Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOI

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Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOI

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450-mil SOIC Package Taiwan Assembly
Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOIC
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97184, Page August, 1997
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Copper
450-mil SOIC Hitachi CEL9200 Solder Plated, 85%Sn, 15%Pb None Silver Epoxy Thermosonic Attach Material: Wire Material/Size: Level ASE, Taiwan (TAIWN-G) Ablestik 8361H Gold
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOIC
QTP# 97184, Page August, 1997
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH 140°C/5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 30°C/60%RH
Result
High Accelerated Saturation Test
Internal Visual External Visual Physical Dimension Solderability, Steam Aged Shear Ball Shear Bond Pull Thermal Shock X-Ray Resistance Solvent Acoustic Microscopy
Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-000149 Cypress Spec 25-00016
Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOIC
RELIABILITY TEST DATA
QTP# 97184, Page August, 1997
QTP#: 97184
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 30C/60%RH
FAIL MODE
CY7C1048-SC TAIWN-G 4716305 619703660 -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY7C1048-SC TAIWN-G 4716305 619703658 -STRESS: COND. 150C, PRECOND. 30C/60%RH CY7C1048-SC CY7C1048-SC CY7C1048-SC TAIWN-G TAIWN-G TAIWN-G 4714185 4716305 4716305 619702975 619703658 619703658 1000
CY7C1048-SC TAIWN-G 4716305 619703659 CY7C1048-SC TAIWN-G 4716305 619703659 1000 -STRESS: THERMAL SHOCK, CONDITION CY7C1048-SC TAIWN-G 4716305 619703659 CY7C1048-SC TAIWN-G 4716305 619703659

Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOI

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