Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP P
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Thin Small Outline Package (TSOP) Anam, Philippines
Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 97098, Page April, 1997
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Epoxy Copper
TSOP (paddle size less than equal 209mil mil) Sumitomo 7351 Solder Plated, 90%Sn, 10%Pb Silver Spot Attach Material: Wire Material/Size: Level (Test results level moisture required ship with packed condition) Ablestik 8361 Gold Thermosonic
Assembly Line Process
Anam, Philippines (PHIL-M)
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP
QTP# 97098, Page April, 1997
RELIABILITY TESTS PERFORMED
Stress/Test High Accelerated Saturation Test (HAST) Temperature Cycle
Test Condition (Temp/Bias) 140°C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH
Result
Acoustic Microscopy X-Ray Ball Shear MIL-STD-883 2012; Cypress Spec 12-000149 Cypress Spec 24-00018
Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP
RELIABILITY TEST DATA
QTP# 97098, Page April, 1997
QTP#: 97098
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 85C/85%RH FAIL MODE
CY7C199-ZC PHIL-M 4628725 349700963-1 -STRESS: COND. 150C, PRECOND. 85C/85%RH CY7C199-ZC CY7C199-ZC CY7C199-ZC PHIL-M PHIL-M PHIL-M 4628725 4628725 4628725 349700963-1 349700963-2 349700963-2 1000
CY7C199-ZC PHIL-M 4628725 349700963-3 CY7C199-ZC PHIL-M 4628725 349700963-3 1000
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