VLCD offset input VLCD offset input supply voltage supply voltage supply voltage serial clock input test alternative HV-gen programming input serial data input HV-gen programming input data/command input chip enable input (active LOW) oscillator input ground test input test input test output ground VLCDOUT VLCDSENSE
OM6213
SYMBOL VLCDIN
DESCRIPTION test output test output test output VLCD supply voltage input HV-gen programming input VLCD generator output VLCD generator regulation input reset input (active LOW) driver outputs
driver outputs column driver outputs driver outputs driver outputs dummy pads
FUNCTIONS driver outputs
VLCDOUT, VLCDIN VLCDSENSE: power supplies
These pads output signals. column driver outputs
These pads output column signals. VSS1 VSS2: negative power supply rails
internal VLCD generator used, then pins must connected together. (the internal VLCD generator disabled external voltage supplied VLCDIN), VLCDOUT must left open-circuit VLCDSENSE must connected VLCDIN. must logic switch-off charge pump external VLCD generator used. VLCDIN also used HV-gen programming. VOS0 VOS4
VSS1 VSS2 must connected together, jointly referred VSS. When connected externally VSS, VSS1 should used. VDD1 VDD3: positive power supply rails
VDD1 provides logic supply. VDD2 VDD3 provide analog supply; jointly referred VDD2. VDD2 VDD3 must connected together.
Five input pins on-glass VLCD offset. Each must connected VSS1, which corresponds logic VDD1, which corresponds logic five pins define 5-bit two's complement number ranging from decimal (from 10000 01111). default value, with pins connected VSS1, decimal (00000). register refreshed each bias system command when exiting Power-down mode.
2001
Philips Semiconductors
Product specification
pixels matrix driver
test pads Display Data (DDRAM)
OM6213
application, must connected VSS. must left open-circuit. SDIN: serial data line
Data line HV-gen programming input. SCLK: serial clock line
OM6213 contains static which stores display data. divided into banks bytes bits). During access, data transferred serial interface. There direct correspondence between address column output number. Timing generator
Input clock signal. Mbits/s. 7.10 D/C: mode select
timing generator produces various signals required drive internal circuitry. Internal chip operation affected operations data bus. Display address counter
Input select either command/address data input. 7.11 SCE: chip enable display generated continuously shifting rows data matrix column outputs. display status (all dots on/off normal/inverse video) bits command `Display control' (see Table column drivers
enable allows data clocked this signal active LOW. 7.12 OSC: oscillator
on-chip oscillator used, this input must connected VDD1. external clock used, must connected OSC. left VSS1, internal clock disabled, device clocked display left state. avoid this, advisable enter Power-down mode before stopping clock. 7.13 RES: reset
OM6213 contains rows column drivers, which connect appropriate bias voltages sequence display accordance with data displayed. Figure shows typical waveforms. Unused outputs should left unconnected. VLCD generator
This signal will reset device must applied properly initialize chip; this signal active LOW. BLOCK DIAGRAM FUNCTIONS Oscillator
voltage multiplier (i.e. charge pump) generates VLCD voltage. multiplication factor Module Maker programmable (default value
on-chip oscillator provides clock signal display system. external components required input must connected VDD1. external clock signal used, must connected OSC. Address counter (AC)
address counter assigns addresses display data writing. address X[6:0] address Y[2:0] separately. After write operation address counter automatically incremented according flag.
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
frame
VLCD VSS1 VLCD VSS1 VLCD VSS1 VLCD VSS1
frame Vstate1(t) Vstate2
VLCD VSS1 VLCD VSS1 VLCD VLCD VLCD VSS1 VLCD VSS1 VLCD VLCD
Vstate1(t)
Vstate2
MGT841
Vstate1(t) C1(t) R0(t) Vstate2(t) C1(t) R1(t) Fig.2 Typical driver waveforms.
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
DDRAM
bank
bank
bank
bank
bank
bank
MGT842
Fig.3 DDRAM display mapping.
