The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.    


Datasheet Search Engine   
 
Part # or Description: • 5V RS232 Driver • 2SC5066* • "Real Time Clock" • "USB connector" • "blue led" 5mm • 10 watt zener diode • 2N3055* motorola
 
Search Tip: Try entering the part number only. Include a wildcard (eg. lm317* or 1n4148*)

 

 

Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP PLASTIC


Datasheet Thumbnail

  

Download PDF



Top Searches for this datasheet



Pins TQFP Package (14x20x1.4mm) ASE, Taiwan Assembly
Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97302, Page June, 1997
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
Thin Quad Flatpack (TQFP) Hitachi CEL9200 Solder Plated, 90%Sn, 10%Pb None Attach Material: Wire Material/Size: Level ASE, Taiwan (TAIWAN-G) Ablestik 8361H Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP
QTP# 97302, Page June, 1997
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH+Solder Reflow 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH+Solder Reflow
Result
High Accelerated Saturation Test
Internal Visual External Visual Physical Dimension Solderability, Steam Aged Shear Ball Shear Bond Pull High Temperature Storage Thermal Shock X-Ray Acoustic Microscopy
Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 165°C, bias Cypress Spec 25-00014 Cypress Spec 12-000149 JEDEC A112-A
Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP
RELIABILITY TEST DATA
QTP# 97302, Page June, 1997
QTP#: 97302
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 30C/60%RH FAIL MODE
CY7C1329-AC TAIWN-G 4711050 619703196LB -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY7C1329-AC TAIWN-G 4711050 619703196LB -STRESS: COND. 150C, PRECOND. 30C/60%RH CY7C1329-AC CY7C1329-AC CY7C1329-AC CY7C1329-AC TAIWN-G TAIWN-G TAIWN-G TAIWN-G 4711050 4711050 4711050 4711050 619703196LA 619703196LA 619703196LB 619703196LB 1000 1000 BROKEN PINS
CY7C1329-AC TAIWN-G 4711050 619703196LC CY7C1329-AC TAIWN-G 4711050 619703196LC 1000 -STRESS: THERMAL SHOCK, CONDITION CY7C1329-AC TAIWN-G 4711050 619703196LB CY7C1329-AC TAIWN-G 4711050 619703196LB

Other recent searches


SGC-4F - SGC-4F   SGC-4F Datasheet
PVD13N - PVD13N   PVD13N Datasheet
PT2308P - PT2308P   PT2308P Datasheet
PD60191-B - PD60191-B   PD60191-B Datasheet
IR21091 - IR21091   IR21091 Datasheet
MA3D756 - MA3D756   MA3D756 Datasheet
MA7D56 - MA7D56   MA7D56 Datasheet
DDR400 - DDR400   DDR400 Datasheet
DDR333 - DDR333   DDR333 Datasheet
DDR266 - DDR266   DDR266 Datasheet

 

Privacy Policy | Disclaimer
© 2012 Datasheet Archive