Cypress Semiconductor Assembly: Anam, Korea Package: TSOP Sumitomo EME
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TSOP Package Sumitomo 7351 Mold Compound Anam, Korea Assembly
Cypress Semiconductor Assembly: Anam, Korea Package: TSOP Sumitomo EME-7351/S351 Mold Compound
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97351, Page January, 1998
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
TSOP Sumitomo EME-7351 S351 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Anam, Korea (KOREA-A) Ablestik 4-1LMISR4 Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: Anam, Korea Package: TSOP Sumitomo EME-7351/S351 Mold Compound
QTP# 97351, Page January, 1998
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH
Result
High Accelerated Saturation Test
Resistance Solvent X-Ray Acoustic Microscopy Test
Cypress Spec 25-00016 Cypress Spec 12-000149 Cypress Spec 25-00104
Cypress Semiconductor Assembly: Anam, Korea Package: TSOP Sumitomo EME-7351/S351 Mold Compound
RELIABILITY TEST DATA
QTP# 97351, Page January, 1998
QTP#: 97351
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 30C/60%RH FAIL MODE
CY7C109-ZC KOREA-Q 3720643 349704960 -STRESS: COND. 150C, PRECOND. 30C/60%RH CY7C109-ZC CY7C109-ZC CY7C109-ZC CY7C109-ZC KOREA-Q KOREA-Q KOREA-Q KOREA-Q 3720643 3720643 3720643 3720643 349704960 349704960 349704961 349704961 1000 1000
CY7C109-ZC KOREA-Q 3720643 349704962 CY7C109-ZC KOREA-Q 3720643 349704962 1000
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