2001
Philips Semiconductors
Product specification
pixels matrix driver
INITIALIZATION
OM6213
address ranges are: (1010011) (101). Addresses outside these ranges allowed. vertical addressing mode address increments after each byte (see Fig.5). After last address wraps around increments address next column. horizontal addressing mode address increments after each byte; Fig.6. After last address wraps around increments address next row. After very last address address pointers wrap around address
Immediately following power-on, internal registers content undefined. reset (RES) pulse must applied. should noted that device damaged properly reset. Reset accomplished applying external pulse (active LOW) RES. When reset occurs within specified time, internal registers reset, however still undefined. state after reset described Section "Reset function". input must 0.3VDD1 after VDD1 reaches VDD(min) higher) according tVHRL timing (see Fig.16). ADDRESSING Data downloaded bytes into matrix OM6213 indicated Figs.3, display matrix bits. columns addressed address pointer. 10.1 Data structure
handbook, full pagewidth
address address
MGT843
Fig.4 format, addressing.
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
handbook, full pagewidth
address
address
MGT844
Fig.5 Sequence writing data bytes into with vertical addressing
handbook, full pagewidth
address
address
MGT845
Fig.6 Sequence writing data bytes into with horizontal addressing
2001
Philips Semiconductors
Product specification
pixels matrix driver
INSTRUCTIONS instruction format divided into modes. (mode select) current byte interpreted command byte (see Table HIGH following bytes stored DDRAM. After every data byte address counter incremented automatically. level signal read during last data byte. Instructions sent order OM6213 (the exception being that temperature control command must followed least byte data command). transmitted first (see Fig.7). Figure shows example command stream, used set-up driver. serial interface initialized when HIGH. this state SCLK clock pulses have effect power consumed serial interface. negative edge enables serial interface indicates start data transmission. Figures show serial protocol.
OM6213
When HIGH, SCLK clocks ignored. During HIGH time serial interface initialized (see Fig.11). SDIN sampled positive edge SCLK indicates whether byte command (D/C data (D/C read with eighth SCLK pulse. stays after last command/data byte, serial interface expects next byte next rising edge SCLK (see Fig.11) reset pulse with interrupts transmission. data being written into corrupted. registers cleared. after rising edge RES, serial interface ready receive command/data byte (see Fig.12). Instructions (except temperature control command) executed SCLK positive edge which latches temperature control command executed SCLK positive edge which latches next command next write DDRAM (whichever occurs first).This command requires bytes executed.
handbook, halfpage (DB7) data
(DB0) data
MGT639
Fig.7 General format data stream.
handbook, full pagewidth
function
bias system
temperature control
function
display control
address
address
MGT846
Fig.8 Serial data stream, example.
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
handbook, full pagewidth
SCLK
SDIN
MGT641
Fig.9 Serial protocol; transmission byte.
handbook, full pagewidth
SCLK
SDIN
MGT642
Fig.10 Serial protocol; transmission several bytes.
handbook, full pagewidth
SCLK
SDIN
MGT643
Fig.11 Serial reset function (SCE).
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
handbook, full pagewidth
SCLK
SDIN
MGT644
Fig.12 Serial reset function (RES).
Table Instruction set; note Table Instructions expressly defined Table reserved instructions must used application. INSTRUCTION
Function Write data
COMMAND BYTE
DESCRIPTION
operation Power-down control; entry mode; extended instruction control writes data display RAM.
Reserved Reserved Display control Reserved address address RAM. reserved reserved sets display configuration reserved sets address RAM; Sets address part RAM; reserved temperature coefficient (TCx) reserved bias system (BSx) reserved write register
Reserved Temperature control Reserved Bias system Reserved
VPR6 VPR5 VPR4 VPR3
VPR2 VPR1 VPR0
Note don't care.
2001
Philips Semiconductors
Product specification
pixels matrix driver
Table Explanations symbols Table LOGIC chip active horizontal addressing basic instruction display blank normal mode display segments inverse video mode VLCD temperature coefficient Module Maker defined; VLCD temperature coefficient VLCD temperature coefficient VLCD temperature coefficient 11.2.3 LOGIC
OM6213
chip Power-down mode vertical addressing extended instruction
(TC0) (TC1) (TC2) (TC3)
11.1
Reset function
After reset driver following state: Power-down mode Horizontal addressing normal instruction Display blank Address counter X[6:0] Y[2:0] Temperature control mode (TC[1:0] TC0, TCA) Bias system (BS[2:0] VLCD equal HV-generator switched (VPR[6:0] After power-on, data undefined Oscillator (external clock operation possible). 11.2 11.2.1 Function
When commands `display control', `set address' `set address' performed, when others executed. commands `write data' `function set' executed both cases. 11.3 11.3.1 Display Control
bits select display mode (see Table 11.4 address
defines address vector address display RAM; Table Table 11.5 address range CONTENT bank bank bank bank bank bank
outputs VSS1 (display off) Bias generator VLCD generator off, VLCD disconnected Oscillator Serial bus, command, etc. function contents cleared; data written.
