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MC74HC1G08 high speed CMOS 2-input gate fabricated with silicon gate C
Top Searches for this datasheetMC74HC1G08 2-Input Gate MC74HC1G08 high speed CMOS 2-input gate fabricated with silicon gate CMOS technology. achieves high speed operation similar equivalent LSTTL while maintaining CMOS power dissipation. internal circuit composed three stages, including buffer output which provides high noise immunity stable output. MC74HC1G08 output drive current compared MC74HC series. SC-88A SOT-353/SC-70 SUFFIX CASE 419A High Speed: (Typ) Power Dissipation: (Max) 25°C High Noise Immunity Balanced Propagation Delays (tpLH tpHL) Output Drive Capability: LSTTL Symmetrical Output Impedance (IOH 2mA) Performance: 2000V; 200V Date Code TSOP-5/SOT-23/SC-59 SUFFIX CASE Date Code ASSIGNMENT Figure Pinout (Top View) ORDERING INFORMATION detailed ordering shipping information package dimensions section page this data sheet. Figure Logic Symbol FUNCTION TABLE Inputs Output Semiconductor Components Industries, LLC, 2000 August, 2000 Rev. Publication Order Number: MC74HC1G08/D MC74HC1G08 MAXIMUM RATINGS* Characteristics Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Current, Supply Current, Power dissipation still Lead temperature, from case Storage temperature SC-88A TSOP5 (VOUT GND; VOUT VCC) Symbol VOUT IOUT Tstg Value -0.5 +7.0 -0.5 -0.5 ±12.5 +150 Unit Maximum Ratings those values beyond which damage device occur. Exposure these conditions conditions beyond those indicated adversely affect device reliability. Functional operation under absolute-maximum-rated conditions implied. Functional operation should restricted Recommended Operating Conditions. Derating SC-88A Package: mW/_C from 125_C TSOP5 Package: mW/_C from 125_C RECOMMENDED OPERATING CONDITIONS Characteristics Supply Voltage Input Voltage Output Voltage Operating Temperature Range Input Rise Fall Time 2.0V 3.0V 4.5V 6.0V Symbol VOUT +125 1000 Unit package equal 1/Derating. Higher junction temperatures affect expected lifetime device table figure below. DEVICE JUNCTION TEMPERATURE VERSUS TIME 0.1% BOND FAILURES Junction Temperature Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 NORMALIZED FAILURE RATE FAILURE RATE PLASTIC CERAMIC UNTIL INTERMETALLICS OCCUR 110° 120° TIME, YEARS 1000 Figure Failure Rate Time Junction Temperature http://onsemi.com MC74HC1G08 ELECTRICAL CHARACTERISTICS Symbol Parameter Minimum High-Level Input Voltage Test Conditions -20µA 4.18 5.68 4.31 5.80 0.17 0.18 0.26 0.26 ±0.1 3.15 4.20 1.35 1.80 4.13 5.63 0.33 0.33 ±1.0 25°C 85°C 3.15 4.20 1.35 1.80 4.08 5.58 0.40 0.40 ±1.0 125°C 3.15 4.20 1.35 1.80 Unit Maximum Low-Level Input Voltage Minimum High-Level Output Voltage -2mA -2.6mA Maximum Low-Level Output Voltage 20µA 2.6mA Maximum Input Leakage Current Maximum Quiescent Supply Current 6.0V ELECTRICAL CHARACTERISTICS (Cload Input 6.0ns) Symbol Parameter Test Conditions 25°C 85°C 125°C Unit tPLH, tPHL Maximum Propogation Delay, Input 5.0V 2.0V 3.0V 4.5V 6.0V 5.0V tTLH, tTHL Output Transition Time 2.0V 3.0V 4.5V 6.0V Maximum Input Capacitance Typical 25°C, 5.0V Power Dissipation Capacitance (Note defined value internal equivalent capacitance which calculated from operating current consumption without load. Average operating current obtained equation: ICC(OPR) ICC. used determine no-load dynamic power consumption; VCC2 VCC. http://onsemi.com MC74HC1G08 INPUT