CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Russell Reliability
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100/256 Lead Fine Pitch Ball Grid Array (FBGA) Taiwan
CYPRESS TECHNICAL CONTACT QUALIFICATION DATA:
Russell Reliability Director (408) 432-7069
Cypress Semiconductor Package: 100/256 Fine Pitch Ball Grid Array Assembly: Taiwan
QTP# 99473, Page April, 2000
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Mold Compound Lead Frame Material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Flow: Moisture Level Thermal Resistance °C/W: Name/Location Assembly Facilities Pkg.: 100/256 Fine Pitch Ball Grid Array (FBGA) Ultra logic product family Plaskon SMT-B-1 Resin 63%Sn Copper Epoxy Attach 8355F Ablestik Material: Thermosonic Wire Material/Size: 49-41010M Level (220°C+ 5,-0°C) 29.9 Taiwan (TAIWN-G)
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Package: 100/256 Fine Pitch Ball Grid Array Assembly: Taiwan
QTP# 99473, Page April, 2000
RELIABILITY TESTS PERFORMED
Stress/Test High Accelerated Saturation Test
Test Condition (Temp/Bias) Bias: 3.63V, 130°C, 85%RH Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH +3IR-Reflow (220°C+5,-0°C) MIL-STD-883C, Method 1010, Condition -55°C 125°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH +3IR-Reflow (220°C+5, -0°C)
Result
Temperature Cycle
Electrostatic Discharge Charge Device Model (ESD-CDM) Physical Dimensions Thermal Shock High Temperature Storage External Visual Internal Visual Bond Pull Ball Shear Shear Acoustic Microscopy, Level Pressure Cooker X-Ray
Cypress Spec. 25-00020
1,000v
Cypress Spec. 25-00031 Cypress Spec: 25-00014 Condition -55°C 125°C 165°C, Bias Cypress Spec 25-00038 Cypress Spec: 25-00017 Cypress Spec 24-00002 Cypress Spec 24-00018 Cypress Spec. 25-00004 Cypress Spec. 25-00104 Bias, 121°C, 100%RH Cypress Spec 12-00292
Cypress Semiconductor Package: 100/256 Fine Pitch Ball Grid Array Assembly: Taiwan
RELIABILITY TEST DATA
QTP# 99473, Page April, 2000
Reliability Test Data
Device
STRESS:
99473
Failure Mechanism
Assy
Assy Duration Samp
ESD-CHARGE DEVICE MODEL (1000V) 2918088 619915336 TAIWN-G COMP
CY37256VP256-BB STRESS:
HI-ACCEL SATURATION TEST (130°C, 85%RH, 3.63V), COND 30°C/60%RH +3IR Reflow (220°C 5,-0°C) 2934772 619937560L TAIWN-G
CY37256VP256-BB STRESS:
HIGH TEMPERATURE STORAGE, (165°C) 2918088 619915336 TAIWN-G
CY37256VP256-BB STRESS:
PRESSURE COOKER TEST (121°C, 100%RH) 2918088619915336 TAIWN-G
CY37256VP256-BB STRESS:
JEDDEC22 CONDITION -55°C 125°C, PRECOND. 30°C/60%RH +3IR Reflow (220°C 5,-0°C) 2907107 2934772 2934772 2934772 619938111 619937559 619937560L 619937561L TAIWN-G TAIWN-G TAIWN-G TAIWN-G
CY7C37128VP100CY37256VP256-BB CY37256VP256-BB CY37256VP256-BB STRESS:
THERMAL SHOCK, CONDITION (-55°C, 125°C) 2918088 2918088 619915336 619915336 TAIWN-G TAIWN-G
CY37256VP256-BB CY37256VP256-BB
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