CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Russell Reliability
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Lead TSOP type package Moisture Level Chip Korea
CYPRESS TECHNICAL CONTACT QUALIFICATION DATA:
Russell Reliability Director (408)432-7069
Cypress Semiconductor, Inc. 32ld TSOP Type ll/level Device: CY621485
QTP# 99233, Page December, 1999
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: qualify design leadframe CY621485 TSOP lead Moisture level Chip Pack Korea. Marketing Part Package: Device Description: Cypress Division: Size (stepping): CY621485 Lead TSOP 512K Static Rev. 7C11481A 62148 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification):
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Mold Compound: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Thermal Resistence Theta Assembly Line Process Flow: JESD22-A112 Moisture Sensitivity Level: Name/Location Assembly (prime) facility:
leads TSOP Sumitomo7351 125°C Copper Alloy Lead (63137) Silver Epoxy Thermosonic 20999 Level Chip (Hyundai) Attach Material: Wire Material/Size: Ablestik 8361H Gold
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor, Inc. 32ld TSOP Type ll/level Device: CY621485
QTP# 99233, Page December, 1999
RELIABILITY TESTS PERFORMED
Stress/Test High Accelerated Saturation Test (HAST) Temperature Cycle
Test Condition (Temp/Bias) 140°C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs, 30C/60% MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%
Result
Cypress Semiconductor, Inc. 32ld TSOP Type ll/level Device: CY621485
QTP# 99233, Page December, 1999
RELIABILITY TEST DATA
QTP#: 99233
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION FAIL MODE ==================== ======== ======== ========== ======== ==== ========= STRESS: HI-ACCEL SATURATION TEST (140C/85%RH/5.5V), PRECOND. 30C/60%RH CY62148-ZSC KOREA-H 4906986 619908966 -STRESS: COND. 150C, PRECOND. 30C/60%RH (MSL CY62148-ZSC CY62148-ZSC CY62148-ZSC CY62148-ZSC CY62148-ZSC CY62148-ZSC CY62148-ZSC CY62148-ZSC CY62148-ZSC KOREA-H KOREA-H KOREA-H KOREA-H KOREA-H KOREA-H KOREA-H KOREA-H KOREA-H 4906986 4906986 4906986 4906986 4906986 4906986 4925273 4925273 4925273 619908966 619908966 619908966 619908966 619908966 619908966 619923897 619923897 619923897 1000 1000 S/RE-FLOW
CY62148-ZSC KOREA-H 4927535 619923900 CY62148-ZSC KOREA-H 4927535 619923900 S/RE-FLOW CY62148-ZSC KOREA-H 4927535 619923900
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