tPLH tTLH tPHL DEVICE UNDER TEST TEST POINT OUTPUT OUTPUT tTHL Includes probe capacitance Figure Switching Waveforms Figure Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number MC74HC1G08DFT2 MC74HC1G08DFT4 MC74HC1G08DTT1 MC74HC1G08DTT3 Circuit Indicator Temp Range Identifier Device Function Package Suffix Tape Reel Suffix Package Type (Name/SOT#/ Common Name) SC-88A SOT-353 SC-70 SC-88A SOT-353 SC-70 TSOPS SOT-23 SC-59 TSOPS SOT-23 SC-59 Tape Reel Size (7") 3000 Unit (13") 10000 Unit (7") 3000 Unit (13") 10000 Unit Technology HC1G HC1G HC1G HC1G http://onsemi.com MC74HC1G08 PITCHES CUMULATIVE TOLERANCE TAPE ±0.2 (±0.008") NOTE NOTE COVER TAPE COMPONENTS LARGER MACHINE REFERENCE ONLY INCLUDING DRAFT RADII CONCENTRIC AROUND EMBOSSMENT USER DIRECTION FEED CENTER LINES CAVITY *TOP COVER TAPE THICKNESS (t1) 0.10 (0.004") MAX. MIN. TAPE COMPONENTS SHALL PASS AROUND RADIUS WITHOUT DAMAGE BENDING RADIUS EMBOSSED CARRIER EMBOSSMENT MAXIMUM COMPONENT ROTATION TYPICAL COMPONENT CAVITY CENTER LINE (3.937") TAPE (0.039") (9.843") TYPICAL COMPONENT CENTER LINE CAMBER (TOP VIEW) ALLOWABLE CAMBER mm/100 NONACCUMULATIVE OVER Figure Carrier Tape Specifications EMBOSSED CARRIER DIMENSIONS (See Notes Tape Size 4.35 (0.171") +0.1/ -0.0 (0.059 +0.004/ -0.0") (0.039") 1.75 ±0.1 (0.069 ±0.004") ±0.5 (1.38 ±0.002") (0.094") ±0.10 (0.157 ±0.004") ±0.1 (0.156 ±0.004") ±0.1 (0.079 ±0.002") (0.98") ±0.05 (0.01 +0.0038/ -0.0002") ±0.3 (0.315 ±0.012") Metric Dimensions Govern-English parentheses reference only. determined component size. clearance between components cavity must within 0.05 0.50 max. component cannot rotate more than within determined cavity http://onsemi.com MC74HC1G08 (0.06") 20.2 (0.795") 13.0 ±0.2 (0.512" ±0.008") (1.969") FULL RADIUS Figure Reel Dimensions REEL DIMENSIONS Tape Size Suffix (7") (13") +1.5 -0.0 (0.33" 0.059", -0.00) +1.5 -0.0 (0.33" 0.059", -0.00) 14.4 (0.56") 14.4 (0.56") DIRECTION FEED BARCODE LABEL POCKET HOLE Figure Reel Winding Direction http://onsemi.com MC74HC1G08 CAVITY TAPE TAPE TAPE TRAILER (Connected Reel Hub) COMPONENTS COMPONENTS TAPE LEADER COMPONENTS DIRECTION FEED Figure Tape Ends Finished Goods AWAY FROM SPROCKET HOLE User Direction Feed Figure DFT2 DFT4 (SC88A) Reel Configuration/Orientation AWAY FROM SPROCKET HOLE User Direction Feed Figure DTT1 DTT3 (TSOP5) Reel Configuration/Orientation http://onsemi.com MC74HC1G08 PACKAGE DIMENSIONS SC-88A SOT-353 SC-70 SUFFIX 5-LEAD PACKAGE CASE 419A-01 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCHES 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 -0.004 0.004 0.010 0.004 0.012 0.008 0.079 0.087 0.012 0.016 MILLIMETERS 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 -0.10 0.10 0.25 0.10 0.30 0.20 2.00 2.20 0.30 0.40 (0.008) (min) (min) http://onsemi.com 0.65 0.65 MC74HC1G08 PACKAGE DIMENSIONS TSOP-5/SOT-23/SC-59 SUFFIX 5-LEAD PACKAGE CASE 483-01 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL. MILLIMETERS 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.00 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 2.50 3.00 INCHES 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0.0985 0.1181 0.05 (0.002) 0.094 0.037 0.95 0.074 0.037 0.95 0.039 0.028 inches http://onsemi.com MC74HC1G08 Notes http://onsemi.com MC74HC1G08 Notes http://onsemi.com MC74HC1G08 Semiconductor trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. 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