BiCMOS ECL-TTL/TTL-ECL TRANSLATOR MARKETING PART NUMBERS CY101E383 CY1

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BiCMOS ECL-TTL/TTL-ECL TRANSLATOR MARKETING PART NUMBERS CY101E383 CY1

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Reliability Report
BiCMOS ECL-TTL/TTL-ECL TRANSLATOR MARKETING PART NUMBERS CY101E383 CY10E383 DESCRIPTION ECL/TTL/ECL Translator High Speed Driver ECL/TTL/ECL Translator High Speed Driver
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PRODUCT DESCRIPTION (for qualification) Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY101E383 ECL-TTL/TTL-ECL TRANSLATORS Cypress Semiconductor Corporation 100E383A Septempber, 1994 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process None Single Poly, Double Metal /0.8µm SiO2 /195A Cypress Semiconductor, Round Rock, (Fab Generic Process Technology/Design Rule (µ-drawn): Metal Composition: Metal Ti,TiW,1%SiAl Metal SiAl None
3,000A Plasma Oxide 15,000A Oxynitride
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PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: JESD22-A112 Moisture Sensitivity Level Assembly Line Process Paste Thermosonic Copper Solder Plated, 85%Sn, 15%Pb Silver Spot Attach Material: Wire Material/Size: Level Anam, Korea/J84S Silver Epoxy Gold 84-Lead Plastic Lead Chip Carrier Sumitomo EME-6300H(R)
Note: Please contact Cypress Representative other packages availability.
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RELIABILITY TESTS PERFORMED
Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate Read Record Life Test High Temperature Steady State Life High Accelerated Saturation Test (HAST) Temperature Cycle Temperature Cycle Pressure Cooker Test Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Latchup Sensitivity
Test Condition (Temp/Bias) Dynamic Operating Condition, 5.50V, 125°C Dynamic Operating Condition, 5.60V, 125°C Dynamic Operating Condition, 5.75V, 125°C Static Operating Condition, 5.75V, 125°C 140°C, 85%RH, 5.5V Precondition: 48-Hrs PCT, Solder Reflow JEDEC22 Condition -40°C 125°C, Precondition: Hrs. PCT, Solder Reflow MIL-STD-883C, Method 1010, Condition -65°C 150°C Precondition: Hrs. PCT, Solder Reflow bias, 121°C, 100%RH, PSIA Precondition: Temperature cycles, Condition MIL-STD-883, Method 3015.7 Cypress Spec. 25-00020 accordance with JEDEC Cypress Spec. 01-00081
Result 2200V 2000V
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RELIABILITY FAILURE RATE SUMMARY
Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life1,2 Long Term Failure Rate
Device Tested/ Device Hours 2109 Devices 358,000 DHRs
Fails
Activation Energy
Thermal3
Failure Rate FITs
Assuming ambient temperature 55°C junction temperature rise 15°C. Chi-squared estimations used calculate failure rate. Thermal Acceleration Factor calculated from Arrhenius equation
where: =The Activation Energy defect mechanism. Boltzmann's constant 8.62x10-5 eV/Kelvin. junction temperature device under stress junction temperature conditions.
device
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RELIABILITY TEST DATA
EVAL DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION FAIL MODE ====== =============== ======== ======== ============== ======== ==== STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 5,50V) 95255 CY101E383-JC KOREA-A 2429923 349411720 94346 CY101E383-JC KOREA-A 2429923 349411729 94346 CY101E383-JC KOREA-A 2435526 349414205 1029 TEOS
-STRESS: HI-ACCEL SATURATION TEST (140C, 85%RH, 5.5V), PRECONDITION HOURS 94346 CY101E383-JC KOREA-A 2429923 349411729 -STRESS: HIGH TEMP STEADY STATE LIFE TEST (125C, 5.60V) 94346 CY101E383-JC KOREA-A 2429923 349411729
94346 CY101E383-JC KOREA-A 2435526 349414205 94346 CY101E383-JC KOREA-A 2435526 349414205 -STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 5,60V) 94346 CY101E383-JC KOREA-A 2429923 349411729 94346 CY101E383-JC KOREA-A 2429923 349411729 94346 CY101E383-JC KOREA-A 2429923 349411729 1000 2000
94346 CY101E383-JC KOREA-A 2435526 349414205 94346 CY101E383-JC KOREA-A 2435526 349414205 -STRESS: PRESSURE COOKER TEST (121C, 100%RH) 94346 CY101E383-JC KOREA-A 2429923 349411729 -STRESS: READ RECORD LIFE TEST (125C, 5.75V) 94346 CY101E383-JC KOREA-A 2429923 349411729 94346 CY101E383-JC KOREA-A 2429923 349411729 94346 CY101E383-JC KOREA-A 2429923 349411729 1000 94346 CY101E383-JC KOREA-A 2429923 349411729 2000 -STRESS: TEMP CYCLE, JEDEC22 COND. 125C, PRECONDITION HOURS 94346 CY101E383-JC KOREA-A 2429923 349411729 94346 CY101E383-JC KOREA-A 2429923 349411729 94346 CY101E383-JC KOREA-A 2429923 349411729 1000 1500
94346 CY101E383-JC KOREA-A 2435526 349414205 94346 CY101E383-JC KOREA-A 2435526 349414205 1000 94346 CY101E383-JC KOREA-A 2435526 349414205 1500 -STRESS: TEMP CYCLE, COND. 150C, PRECONDITION HOURS 94346 CY101E383-JC KOREA-A 2435526 349414205 94346 CY101E383-JC KOREA-A 2435526 349414205 1000
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Note:
94346, BiCMOS ECL-TTL/TTL-ECL Translator qualified Fab2. 95255, BiCMOS ECL-TTL/TTL-ECL Translator production burn-in elimination.

BiCMOS ECL-TTL/TTL-ECL TRANSLATOR MARKETING PART NUMBERS CY101E383 CY1

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