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Cypress Semiconductor Assembly: Omedata, Indonesia Package: 150-mil SO


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SOIC Omedata-Indonesia Assembly
Cypress Semiconductor Assembly: Omedata, Indonesia Package: 150-mil SOIC
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97181 Page2 November, 1997
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
150-mil SOIC (die size less than equal mil) Sumitomo EME-6300 Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Omedata, Indonesia (INDNS-O) Ablestik 84-1LMISR4 Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: Omedata, Indonesia Package: 150-mil SOIC
QTP# 97181 Page3 November, 1997
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH 140°C/5.5V Precondition: 165°C, bias Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec 24-00004 Cypress Spec 24-00018 Cypress Spec 24-00002 Cypress Spec 25-00014 Cypress Spec 12-000149 Cypress Spec 25-00016 JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH
Result
High Accelerated Saturation Test
High Temp Storage Internal Visual External Visual Physical Dimension Solderability, Steam Aged Shear Ball Shear Bond Pull Thermal Shock X-Ray Resistance Solvent
Cypress Semiconductor Assembly: Omedata, Indonesia Package: 150-mil SOIC
RELIABILITY TEST DATA
QTP# 97181 Page4 November, 1997
QTP#: 97181
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 85C/85%RH FAIL MODE
7C83300DB-OSC INDNS-O 3629075 519610991 -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) 7C83300DB-OSC INDNS-O 3629075 519610991 -STRESS: COND. 150C, PRECOND. 85C/85%RH 7C83300DB-OSC 7C83300DB-OSC 7C83300DB-OSC 7C83300DB-OSC INDNS-O INDNS-O INDNS-O INDNS-O 3629075 3629075 3629064 3629064 519610991 519610991 519610992 519610992 1000 1000
7C83300DB-OSC INDNS-O 3629043 519610993 7C83300DB-OSC INDNS-O 3629043 519610993 1000 -STRESS: THERMAL SHOCK, CONDITION 7C83300DB-OSC INDNS-O 3629075 519610991 7C83300DB-OSC INDNS-O 3629075 519610991

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