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Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP PLASTIC
Top Searches for this datasheetPins TQFP Package (14x20x1.4mm) ASE, Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP PLASTIC PACKAGE/ASSEMBLY DESCRIPTION QTP# 97302, Page June, 1997 Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper Thin Quad Flatpack (TQFP) Hitachi CEL9200 Solder Plated, 90%Sn, 10%Pb None Attach Material: Wire Material/Size: Level ASE, Taiwan (TAIWAN-G) Ablestik 8361H Gold Thermosonic Note: Please contact Cypress Representative other packages availability. Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP QTP# 97302, Page June, 1997 RELIABILITY TESTS PERFORMED Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH+Solder Reflow 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH+Solder Reflow Result High Accelerated Saturation Test Internal Visual External Visual Physical Dimension Solderability, Steam Aged Shear Ball Shear Bond Pull High Temperature Storage Thermal Shock X-Ray Acoustic Microscopy Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 165°C, bias Cypress Spec 25-00014 Cypress Spec 12-000149 JEDEC A112-A Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP RELIABILITY TEST DATA QTP# 97302, Page June, 1997 QTP#: 97302 DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 30C/60%RH FAIL MODE CY7C1329-AC TAIWN-G 4711050 619703196LB -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY7C1329-AC TAIWN-G 4711050 619703196LB -STRESS: COND. 150C, PRECOND. 30C/60%RH CY7C1329-AC CY7C1329-AC CY7C1329-AC CY7C1329-AC TAIWN-G TAIWN-G TAIWN-G TAIWN-G 4711050 4711050 4711050 4711050 619703196LA 619703196LA 619703196LB 619703196LB 1000 1000 BROKEN PINS CY7C1329-AC TAIWN-G 4711050 619703196LC CY7C1329-AC TAIWN-G 4711050 619703196LC 1000 -STRESS: THERMAL SHOCK, CONDITION CY7C1329-AC TAIWN-G 4711050 619703196LB CY7C1329-AC TAIWN-G 4711050 619703196LB Other recent searchesSGC-4F - SGC-4F SGC-4F Datasheet PVD13N - PVD13N PVD13N Datasheet PT2308P - PT2308P PT2308P Datasheet PD60191-B - PD60191-B PD60191-B Datasheet IR21091 - IR21091 IR21091 Datasheet MA3D756 - MA3D756 MA3D756 Datasheet MA7D56 - MA7D56 MA7D56 Datasheet DDR400 - DDR400 DDR400 Datasheet DDR333 - DDR333 DDR333 Datasheet DDR266 - DDR266 DDR266 Datasheet
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