| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
(Sumitomo EME-7351 Molding Compound) Cypress Philippines Assembly
Top Searches for this datasheetTSOP Package (Sumitomo EME-7351 Molding Compound) Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP PLASTIC PACKAGE/ASSEMBLY DESCRIPTION QTP# 97514, Page July, 1998 Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper TSOP Sumitomo EME-7351 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Cypress Philippines (CSPI-R) Ablestik 8361H Gold Thermosonic Note: Please contact Cypress Representative other packages availability. Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97514, Page July, 1998 RELIABILITY TESTS PERFORMED Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH Result High Accelerated Saturation Test Internal Visual External Visual Physical Dimension Solderability, Steam Aged Shear Ball Shear Bond Pull Thermal Shock X-Ray Acoustic Microscopy Test (C-SAM) Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-000149 Cypress Spec 25-000104 Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP RELIABILITY TEST DATA QTP# 97514, Page July, 1998 QTP#: 97514 DEVICE ASSY-LOC ==================== ======== STRESS: BALL SHEAR FABLOT# ======== ASSYLOT# ============== DURATION ======== ==== FAIL MODE CY7C199-ZC CSPI-R 3742054 619710271 DATA -STRESS: BOND PULL CY7C199-ZC CSPI-R 3742054 619710271 DATA -STRESS: C-SAM CY7C199-ZC CY7C199-ZC CY7C199-ZC CY7C199-ZC CSPI-R CSPI-R CSPI-R CSPI-R 3742054 3742054 3742054 3742054 619710271 619710271 619710272 619710272 DATA DATA CY7C199-ZC CSPI-R 3742054 619710273 DATA CY7C199-ZC CSPI-R 3742054 619710273 -STRESS: PHYSICAL DIMENSIONS CY7C199-ZC CSPI-R 3742054 619710271 COMP -STRESS: SHEAR CY7C199-ZC CSPI-R 3742054 619710271 DATA -STRESS: EXTERNAL VISUAL CY7C199-ZC CSPI-R 3742054 619710271 COMP -STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 30C/60%RH CY7C199-ZC CSPI-R 3742054 619710271 -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY7C199-ZC CSPI-R 3742054 619710271 -STRESS: INTERNAL VISUAL CY7C199-ZC CSPI-R 3742054 619710271 COMP -STRESS: SOLDERABILITY CY7C199-ZC CSPI-R 3742054 619710271 COMP -STRESS: COND. 150C, PRECOND. 30C/60%RH (MSL CY7C199-ZC CY7C199-ZC CSPI-R CSPI-R 3742054 3742054 619710271 619710272 CY7C199-ZC CSPI-R 3742054 619710273 -STRESS: THERMAL SHOCK, CONDITION CY7C199-ZC CSPI-R 3742054 619710271 CY7C199-ZC CSPI-R 3742054 619710271 -STRESS: X-RAY CY7C199-ZC CSPI-R 3742054 619710271 DATA CY7C199-ZC CSPI-R 3742054 619710272 DATA Other recent searchesVDE0160 - VDE0160 VDE0160 Datasheet UG376 - UG376 UG376 Datasheet IDT72V2103 - IDT72V2103 IDT72V2103 Datasheet IDT72V2113 - IDT72V2113 IDT72V2113 Datasheet FEB108-001 - FEB108-001 FEB108-001 Datasheet FAN4810 - FAN4810 FAN4810 Datasheet EE-5 - EE-5 EE-5 Datasheet D2253UK - D2253UK D2253UK Datasheet AS7C33128NTF18B - AS7C33128NTF18B AS7C33128NTF18B Datasheet 1733457 - 1733457 1733457 Datasheet
Privacy Policy | Disclaimer |