Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSO
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TSOP Type OSE, Taiwan Assembly
Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97491, March, 1998
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
TSOP Type Hitachi 9200 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level ASE, Taiwan (TAIWAN-G) Ablestik 8361H Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type
QTP# 97491, March, 1998
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) JEDEC22, Condition -40°C 125°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH 140°C/3.63 Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH
Result
High Accelerated Saturation Test
Solderability, Steam Aged Resistance solvents Physical Dimentions High Temperature Storage Internal Visual External Visual Shear Ball Shear Bond Pull Thermal Shock X-Ray Acoustic Microscopy Test (C-SAM)
Cypress Spec. 25-00018 Cypress Spec. 25-00016 Cypress Spec. 25-00031 165°C, bias Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-000149 Cypress Spec 25-00104
Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type
RELIABILITY TEST DATA
QTP# 97491, March, 1998
QTP#: 97354
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 30C/60%RH FAIL MODE
CY7C1021-ZSC TAIWN-T 4722637 619708845L -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY7C1021-ZSC TAIWN-T 4722637 619708845L -STRESS: COND. 150C, PRECOND. 30C/60%RH CY7C1021-ZSC CY7C1021-ZSC CY7C1021-ZSC CY7C1021-ZSC TAIWN-T TAIWN-T TAIWN-T TAIWN-T 4722637 4722637 4722637 4722637 619708843L 619708843L 619708844L 619708844L 1000 1000
CY7C1021-ZSC TAIWN-T 4722637 619708845L CY7C1021-ZSC TAIWN-T 4722637 619708845L 1000 -STRESS: THERMAL SHOCK, CONDITION CY7C1021-ZSC TAIWN-T 4722637 619708845L CY7C1021-ZSC TAIWN-T 4722637 619708845L
Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type
QTP# 97491, March, 1998
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