| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
Cypress Semiconductor Assembly: Anam, Korea Package: SSOP PLASTIC
Top Searches for this datasheetSSOP Package Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: SSOP PLASTIC PACKAGE/ASSEMBLY DESCRIPTION QTP# 97385, December, 1997 Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper SSOP Sumitomo EME-6300 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Anam, Korea (KOREA-L/A) Ablestik 84-1LMISR4 Gold Thermosonic Note: Please contact Cypress Representative other packages availability. Cypress Semiconductor Assembly: Anam, Korea Package: SSOP QTP# 97385, December, 1997 RELIABILITY TESTS PERFORMED Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH 140°C/5.5V Precondition: 165°C, bias Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-000149 JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH Result High Accelerated Saturation Test High Temperature Storage Internal Visual External Visual Shear Ball Shear Bond Pull Thermal Shock X-Ray Acoustic Microscopy Test Cypress Semiconductor Assembly: Anam, Korea Package: SSOP RELIABILITY TEST DATA QTP# 97385, December, 1997 QTP#: 97385 DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 85C/85%RH FAIL MODE CY2276APVC KOREA-L 3705598 3705598.A -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY2276APVC KOREA-L 3701143 619702200 CY2276APVC KOREA-L 3701143 619702200 1000 -STRESS: COND. 150C, PRECOND. 85C/85%RH CY2276APVC CY2276APVC CY2276APVC CY2276APVC KOREA-L KOREA-L KOREA-A KOREA-A 3705598 3705598 3713782 3713782 3705598.A 3705598.A 3713782.03 3713782.03 1000 1000 CY2276APVC KOREA-L 3701143 619702200 CY2276APVC KOREA-L 3701143 619702200 1000 -STRESS: THERMAL SHOCK, CONDITION CY2276APVC KOREA-L 3701143 619702200 CY2276APVC KOREA-L 3701143 619702200 Other recent searchesXilinx - Xilinx Xilinx Datasheet Technical - Technical Technical Datasheet Paper - Paper Paper Datasheet Using - Using Using Datasheet FPGAs - FPGAs FPGAs Datasheet Flexible - Flexible Flexible Datasheet Interface - Interface Interface Datasheet Solution - Solution Solution Datasheet UP04217G - UP04217G UP04217G Datasheet TMS320C6000 - TMS320C6000 TMS320C6000 Datasheet TMS320C6x - TMS320C6x TMS320C6x Datasheet TMS320C62x - TMS320C62x TMS320C62x Datasheet C67x - C67x C67x Datasheet C64x - C64x C64x Datasheet TMS320C64x - TMS320C64x TMS320C64x Datasheet MN39620PQ - MN39620PQ MN39620PQ Datasheet ICS552-01B - ICS552-01B ICS552-01B Datasheet ICS551M - ICS551M ICS551M Datasheet B57301K - B57301K B57301K Datasheet 1DI400MP-050 - 1DI400MP-050 1DI400MP-050 Datasheet
Privacy Policy | Disclaimer |