address
11.2.2
When horizontal addressing selected. data written into DDRAM shown Fig.6. When vertical addressing selected. data written into DDRAM shown Fig.5.
address points columns. range (53H). 11.6 Temperature Control
temperature coefficient VLCD selected bits TC0.
2001
Philips Semiconductors
Product specification
pixels matrix driver
11.7 Bias value
OM6213
bias voltage levels ratio giving bias system. Different multiplex rates require different factors (see Table This programmed BS[2:0]. optimum bias value given Table 3.928 resulting bias.
Programming required bias system BIAS SYSTEM
RECOMMENDED RATE
Module Maker programmable (see Table
Table
bias voltage SYMBOL
18/1 10/1
BIAS VOLTAGE BIAS SYSTEM VLCD
VLCD VLCD VLCD VLCD
2001
Philips Semiconductors
Product specification
pixels matrix driver
11.8 VLCD generator
OM6213
generated voltage VLCD dependent temperature, programmed temperature coefficient (TC) programmed voltage reference temperature (TCUT). TCUT, each temperature coefficient given Table maximum voltage that generated dependent voltage VDD2 display load current. programming range internally generated VLCD allows values above maximum allowed VLCD, user ensure while setting register selecting Temperature Compensation (TC), that under conditions including tolerances VLCD limit maximum will never exceeded. particular liquid, optimum VLCD calculated given multiplex rate. rate optimum operating voltage liquid calculated follows; 6.06
binary number representing operating voltage serial interface command adjusted (calibrated) input pins according following formulae: where: 8-bit unsigned number used internally generation supply voltage VLCD 5-bit two's complement number input pins VOS[4:0]; Table VCAL 5-bit two's complement number Module Maker; Table 7-bit unsigned number serial interface command. avoid numerical overflow allowed values should limited range VPR(min) VPR(max) (decimal). corresponding voltage reference temperature, TCUT, calculated Tcut
where threshold voltage liquid crystal used. Table Typical values parameters generator programming 3.06 30.3 6.04 10.77 3.84 24.3 -0.87 4.81 8.74 3.62 26.1 -0.58 5.18 9.35 3.37 28.0 -0.29 5.56 10.11 UNIT 10-3/°C decimal decimal
SYMBOL TCUT VPR(min) VPR(max) VLCD(min) VLCD(max)
VLCD(min) values values corresponding VPR(min). VLCD(max) values theoretical values corresponding VPR(max). Under conditions including tolerances VLCD must never exceed Example: (decimal) selected. temperature TCUT measured VLCD user wants decrease VLCD order VLCD best value then decimal (11100 binary two's complement notation). VPR[6:0] zero, charge pump turned off.
2001
Philips Semiconductors
Product specification
pixels matrix driver
Table VCAL values two's complement notation DECIMAL BINARY 00000 00001 00010 00011 00100 00101 00110 00111 01000 01001 01010 01011 01100 01101 01110 01111
OM6213
DECIMAL
BINARY 11111 11110 11101 11100 11011 11010 11001 11000 10111 10110 10101 10100 10011 10010 10001 10000
handbook, full pagewidth
MGT847
programming (00H FFH). Depending restrictions defined Table depending VCAL, VOP[7:0] selected. charge pump turned VLCD external VLCD supply provided.
Fig.13 VLCD programming OM6213.
2001
Philips Semiconductors
Product specification
pixels matrix driver
TEMPERATURE COMPENSATION
OM6213
temperature dependency liquid crystal viscosity, controlling voltage VLCD must increased with lower temperature maintain optimum contrast. Figure shows VLCD high multiplex rates. OM6213 temperature coefficient VLCD selected from values (see Table setting bits TC[1:0].
handbook, full pagewidth
MGT848
VLCD
Fig.14 VLCD function liquid crystal temperature (typical values).
LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 60134); notes SYMBOL VDD1 VDD2,3 VLCD Ptot Pout Tamb Tjun Tstg Notes Stresses above those listed under Limiting Values cause permanent damage device. Parameters valid over operating temperature range unless otherwise specified. voltages referenced VSS1 unless otherwise noted. HANDLING Inputs outputs protected against electrostatic discharge normal handling. However, totally safe, desirable take normal precautions appropriate handling devices (see "Handling devices"). PARAMETER logic supply voltage high supply voltage supply voltage input voltages ground supply current input output current total power dissipation power dissipation output ambient temperature junction temperature storage temperature -0.5 -0.5 -0.5 -0.5 MIN. +6.5 +6.5 VDD1 +150 +150 MAX. UNIT
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
CHARACTERISTICS VDD1 VDD2 VLCD Tamb unless otherwise specified. SYMBOL VDD1 VDD2,3 VLCD IDD1 PARAMETER logic supply voltage high supply voltage supply voltage total (VDD1 VDD2 VDD3) supply current note normal mode; VDD1 VDD2 VDD3 2.85 VLCD booster device); fSCLK Tamb display load 10µA; inputs VDD1 VSS, bias system 1/7; note Power-down mode; with internal external supply voltage; inputs VDD1 VSS; note VDD1 VDD2 VDD3 2.85 VLCD fSCLK Tamb display load inputs VDD1 VSS; bias system 1/7; notes VDD1 VDD2 VDD3 2.85 VLCD fSCLK Tamb display load inputs VDD1 VSS; bias system 1/7; notes CONDITIONS MIN. TYP. MAX. UNIT
IDD2
supply current
IDD3
supply current external VLCD
ILCDIN
supply current from external VLCD
Logic Ro(col) Ro(row) Vbias(col) Vbias(row) LOW-level input voltage HIGH-level input voltage input leakage current VDD1 note note 0.7VDD1 -100 -100 0.3VDD1 VDD1
Column outputs column output resistance COL0 COL83 output resistance ROW0 ROW47 bias tolerance COL0 COL83 bias tolerance ROW0 ROW47 VLCD tolerance internally generated note +100 +100
supply voltage generator VLCD(tol)
2001
Philips Semiconductors
Product specification
pixels matrix driver
Notes characteristics
OM6213
maximum possible VLCD voltage that generated dependent voltage, temperature (display) load. Internal clock. Power-down mode: during Power-down static currents switched off. external VLCD, display load current transmitted IDD. VLCD external voltage applied VLCDIN VLCDSENSE inputs; VLCDOUT disconnected. must switch-off charge pump. Load current outputs tested time. Valid values temperature, used calibration. CHARACTERISTICS VDD1 VDD2 VLCD Tamb unless otherwise specified. SYMBOL fclk(ext) fframe tVHRL tR(op) PARAMETER external clock frequency frame frequency reset pulse set-up time after power-on reset pulse width reset pulse interface being operational VDD1 ±10%; signal timing based maximum rise fall time internal oscillator; note notes Fig.16 Fig.16 CONDITIONS MIN. 30.9 TYP. 34.3 MAX. 37.7 1000 UNIT
Serial timing characteristics fSCLK clock frequency 4.00
Tcy(SCLK) tPWH1 tPWL1 tPWH2 Notes
clock cycle time SCLK SCLK pulse width HIGH SCLK pulse width set-up time hold time minimum HIGH time start hold time set-up time hold time SDIN set-up time SDIN hold time note
tframe fclk(ext)/490. before goes HIGH (see Fig.16). This recommended. Decoupling capacitor VLCD/VSS1 (higher capacitor size increases tVHRL higher VDD1,2,3 reduces tVHRL). time from previous SCLK positive edge (irrespective state SCE) negative edge (see Fig.15).
2001
Philips Semiconductors
Product specification
pixels matrix driver
SERIAL INTERFACE
OM6213
handbook, full pagewidth
PWH2
cy(SCLK) PWL1 SCLK PWH1
SDIN
MGT849
Fig.15 Serial interface timing.
