Cypress Semiconducto Assembly: Cypress Philippine Package: PLASTI

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Cypress Semiconducto Assembly: Cypress Philippine Package: PLASTI

Datasheet Thumbnail

Top Searches for this datasheet

Package Cypress Philippines Assembly
Cypress Semiconducto Assembly: Cypress Philippine Package:
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97312, Page August, 1997
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
Hitachi CEL9200 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Cypress Philippines (CSPI-R) Ablestik 8361H Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconducto Assembly: Cypress Philippine Package:
QTP# 97312, Page August, 1997
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH
Result
High Accelerated Saturation Test
Internal Visual External Visual Physical Dimension Solderability, Steam Aged Shear Ball Shear Bond Pull Thermal Shock X-Ray Acoustic Microscopy Test
Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-000149
Cypress Semiconducto Assembly: Cypress Philippine Package:
RELIABILITY TEST DATA
QTP# 97312, Page August, 1997
QTP#: 97312
DEVICE ASSY-LOC ==================== ======== STRESS: BALL SHEAR FABLOT# ======== ASSYLOT# ============== DURATION ======== ==== FAIL MODE
CY7C1021 CSPI-R 619702266 DATA -STRESS: BOND PULL CY7C1021 CSPI-R 619702266 COMP -STRESS: C-SAM CY7C1021 CY7C1021 CSPI-R CSPI-R 619702266 619702267 COMP COMP
CY7C1021 CSPI-R 619702268 COMP -STRESS: PHYSICAL DIMENSIONS CY7C1021 CSPI-R 619702266 COMP -STRESS: SHEAR CY7C1021 CSPI-R 619702266 COMP -STRESS: EXTERNAL VISUAL CY7C1021 CSPI-R 619702266 COMP -STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 85C/85%RH CY7C1021 CSPI-R 619702266 -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY7C1021 CSPI-R 619702266 -STRESS: INTERNAL VISUAL CY7C1021 CSPI-R 619702266 COMP -STRESS: SOLDERABILITY CY7C1021 CSPI-R 619702266 COMP -STRESS: COND. 150C, PRECOND. 85C/85%RH CY7C1021 CY7C1021 CSPI-R CSPI-R 619702266 619702267
CY7C1021 CSPI-R 619702268 -STRESS: THERMAL SHOCK, CONDITION CY7C1021 CY7C1021 CSPI-R CSPI-R 619702266 619702266
-STRESS: X-RAY CY7C1021 CSPI-R 619702266 DATA

Cypress Semiconducto Assembly: Cypress Philippine Package: PLASTI

Top Searches for this datasheet

Other recent searches