ALIVH Layer structure Multilayer Printed Wiring Board adopts base
|
|
|
Top Searches for this datasheet
Series:ALIVH Type:
ALIVH
Layer structure Multilayer Printed Wiring Board adopts base material made nonwoven aramid interconnects between arbitrary layers filling small hole formed laser with copper paste. Industrial Property Patent
Properties
Base Material Thickness Board Hole Size Size Line/Space Dielectric Constant Density
Non-woven aramid fabric-epoxy resin
Features
Smaller, lighter, higher density wiring. Easier design shorter total design time.
g/mL
Layers:0.95 Layers:0.70 min.150 min.300 min.60/70
Recommended Applications
Mobile phone Note book type card Camcorders
Recognized Standards
Standard (File E36779) Base Type Flammability ANSI Grade min. Thickness (mm) min. Width (mm) Conductor min. Edge Width (mm) max. Width (mm) Soldering Limits Rated Temp.
EBKN1 94V-0 0.305 0.051 0.102 19.8
These values designing.
sBenefit Layer Structure Conventional
Through-hole Structure Layer Structure
ALIVH
Unable package through-hole
Enable package almost surface
Other recent searches
SMP690G-KQS - SMP690G-KQS SMP690G-KQS Datasheet
SGA5589 - SGA5589 SGA5589 Datasheet
RDK-83 - RDK-83 RDK-83 Datasheet
MRF1518N - MRF1518N MRF1518N Datasheet
DS1602 - DS1602 DS1602 Datasheet
BD131 - BD131 BD131 Datasheet
BD132 - BD132 BD132 Datasheet
74ALVT16541 - 74ALVT16541 74ALVT16541 Datasheet
2SK3419 - 2SK3419 2SK3419 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
