mils lds, mils package) Cypress Semiconductor Backgrind Wafer Eli
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Backgrind Wafer Elimination
mils lds, mils package)
Cypress Semiconductor Backgrind Wafer Elimination Package: SOJ/ Assembly: Cypress Bangkok/ASE Taiwan
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97255, Page October, 1997
Package Outline, Type, Name: Mold Compound Name/Manufacturer:
32-pins, 300-mils Sumitomo-7351 Nitto MP-8000 Hitachi CEL-9200U
Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process
Copper Solder Plated, 85%Sn, 15%Pb Silver Spot Epoxy Thermosonic Attach Material: Wire Material/Size: Level Level (packages were stressed level product currently shipping) Bangkok, Thailand (ALPHA-X) ASE, Taiwan(TAIWAN-G) Ablestik 8361A Gold
Note: Please contact Cypress Representative other packages availability
Cypress Semiconductor Backgrind Wafer Elimination Package: SOJ/ Assembly: Cypress Bangkok/ASE Taiwan
RELIABILITY TESTS PERFORMED
QTP# 97255, Page October, 1997
Stress/Test High Accelerated Saturation Test (HAST) High Accelerated Saturation Test (HAST) Temperature Cycle 140°C, 5.5V Precondition: 140°C,, 5.5V Precondition:
Test Condition (Temp/Bias) JESD22 Moisture Sensitivity Level (168Hrs, 85C/85%RH)
Result
JESD22 Moisture Sensitivity Level (192Hrs, 30C/60%RH)
MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level (168Hrs, 85C/85%RH) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level (192Hrs, 30C/60%RH)
Temperature Cycle
C-SAM X-Ray Acoustic Microscopy Cypress Spec 12-00149 JEDEC 112-A
Cypress Semiconductor Backgrind Wafer Elimination Package: SOJ/ Assembly: Cypress Bangkok/ASE Taiwan
QTP# 97255, Page October, 1997
RELIABILITY TEST DATA
QTP#: 97255
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 85C/85%RH FAIL MODE
CY7C199-VC
ALPHA-X
4709981
219705927
CY7C199-VC CSPI-R 4720515 619705069 PARTICLE -STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 30C/60%RH
CY7C1009-VC
TAIWN-G
3715980
619703844-1
CY7C1021-VC TAIWN-G 4709987 619703845-1 -STRESS: COND. 150C, PRECOND. 85C/85%RH
CY7C199-VC CY7C199-VC CY7C199-VC CY7C199-VC CY7C199-VC CY7C199-VC
ALPHA-X ALPHA-X ALPHA-X ALPHA-X ALPHA-X ALPHA-X
4709981 4709981 4709981 4709981 4709981 4709981
219705927 219705927 219705927E 219705927E 219705927EE 219705927EE
1000 1000 1000
CY7C199-VC CSPI-R 4720515 619705069 CY7C199-VC CSPI-R 4720515 619705069 1000 -STRESS: COND. 150C, PRECOND. 30C/60%RH CY7C1009-VC CY7C1009-VC CY7C1009-VC CY7C1009-VC TAIWN-G TAIWN-G TAIWN-G TAIWN-G 3715980 3715980 3715980 3715980 619703844-1 619703844-1 619703844-2 619703844-2 1000 1000
CY7C1009-VC TAIWN-G 3715980 619703844-3 CY7C1009-VC TAIWN-G 3715980 619703844-3 1000
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