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CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Russell Reliability
Top Searches for this datasheetLead PQFP Taiwan CYPRESS TECHNICAL CONTACT QUALIFICATION DATA: Russell Reliability Manager (408) 432-7068 Cypress Semiconductor Assembly: Taiwan Package: Lead PQFP QPT# 99045, Page September 1999 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Copper lead PQFP Hitachi 9200 Solder Plated, 85%Sn, 15%Pb Copper/Solder mask Silver Epoxy Thermosonic Attach Material: Wire Material/Size: Level ASE, Taiwan (TAIWAN-G) Ablestik 8361 1.0/1.3 mils Note: Please contact Cypress Representative other packages availability. Cypress Semiconductor Assembly: Taiwan Package: Lead PQFP QPT# 99045, Page September 1999 RELIABILITY TESTS PERFORMED Stress/Test Temperature Cycle JEDEC22, Precondition: Test Condition (Temp/Bias) Condition -65°C 150°C JESD22 Moisture Sensitivity Level Hrs., 30°C/ Result Acoustic Microscopy Test (C-SAM) Solderability Resistance Solvents Internal Visual External Visual Physical Dimension Shear Ball Shear Bond Pull High Accelerated Saturation Test Cypress Specification 25-00104 Cypress Specification 25-00018 Cypress Specification 25-00016 Cypress Specification 25-00017 Cypress Specification 12-00292/12-00103 Cypress Specification 25-00031 Cypress Specification 24-00215 Cypress Specification 24-00018 Cypress Specification 24-00002 140°C/ 5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60% X-Ray High Temperature Storage Thermal Shock STD-883-2012 165°C, bias Cypress Specification 25-00014 Cypress Semiconductor Assembly: Taiwan Package: Lead PQFP RELIABILITY TEST DATA QPT# 99045, Page September 1999 QTP#: 99045 DEVICE ASSY-LOC FABLOT# ======== 9850159 9850159 9850158 9850158 ASSYLOT# ============== 619817519 619817519 619817611 619817611 DURATION ======== POST POST ==== FAIL MODE ==================== ======== STRESS: ACOUSTIC MICROSCOPY CY37512P208-NC CY37512P208-NC CY37512P208-NC CY37512P208-NC TAIWN-G TAIWN-G TAIWN-G TAIWN-G CY37512P208-NC TAIWN-G 9901171 619901312 CY37512P208-NC TAIWN-G 9901171 619901312 POST -STRESS: HI-ACCEL SATURATION TEST (140C/85%RH/5.5V), PRECOND. 30C/60%RH CY37512P208-NC TAIWN-G 9850158 619817611 S/RE-FLOW CY37512P208-NC TAIWN-G 9850158 619817611 -STRESS:HIGH TEMP STORAGE CY37512P208-NC TAIWN-G 9850158 619817611 -STRESS: COND. 150C, PRECOND. 30C/60%RH (MSL CY37512P208-NC CY37512P208-NC CY37512P208-NC TAIWN-G TAIWN-G TAIWN-G 9850159 9850158 9850158 619817519 619817611 619817611 1000 CY37512P208-NC TAIWN-G 9901171 619901312 CY37512P208-NC TAIWN-G 9901171 619901312 1000 -STRESS: THERMAL SHOCK, CONDITION 150C/-55C CY37512P208-NC TAIWN-G 9850158 619817611 CY37512P208-NC TAIWN-G 9850158 619817611 Other recent searchesCY7C1361V25 - CY7C1361V25 CY7C1361V25 Datasheet CY7C1363V25 - CY7C1363V25 CY7C1363V25 Datasheet CY7C1365V25 - CY7C1365V25 CY7C1365V25 Datasheet BCJ0029A - BCJ0029A BCJ0029A Datasheet A8406 - A8406 A8406 Datasheet A8406-42 - A8406-42 A8406-42 Datasheet A8406EMC2 - A8406EMC2 A8406EMC2 Datasheet A8406-41 - A8406-41 A8406-41 Datasheet A8406-46 - A8406-46 A8406-46 Datasheet A8406-47 - A8406-47 A8406-47 Datasheet A8406-48 - A8406-48 A8406-48 Datasheet A8406-51 - A8406-51 A8406-51 Datasheet A8406-56 - A8406-56 A8406-56 Datasheet A8406-57 - A8406-57 A8406-57 Datasheet A8406-58 - A8406-58 A8406-58 Datasheet A8406-43 - A8406-43 A8406-43 Datasheet A8406-44 - A8406-44 A8406-44 Datasheet A8406-45 - A8406-45 A8406-45 Datasheet A8406-52 - A8406-52 A8406-52 Datasheet A8406-53 - A8406-53 A8406-53 Datasheet A8406-54 - A8406-54 A8406-54 Datasheet A8406-55 - A8406-55 A8406-55 Datasheet A8406-62 - A8406-62 A8406-62 Datasheet A8406-64 - A8406-64 A8406-64 Datasheet
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