RESET
handbook, full pagewidth
VDD1
VDD1 VHRL R(op)
MGT850
Fig.16 Reset timing.
2001
Philips Semiconductors
Product specification
pixels matrix driver
APPLICATION INFORMATION Table STEP Start Example OM6213 operation SERIAL BYTE DISPLAY
OM6213
OPERATION going function set; select extended instruction mode) VPR; function set; select normal instruction mode) display control; normal mode data write; initialized default, they here
MGS405
data write
MGS406
data write
MGS407
data write
MGS407
data write
MGS408
data write
MGS409
data write
MGS410
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
SERIAL BYTE STEP display control; inverse video mode
MGS412
DISPLAY
OPERATION
address RAM; address 0000000
MGS412
data write
MGS414
pinning OM6213 optimized single plane wiring e.g. chip-on-glass display modules. Display size: pixels.
handbook, full pagewidth
DISPLAY
OM6213
Cext VLCD
MGT851
Fig.17 Application diagram.
required minimum value external capacitors application with OM6213 are: Cext (min.) VLCD1,2/VSS1,2, Cext (min.) VLCD1,2,3/VSS1,2 Higher capacitor values recommended ripple reduction.
2001
Philips Semiconductors
Product specification
pixels matrix driver
Module Maker programming OM6213 features five Module Maker programmable parameters: VLCD calibration Charge pump multiplication factor Bias system selected when BS[2:0] VLCD temperature coefficient selected when TC[1:0] (TC1) Seal bit. Used select default parameters Module Maker programmable parameters. Once set: seal cannot reset Module Maker programmable parameters cannot changed Module Maker programmable parameters selected default parameters deselected. 20.1 VLCD calibration
OM6213
first parameter calibrates VLCD voltage. 5-bit code (VCAL[4:0]) used this parameter. code implemented two's complement notation giving rise positive negative offset register. VLCD calibration used together with VLCD offset (performed connecting VOS[4:0] pads either VSS1 VDD1). values must always within ranges specified Table
VLCD calculated from equations (6): parameters defined Table example correspondence between VCAL code relative VLCD calibration shown Table where assumed 24.3 (TCB, temperature coefficient assumed
handbook, full pagewidth
VLCD offset: 5-bit signed value [4:0] VLCD calibration: 5-bit signed value VCAL [4:0]
high voltage generator
register: 7-bit unsigned value [6:0]
+127
MGT852
Fig.18 VLCD offset calibration
2001
Philips Semiconductors
Product specification
pixels matrix driver
Table VCAL codes associated nominal calibration voltage (TCB, VCAL VLCD CALIBRATION (mV) (TCB, (default) +24.3 +48.6 +72.9 +97.2 +121.5 +145.8 +170.1 +194.4 +218.7 +243 +267.3 +291.6 +315.9 +340.2 +364.5 -24.3 -48.6 -72.9 -97.2 -121.5 -145.8 -170.1 -194.4 -218.7 -243 -267.3 -291.6 -315.9 -340.2 -364.5 -388.8 (TC2) (TC3) 20.4 20.3
OM6213
Table Charge pump multiplication factor definition MULTIPLICATION FACTOR (default)
VCAL[4:0] 00000 00001 00010 00011 00100 00101 00110 00111 01000 01001 01010 01011 01100 01101 01110 01111 11111 11110 11101 11100 11011 11010 11001 11000 10111 10110 10101 10100 10011 10010 10001 10000 20.2
Bias system selected when BS[2:0]
third parameter defines bias system selected when BS[2:0] 100. 1-bit code (BS100) used this parameter. Table Bias system selected when BS[2:0] definition
BIAS SYSTEM (default)
VLCD temperature coefficient selected when TC[1:0] (TC1)
fourth parameter defines VLCD temperature coefficient selected when TC[1:0] (TC1). defined using code (TCx[1:0]). Table VLCD temperature coefficient TC[1:0] (TC0) (TC1) TC1[1:0] VLCD TEMPERATURE COEFFICIENT (default)
Charge pump multiplication factor
second parameter defines charge pump multiplication factor. 1-bit code (MF) used this parameter.
