Cypress Semiconductor Assembly: OSE, Taiwan Package: STSOP PLASTI

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Cypress Semiconductor Assembly: OSE, Taiwan Package: STSOP PLASTI

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STSOP Package OSE, Taiwan Assembly
Cypress Semiconductor Assembly: OSE, Taiwan Package: STSOP
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97213, February, 1998
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
STSOP Hitachi 9200U Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level OSE, Taiwan (TAIWAN-T) Ablestik 84-1LMISR4 Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: OSE, Taiwan Package: STSOP
QTP# 97213, February, 1998
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH
Result
High Accelerated Saturation Test
Resistance Solvent Physical Dimension High Temperature Storage Internal Visual External Visual Shear Ball Shear Bond Pull Thermal Shock X-Ray C-Sam
Cypress Spec 25-00016 Cypress Spec 25-00031 165°C, bias Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-00149 Cypress Spec 25-00104
Cypress Semiconductor Assembly: OSE, Taiwan Package: STSOP
RELIABILITY TEST DATA
QTP# 97213, February, 1998
QTP#: 97213
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 30C/60%RH FAIL MODE
CY7C1512-ZAC TAIWN-T 3648865 619702894 -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY7C1512-ZAC TAIWN-T 3648865 619702894 CY7C1512-ZAC TAIWN-T 3648865 619702894 1000 -STRESS: COND. 150C, PRECOND. 30C/60%RH CY7C1512-ZAC CY7C1512-ZAC CY7C1512-ZAC CY7C1512-ZAC TAIWN-T TAIWN-T TAIWN-T TAIWN-T 3648830 3648830 3648831 3648831 619702836 619702836 619702837 619702837 1000 1000
CY7C1512-ZAC TAIWN-T 3648865 619702894 CY7C1512-ZAC TAIWN-T 3648865 619702894 1000 -STRESS: THERMAL SHOCK, CONDITION CY7C1512-ZAC TAIWN-T 3648865 619702894 CY7C1512-ZAC TAIWN-T 3648865 619702894

Cypress Semiconductor Assembly: OSE, Taiwan Package: STSOP PLASTI

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