Cypress Semiconductor Assembly: Omedata, Inodnesia Package: pins PLCC
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Pins PLCC Omedata Assembly
Cypress Semiconductor Assembly: Omedata, Inodnesia Package: pins PLCC
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
QTP# 96225, Page August, 1997
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Epoxy Copper
Pins PLCC Sumitomo EME-6300H Solder Plated, 85%Sn, 15%Pb Silver Attach Material: Wire Material/Size: Level Omedata, Indonesia (INDNS-O) Ablestik 84-1LMISR4 Gold Thermosonic
Note: Please contact Cypress Representative other packages availability.
Cypress Semiconductor Assembly: Omedata, Inodnesia Package: pins PLCC
QTP# 96225, Page August, 1997
RELIABILITY TESTS PERFORMED
Stress/Test Temperature Cycle
Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH 140°C/3.3V Precondition: JESD22 Moisture Sensitivity Level Hrs., 85°C/85%RH
Result
High Accelerated Saturation Test
Internal Visual External Visual Physical Dimension Solderability, Steam Aged Resistance Solvents High Temperature Storage Thermal Shock X-Ray Acoustic Microscopy
Cypress Spec 25-00017 Cypress Spec 12-00102/12-00103 Cypress Spec. 25-00031 Cypress Spec. 25-00018 Cypress Spec. 25-00016 165°C, bias Cypress Spec 25-00014 Cypress Spec 12-000149
Cypress Semiconductor Assembly: Omedata, Inodnesia Package: pins PLCC
RELIABILITY TEST DATA
QTP# 96225, Page August, 1997
QTP#: 96225
DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION ==================== ======== ======== ============== ======== ==== STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 85C/85%RH CY7C131-JC INDNS-O 2615761 519607978 FAIL MODE
CY7C131-JC INDNS-O 2616862 519607979 -STRESS: HIGH TEMPERATURE STORAGE (165C, BIAS) CY7C131-JC INDNS-O 2616862 519607979 CY7C131-JC INDNS-O 2616862 519607979 1000 -STRESS: COND. 150C, PRECOND. 85C/85%RH CY7C131-JC CY7C131-JC INDNS-O INDNS-O 2615761 2615761 519607978 519607978 1000
CY7C131-JC INDNS-O 2616862 519607979 -STRESS: THERMAL SHOCK, CONDITION CY7C131-JC INDNS-O 2616862 519607979 CY7C131-JC INDNS-O 2616862 519607979
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