2001
Philips Semiconductors
Product specification
pixels matrix driver
20.5 Seal
OM6213
seal selects between default parameters Module Maker programmed parameters. seal prevents further changes Module Maker programmable parameters. 1-bit code (SB) used this parameter. seal bit, once cannot reset Table Seal definition 20.6 defaults Module Maker programmable PARAMETERS MODULE MAKER PROGRAMMABLE PARAMETERS programming possible programming prevented
Module Maker parameter programming
Module Maker programmable parameters stored non-volatile cells. Table Non-volatile cell list CELL[9:0] DESCRIPTION VCAL[4] VCAL[3] VCAL[2] VCAL[1] VCAL[0] BS100 TC1[1] TC1[0]
unprogrammed cell contains programmed cell contains OM6213 dice shipped Module Maker with cells unprogrammed (containing unprogrammed cell programmed using described procedure. programmed cell cannot unprogrammed
2001
Philips Semiconductors
Product specification
pixels matrix driver
Table Module Maker parameters programming procedure COMMAND BYTE STEP Notes Programming voltages applied pins SDIN VLCDIN. CELL[9] CELL[8] CELL[7] CELL[6] CELL[5] CELL[4] CELL[3] CELL[2] CELL[1] CELL[0] switch power reset device (RES pulse) ACTION
OM6213
exit Power-down instruction wait enter Power-down enter programming mode specify CELL[9] (VCAL[4]) specify CELL[8] (VCAL[3]) specify CELL[7] (VCAL[2]) specify CELL[6] (VCAL[1]) specify CELL[5] (VCAL[0]) specify CELL[4] (MF) specify CELL[3] (BS100) specify CELL[2] (TC1[1]) specify CELL[1] (TC1[0]) specify CELL[0] (SB) apply programming waveforms back step other cells need programmed (see note exit programming mode switch power
possible program only cell time. When applying programming waveforms, cells (except being programmed) should also example note seal (SB) must last programmed, since further programming possible when seal unprogrammed defaults (and Module Maker programmed parameters) taken into account. Example: device programmed charge pump with multiplication factor equal (initial state final state Execute steps CELL[9:0] 0000010000 (steps 16). Apply programming waveforms (step 17): cell programmed back step CELL[9:0] 0000000001 (steps 16). Apply programming waveforms (step 17): cell programmed Execute steps Programming waveforms MUST only applied step
2001
Philips Semiconductors
Product specification
pixels matrix driver
Table Programming parameters SYMBOL VSDIN PARAMETER CONDITION MIN. TYP. 11.5
OM6213
MAX. VDD1
UNIT
voltage applied SDIN relative notes VSS1 programming active programming inactive
VLCDIN
voltage applied VLCDIN relative VSS1
notes programming active programming inactive VDD2 1000
ILCDIN ISDIN Tamb(prog) tsu;SCLK th;SCLK tsu;SDIN th;SDIN Notes
current drawn VLCDIN during programming current drawn VSDIN during programming ambient temperature during programming set-up internal data after last clock hold internal data before next clock set-up VSDIN prior programming hold VSDIN after programming pulse width programming voltage
when programming single
voltage drop across track zebra connector must taken into account guarantee sufficient voltage chip pins. high voltage generator must disabled (VPR when VLCDIN being driven. Maximum voltage must never exceeded (even short time). Care must taken when applying programming waveforms order avoid overshoots.
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
handbook, full pagewidth
su;SCLK
h;SCLK
SCLK
SDIN su;SDIN h;SDIN
VLCDIN
MGT853
Fig.19 Programming waveforms.
