(CY7C611) Asat, Hong Kong Assembly CYPRESS TECHNICAL CONTACT
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Nitto MP-8000 Molding Compound Plastic Quad Flat Pack (PQFP)
(CY7C611)
Asat, Hong Kong Assembly
CYPRESS TECHNICAL CONTACT QUALIFICATION DATA:
Russell Reliability Director (408) 432-7069
Cypress Semiconductor Assembly: Asat, Hong Kong Package: PQFP, Nitto MP-8000 Molding Compound
QTP# 98422 Page May, 1999
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
PQFP (CY7C611) Nitto MP-8000 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Asat, Hong Kong (HK-A) Ablestik 84-1LMISR4 Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: Asat, Hong Kong Package: PQFP, Nitto MP-8000 Molding Compound
QTP# 98422 Page May, 1999
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) JEDEC22, Condition -55°C 125°C Precondition: JESD22 Moisture Sensitivity Level DB+72 Hrs., 30°C/60%RH Cypress Spec 25-00016 Cypress Spec 12-000149 Cypress Spec 25-000104
Result
Resistance solvents X-Ray Acoustic Microscopy Test
Cypress Semiconductor Assembly: Asat, Hong Kong Package: PQFP, Nitto MP-8000 Molding Compound
RELIABILITY TEST DATA
QTP# 98422 Page May, 1999
QTP#: 98422
DEVICE ==================== STRESS: ASSY-LOC ======== FABLOT# ======== ASSYLOT# ============== DURATION ======== ==== FAIL MODE
HIGH TEMPERATURE STORAGE (165C, BIAS)
CY7C611A-NC ASAT-B 2829585 619813226 CY7C611A-NC ASAT-B 2829585 619813226 1000 -STRESS: JEDEC22 COND. 125C, PRECOND. DBAKE 30C/60%RH CY7C611A-NC ASAT-B 2829585 619813226 CY7C611A-NC ASAT-B 2829585 619813226 1500 CY7C611A-NC CY7C611A-NC ASAT-B ASAT-B 2830635 2830635 619813227 619813227 1500
CY7C611A-NC ASAT-B 2830635 619813228 Top-side crack CY7C611A-NC ASAT-B 2830635 619813228 1500
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