Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP
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STSOP Package Cypress Philippines Assembly
Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 98107, Page June, 1998
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
STSOP Hitachi CEL9200 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Cypress Philippines (CSPI-R) Ablestik 8361H Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP
QTP# 98107, Page June, 1998
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH
Result
High Accelerated Saturation Test
Internal Visual External Visual Physical Dimension Solderability, Steam Aged Shear Ball Shear Bond Pull Thermal Shock X-Ray Acoustic Microscopy Test (C-SAM)
Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-000149 Cypress Spec 25-000104
Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP
RELIABILITY TEST DATA
QTP# 98107, Page June, 1998
QTP#: 98107
DEVICE ASSY-LOC ==================== ======== STRESS: BALL SHEAR FABLOT# ======== ASSYLOT# ============== DURATION ======== ==== FAIL MODE
CY62128-ZAC CSPI-R 4746103 619802494 COMP -STRESS: BOND PULL CY62128-ZAC CSPI-R 4746103 619802494 COMP -STRESS: C-SAM CY62128-ZAC CY62128-ZAC CSPI-R CSPI-R 4746103 4751464 619802494 619802528 COMP COMP
CY62128-ZAC CSPI-R 4751474 619802568 COMP -STRESS: MOISTURE RESISTANCE CY62128-ZAC CSPI-R 4746103 619802494 COMP -STRESS: SHEAR CY62128-ZAC CSPI-R 4746103 619802494 COMP -STRESS: EXTERNAL VISUAL CY62128-ZAC CSPI-R 4746103 619802494 COMP -STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 85C/85%RH CY62128-ZAC CSPI-R 4746103 619802494 -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY62128-ZAC CSPI-R 4746103 619802494 -STRESS: INTERNAL VISUAL CY62128-ZAC CSPI-R 4746103 619802494 COMP -STRESS: SOLDERABILITY CY62128-ZAC CSPI-R 4746103 619802494 COMP -STRESS: COND. 150C, PRECOND. 85C/85%RH (MSL CY62128-ZAC CY62128-ZAC CY62128-ZAC CSPI-R CSPI-R CSPI-R 4746103 4746103 4751464 619802494 619802494 619802528 1000
CY62128-ZAC CSPI-R 4751474 619802568 CY62128-ZAC CSPI-R 4751474 619802568 1000 -STRESS: THERMAL SHOCK, CONDITION CY62128-ZAC CSPI-R 4746103 619802494 CY62128-ZAC CSPI-R 4746103 619802494 -STRESS: X-RAY CY62128-ZAC CSPI-R 4746103 619802494 COMP
CY62128-ZAC CSPI-R 4751464 619802528 COMP
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