20.7
Example VLCD calibration flow
following tables examples flow calibrate VLCD. Table VLCD calibration flow COMMAND BYTE STEP VPR6 VPR5 VPR4 VPR3 VPR2 VPR1 VPR0 switch power reset device (RES pulse) configure device fill DDRAM without switching charge pump exit Power-down instruction wait switch charge pump measure VLCD switch charge pump switch power calculate VCAL[4:0] with look-up tables store VCAL[4:0] programming later ACTION
2001
Philips Semiconductors
Product specification
pixels matrix driver
Table VLCD calibration flow COMMAND BYTE STEP switch power ACTION
OM6213
reset device (RES pulse) configure device fill DDRAM without switching charge pump exit Power-down instruction wait enter programming mode CELL[9] specify CELL[9] (VCAL[4]) CELL[8] specify CELL[8] (VCAL[3]) CELL[7] specify CELL[7] (VCAL[2]) CELL[6] specify CELL[6] (VCAL[1]) CELL[5] specify CELL[5] (VCAL[0]) CELL[4] specify CELL[4] (MF) CELL[3] specify CELL[3] (BS100) CELL[2] specify CELL[2] (TC1[1]) CELL[1] specify CELL[1] (TC1[0]) VPR0 specify CELL[0] instruction (exit programming mode) switch charge pump measure VLCD switch charge pump VLCD correct, back step different VCAL[4:0] switch power store VCAL[4:0] programming later
VPR6 VPR5 VPR4 VPR3 VPR2 VPR1
2001
Philips Semiconductors
Product specification
pixels matrix driver
CHIP INFORMATION OM6213 manufactured n-well CMOS technology. BONDING INFORMATION Table Bonding information NAME pitch size, aluminium opening Bump dimensions Wafer thickness (excluding bumps) ROW/COL SIDE (min.) (min.) (min.) 17.5 (±5) (min.) (±25)
OM6213
INTERFACE SIDE (min.) (min.) (min.) 17.5 (±5) (min.)
handbook, halfpage
9.11
handbook, halfpage
1.78
OM6213
center
pitch
center
MGT855
MGT854
Fig.20 Bonding pads.
Fig.21 Shape alignment mark (100 diameter).
2001
Philips Semiconductors
Product specification
pixels matrix driver
BONDING LOCATION Table Bonding location co-ordinates referenced centre chip (dimensions seeFig.22). COORDINATES SYMBOL Dummy Alignment VOS4 VOS3 VOS2 VOS1 VOS0 Dummy Dummy Dummy Dummy Dummy VDD1 VDD1 VDD1 VDD1 VDD1 VDD1 VDD3 VDD3 VDD3 VDD3 VDD2 VDD2 VDD2 VDD2 VDD2 VDD2 VDD2 VDD2 SCLK SDIN 2001 -820 -810 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 +4505 +4385 +4240 +4030 +3680 +3470 +3120 +2700 +2420 +2350 +2280 +2210 +2140 +2070 +2000 +1930 +1860 +1790 +1720 +1650 +1580 +1510 +1440 +1370 +1300 +1230 +1160 +1090 +1020 +950 +880 +670 +600 +530 +460 +390 SYMBOL SDIN SDIN SDIN VSS2 VSS2 VSS2 VSS2 VSS2 VSS2 VSS2 VSS2 VSS1 VSS1 VSS1 VSS1 VSS1 VSS1 VSS1 VSS1 VLCDIN VLCDIN VLCDIN VLCDIN VLCDIN VLCDIN VLCDOUT VLCDOUT VLCDOUT VLCDOUT VLCDOUT -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820 -820
OM6213
COORDINATES +320 +250 +180 +110 -100 -310 -520 -590 -660 -730 -800 -870 -940 -1010 -1080 -1290 -1500 -1710 -1780 -1850 -1920 -1990 -2060 -2130 -2200 -2410 -2620 -2830 -3180 -3250 -3320 -3390 -3460 -3530 -3600 -3670 -3740 -3810 -3880
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
COORDINATES SYMBOL VLCDOUT VLCDOUT VLCDSEN Alignment Dummy Dummy Dummy Dummy Dummy Dummy Dummy Dummy -820 -820 -820 -820 -810 -820 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 -3950 -4020 -4090 -4160 -4400 -4505 -4495 -4435 -4375 -4315 -4255 -4195 -4135 -3955 -3895 -3835 -3775 -3715 -3655 -3595 -3535 -3475 -3415 -3355 -3295 -3235 -3175 -3115 -3055 -2995 -2935 -2875 -2815 -2755 -2695 -2635 -2575 -2395 -2335 SYMBOL
COORDINATES +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 -2275 -2215 -2155 -2095 -2035 -1975 -1915 -1855 -1795 -1735 -1675 -1615 -1555 -1495 -1435 -1375 -1315 -1255 -1195 -1135 -1075 -1015 -955 -895 -835 -775 -595 -535 -475 -415 -355 -295 -235 -175 -115 +125
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
COORDINATES SYMBOL +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +185 +245 +305 +365 +425 +485 +545 +605 +665 +725 +785 +845 +905 +965 +1025 +1205 +1265 +1325 +1385 +1445 +1505 +1565 +1625 +1685 +1745 +1805 +1865 +1925 +1985 +2045 +2105 +2165 +2225 +2285 +2345 Dummy Dummy SYMBOL
COORDINATES +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +825 +2405 +2465 +2525 +2585 +2645 +2705 +2765 +2825 +3005 +3065 +3125 +3185 +3245 +3305 +3365 +3425 +3485 +3545 +3605 +3665 +3725 +3785 +3845 +3905 +3965 +4025 +4085 +4145 +4205 +4265 +4325 +4385 +4445 +4505
2001
Philips Semiconductors
Product specification
pixels matrix driver
OM6213
dummy alignment mark VOS4 VOS3 VOS2 VOS1 VOS0
dummy
dummy dummy VDD1 VDD3
VDD2 SCLK SDIN
VSS1
VLCDOUT VLCDSEN alignment mark dummy
MGT856
dummy
Fig.22 locations.
