Cypress Semiconductor Assembly: Cypress Philippines Package: SSOP
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48/56 SSOP Package Cypress Philippines Assembly
Cypress Semiconductor Assembly: Cypress Philippines Package: SSOP
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97304, Page August, 1997
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
SSOP Hitachi CEL9200 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Cypress Philippines (CSPI-R) Ablestik 8361H Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: Cypress Philippines Package: SSOP
QTP# 97304, Page August, 1997
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH
Result
High Accelerated Saturation Test
Internal Visual External Visual Physical Dimension Solderability, Steam Aged Shear Ball Shear Bond Pull Thermal Shock X-Ray Acoustic Microscopy Test
Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-000149
Cypress Semiconductor Assembly: Cypress Philippines Package: SSOP
RELIABILITY TEST DATA
QTP# 97304, Page August, 1997
QTP#: 97304
DEVICE ASSY-LOC ==================== ======== STRESS: ACOUSTIC MICROSCOPY FABLOT# ======== ASSYLOT# ============== DURATION ======== ==== FAIL MODE
CY2276APVC CSPI-R 3716099 619704633 COMP -STRESS: BALL SHEAR CY2276APVC CSPI-R 3716099 619704633 COMP -STRESS: BOND PULL CY2276APVC CSPI-R 3716099 619704633 COMP -STRESS: PHYSICAL DIMENSIONS CY2276APVC CSPI-R 3716099 619704633 COMP -STRESS: SHEAR CY2276APVC CSPI-R 3716099 619704633 COMP -STRESS: EXTERNAL VISUAL CY2276APVC CSPI-R 3716099 619704633 COMP -STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 85C/85%RH CY2276APVC CSPI-R 3716099 619704633 -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY2276APVC CSPI-R 3716099 619704633 -STRESS: INTERNAL VISUAL CY2276APVC CSPI-R 3716099 619704633 COMP -STRESS: SOLDERABILITY CY2276APVC CSPI-R 3716099 619704633 COMP -STRESS: COND. 150C, PRECOND. 85C/85%RH CY2276APVC CSPI-R 3716099 619704633 CY2276APVC CSPI-R 3716099 619704633 CY2276APVC CSPI-R 3716099 619704633 -STRESS: THERMAL SHOCK, CONDITION CY2276APVC CSPI-R 3716099 619704633 CY2276APVC CSPI-R 3716099 619704633 -STRESS: X-RAY CY2276APVC CSPI-R 3716099 619704633 COMP
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