PRODUCT DESCRIPTION (for qualification) Information provided this docu

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PRODUCT DESCRIPTION (for qualification) Information provided this docu

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256K SRAM, TECHNOLOGY MARKETING PART NUMBER CY7C191 CY7C192 CY7C194 CY7C195 CY7C196 CY7C197 CY7C198 CY7C199 DEVICE DESCRIPTION Separate with transparent write Separate without transparent write Common with Common with Common with 256K
PRODUCT DESCRIPTION (for qualification) Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): SRAM Cypress Semiconductor Corporation Rev. 7C198/9 April/1993 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION Number Metal Layers: Metal Composition: Metal 6000A with 1500A Barrier Metal: Ti/TiW 500A/1200A Metal TiW/Al/Ti 1500A/10000A/150A None CMOS, Double Poly, Double Metal /0.65 SiO2 165A Cypress Semiconductor, Bloomington, R25D
Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process
7,000A TEOS/6,000A Oxynitride Si3N4 Polyimide
Generic Process Technology/Design Rule (µ-drawn):
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Epoxy Thermosonic Copper Solder Plated, 63%Sn, 37%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Cypress-Bangkok, Thailand Astra, Indonesia Alpha-X Astra-F mils mils Silver Epoxy Gold 28-pin, 300-mil Plastic mils side Sumitomo EME-6300H(R)
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CYPRESS SEMICONDUCTOR
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Epoxy Thermosonic Copper Solder Plated, 85%Sn, 15%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Cypress-Bangkok, Thailand Astra, Indonesia Alpha-X Astra-F mils mils Silver Epoxy Gold 28-pin, 300-mil mils side Sumitomo EME-6300H(R)
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic Alloy Solder Dipped, 63%Sn, 37%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Cypress-Bangkok, Thailand Alpha-X mils mils Silver Glass Aluminum 1.25 28-pin, 300-mil CerDIP mils side
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CYPRESS SEMICONDUCTOR
OTHER INFORMATION approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly: Omedata, Indonesia Astra, Indonesia Q3/94 Process Change: Cross Licensee/Licensor: 7C627 Cerpack, >4,400V
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 130°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Other: Other: Internal Water Vapor Temperature Cycle -40°C 125°C 150°C
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CYPRESS SEMICONDUCTOR
Product Family: Division: Supplier's Part Number
PRODUCT INFORMATION QUALIFICATION SIMILARITY 256K SRAM, Technology Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Type Compound Assembly Line Location Volt Rating
Process Line CY7C191 CY7C192 -**D* -**L* -**PC -**VC -**KMB -**D* -**L* -**PC -**VC -**KMB -**D* -**L* -**PC -**VC -**KMB -**D* -**L* -**PC -**VC -**KC -**DC* -**LC* -**PC 28.3 CDIP 28.3 PDIP 28.3 CPACK 24.3 CDIP 24.3 PDIP 24.3 CPACK 28.3 CDIP 28.3 PDIP 28.3 CPACK 24.3 CDIP 24.3 PDIP 24.3 CPACK 28.6 CDIP 28.6 PDIP 0.65µ CMOS Oxynitride Sumitomo Hysol Cypress-Bangkok Thailand >4,400V
CY7C194
0.65µ
CMOS
Oxynitride
Sumitomo Hysol
Cypress- Bangkok Thailand
>4,400V
CY7C195 CY7C196
0.65µ
CMOS
Oxynitride
Sumitomo Hysol
Cypress-Bangkok Thailand
>4,400V
CY7C197
0.65µ
CMOS
Oxynitride
Sumitomo Hysol
Cypress-Bangkok Thailand
>4,400V
CY7C198
0.65µ
CMOS
Oxynitride
Sumitomo Hysol
Cypress-Bangkok Thailand
>4,400V
Note:
"**" covers rated speeds from replace (Commercial) (Military)
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CYPRESS SEMICONDUCTOR
Product Family: Division:
PRODUCT INFORMATION QUALIFICATION SIMILARITY 256K SRAM, Technology Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Type Compound Assembly Line Location Volt Availabilit Rating (mm/yy)
Supplier's Part Number
Process Line CY7C199 -**D* -**L* -**PC -**VC -**KMB 28.3 CDIP 28.3 PDIP 28.3 CPACK 0.65µ CMOS Oxynitride Sumitomo Hysol CypressBangkok Thailand >4,400V
Note:
"**" covers rated speeds from replace (Commercial) (Military)
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
DEVICE RELIABILITY SUMMARY CY7C199 Wafer Fab: 28-pin, 300-mil PDIP/SOIC/CDIP Assembly:
Bloomington, Alphatec, Thailand
High Temperature Dynamic Operating Life (HTOL, 5.75V, 125°C) Early Failure Rate Device CY7C199 CY7C199 Lot# 100736 100811 Hours 0/1022 0/1214 Cumulative 0/2236
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device CY7C199 CY7C199 CY7C199 Lot# 95743 91780 92622 Hours Hours 0/84 0/200 0/210 1000 Hours Cumulative 0/494 0/210
0/200 0/210
Group Subgroup Life Test (HTOL, 5.75V, 150°C) Device CY7C199 Lot# 96668 Hours 0/80 High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device CY7C199 CY7C199 CY7C199 CY7C199 Lot# 95743 96668 92622 94279 Hours 0/84 0/80 0/81 0/82 0/80 0/81 Hours Cumulative 0/327 Cumulative 0/80
Temperature Cycle (JEDEC22, Condition -40°C 125°C) Device CY7C199 CY7C199 Lot# 92292 92622 Cycles 0/49 0/50 1000 Cycles 0/49 0/50 Cumulative 0/99
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
DEVICE RELIABILITY SUMMARY CY7C199 Wafer Fab: 28-pin, 300-mil PDIP/SOIC/CDIP Assembly:
Bloomington, Alphatec, Thailand
Temperature Cycle (Condition -65°C 150°C) Device CY7C199 Lot# 95743 Cycles 0/50 1000 Cycles 0/50 Cumulative 0/50
Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Device CY7C199 CY7C199 Lot# 92622 95125 Hours 0/50 0/50 High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH, 15psig) Device CY7C199 CY7C199 Lot# 91780 91780 Hours 0/49 0/50 Cumulative 0/99 Cumulative 0/100
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
DEVICE RELIABILITY SUMMARY CY7C199 Wafer Fab: 28-pin, 300-mil Assembly:
Bloomington, Astra, Indonesia
Temperature Cycle (Condition -65°C 150°C), Precondition hours (121°C, 100%RH) Device CY7C199 CY7C199 Lot# 3436406 3437420 Cycles 0/54 0/54 1000 Cycles 0/54 Cumulative 0/108
Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Device CY7C199 CY7C199 Lot# 3436406 3437420 Hours 0/54 0/54 High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH, 15psig) Device CY7C199 CY7C199 Lot# 3436406 3437420 Hours 0/54 0/54 Thermal Shock (-55°C, 150°C) Device CY7C199 Lot# 3437420 Cycles 0/54 Cycles 0/54 Cumulative 0/54 Cumulative 0/108 Cumulative 0/108
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CYPRESS SEMICONDUCTOR
DEVICE RELIABILITY SUMMARY
256K SRAM, TECHNOLOLGY Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+4,400V >+4,400V Unit Unit >-4,400V >-4,400V
>+4,400V Unit >-4,400V (Highest passing voltage, +10% Guard-banded)
Latchup Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Temp 125°C
Miscellaneous Results Internal Water Vapor: Completed Pass1 Physical Dimention Completed Pass2 External Visual SolderAbility Completed Pass2 Completed Pass2
Technology, 92232 Technology, 94444 (Astra assembly qual R25)

PRODUCT DESCRIPTION (for qualification) Information provided this docu

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