2001
VLCDIN
VSS2
OM6213
Philips Semiconductors
Product specification
pixels matrix driver
DEVICE PROTECTION DIAGRAM
OM6213
handbook, full pagewidth
VDD1
VDD2
VDD3
VSS1
VSS1 VSS2
VSS1
VSS2
VLCDIN, VLCDSENSE VSS1
VLCDOUT
VSS1
VSS1
VDD1
VLCDIN
VSS1
VSS1
VDD1
SDIN,
OSC, SCLK, SCE, RES, D/C, [4:0] VSS1
VSS1
MGT858
conditions continuity test follows: Maximum forward current Maximum reverse voltage
Fig.23 Device protection diagram.
2001
Philips Semiconductors
Product specification
pixels matrix driver
TRAY INFORMATION
handbook, full pagewidth
OM6213
,,,,,,, ,,,,,,,
SECTION
MGT651
Fig.24 Tray details.
Table Tray dimensions DIMENSION DESCRIPTION pocket pitch, direction pocket pitch, direction pocket width, direction pocket width, direction tray width, direction tray width, direction distance from corner pocket centre distance from corner pocket centre tray thickness tray cross section tray cross section pocket depth number pockets direction number pockets direction VALUE 14.45 3.76 9.31 1.98 50.8 50.8 10.95 4.72 3.96 1.78 2.44 0.89
handbook, halfpage
MGT857
orientation pocket indicated position type name surface with respect chamfer upper left corner tray. Refer bonding location diagram orientating position type name surface.
OM6213-1
Fig.25 Tray alignment.
2001
Philips Semiconductors
Product specification
pixels matrix driver
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
OM6213
This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice. This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product. This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Changes will communicated according Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes Please consult most recently issued data sheet before initiating completing design. product status device(s) described this data sheet have changed since this data sheet published. latest information available Internet DEFINITIONS Short-form specification data short-form specification extracted from full data sheet with same type number title. detailed information relevant data sheet data handbook. Limiting values definition Limiting values given accordance with Absolute Maximum Rating System (IEC 60134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Applications that described herein these products illustrative purposes only. Philips Semiconductors make representation warranty that such applications will suitable specified without further testing modification. DISCLAIMERS Life support applications These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips Semiconductors customers using selling these products such applications their risk agree fully indemnify Philips Semiconductors damages resulting from such application. Right make changes Philips Semiconductors reserves right make changes, without notice, products, including circuits, standard cells, and/or software, described contained herein order improve design and/or performance. Philips Semiconductors assumes responsibility liability these products, conveys licence title under patent, copyright, mask work right these products, makes representations warranties that these products free from patent, copyright, mask work right infringement, unless otherwise specified.
2001
Philips Semiconductors
Product specification
pixels matrix driver
NOTES
OM6213
2001
Philips Semiconductors worldwide company
Contact information additional information please visit Fax: 24825 sales offices addresses send e-mail
Koninklijke Philips Electronics N.V. 2001
SCA73
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
403506/01/pp40
Date release: 2001
Document order number:
9397 07745

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