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Static RAM2.1 PRODUCT DESCRIPTION (for qualification) Inform


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CY7C122
Static RAM2.1
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C122 Static RAM, Separate Cypress Semiconductor 7C122A Aug./1994 What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
DIE/FAB DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: None CMOS, Double Poly, Single Metal 0.8µm SiO2 Cypress Semiconductor Round Rock, Generic Process Technology/Design Rule (µ-drawn): Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process Metal Composition: Metal TiW, SiAl,
LTO, Oxynitride
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Epoxy Thermocompression Copper Solder, 85%Sn 15%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Cypress Semiconductor, Jose, Cypress Semiconductor/ Silver Epoxy Gold 22-pin, Plastic side Sumitomo EME-6300H(R)
Name/Location Assembly (prime) facility:
PAGE
CYPRESS SEMICONDUCTOR
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Paste Ultrasonic Alloy-42 Solder, 63%Sn 37%Pb Aluminum Attach Dim: Attach Material: Wire Material/Size: Cypress Semiconductor Cypress Semiconductor, Jose, Silver Glass Aluminum 1.25 22-pin, Ceramic side
Name/Location Assembly (prime) facility:
PAGE
CYPRESS SEMICONDUCTOR
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: CY7C122, CY9122, CY91L22, CY93422, CY93L422 Test paramaters options Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink/Date Fab/Assembly site change/Date Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): (140°C/85%RH) Temperature Cycle (-65°C 150°C) Data Retention Bake, Plastic (185°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 130°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Other: Other: Other: Other: Assembly Yield Class Yield Sort/E-test 150°C None None Process Change/Date: Cross Licensee/Licensor >2000V UL-94V0 None None
Voltage Rating (per STD-008, Method 3018):
PAGE
CYPRESS SEMICONDUCTOR
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: Static Cypress Bangkok, Thailand
Supplier's Part Number
Rated Size/ Speed Type Revision
Size
Design Rule
Fabrication
Passivatio Mold Type Compound
Assembly Line Location
Volt Rating
Availability (mm/yy)
Process Line
CY7C122 -xxPC -xxDC -xxDMB -xxPC -xxDC -xxDMB -xxPC -xxDC -xxDMB ADMB ADMB NOTE: 15ns 45ns 15ns 45ns 25ns 45ns 35ns 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 PDIP 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 CDIP 22.4 CDIP 22.4 PDIP 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 CDIP 22.4 CDIP 7C122A 0.8µ CMOS CMOS CMOS CMOS Oxynitride Oxynitride Oxynitride Oxynitride Sumitomo Jose, CBI, Thailand Jose, CBI, Thailand Jose, CBI, Thailand Jose, CBI, Thailand >2000V
CY9122
7C122A
0.8µ
Sumitomo
>2000V
CY91L22
7C122A
0.8µ
Sumitomo
>2000V
CY93422
7C122A
0.8µ
Sumitomo
>2000V
CY93L422PC
"xx" replaces speed grades device. Options 7C122 15ns, 25ns, 35ns, 45ns Military grade starts 25ns (xMB) 7C122 9122 35ns 91L22, 93422, 93L422.
PAGE
CYPRESS SEMICONDUCTOR
DEVICE RELIABILITY SUMMARY
Marketing Part: Description:
CY7C122 22-pin PDIP 22-pin CDIP
Wafer Fab: Assembly:
Round Rock, Cypress Bangkok, Thailand
High Temperature Dynamic Operating Life Family Data1(HTOL, 5.75V, 150°C), Early Failure Rate Device CY7C185-PC CY7C185-PC CY7C185-PC Assy Lot# 219404141 219404140 219407517 2409204 2409204 2421297 Hours 0/510 0/977 0/3782 Cumulative 0/5269
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C), Long Term Failrue Rate Device CY7C122-PC Assy Lot# 219407781 2419092 Hours 0/120 Hours 0/120 Cumulative 0/120
High Temperature Dynamic Operating Life Family Data2 (HTOL, 5.75V, 150°C), Long Term Failrue Rate Device CY7C199-PC CY7C199-PC CY7C199-PC CY7C199-PC Assy Lot# 49300989 903223/4 90909 91734 2315366 2233797 2238148 2239275 Hours 0/200 0/124 0/198 0/125 Hours 0/200 0/124 0/198 0/125 1000 Hours 0/200 0/124 0/198 0/125 Cumulative 0/647
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C), Group Device Assy Lot# 2419092 Hours 0/80 Cumulative 0/80
CY7C122-DMB 219407433
SRAM, Technology, QTP# 93133 256K SRAM, Technology, Reliability Monitor #M33005, M33006, M24001, M32001.
PAGE
CYPRESS SEMICONDUCTOR
Temperature Cycle (Condition -65°C 150°C) Precondition Pressure Cooker Test (PCT, 121°C, 100%RH, 15psig) Device CY7C122-PC Assy Lot# 219407781 2419092 Cycles 0/78 Cumulative 0/78
Temperature Cycle Family Data1 (Condition -65°C 150°C)
Device CY7C185-PC
Assy Lot# 219404141
2409204
Cycles 0/45
1000 Cycles 0/45
Cumulative 0/45
Pressure Cooker Family Data1 (PCT, Unbiased, 130°C, 100%RH) Precondition Temperature Cycles, Condition (-65°C 150°C) Device CY7C185-PC Assy Lot# 219404141 2409204 Hours 0/45 Cumulative 0/45
High Accelerated Saturation Test1 (HAST, 5.5V, 140°C, 85%RH) Precondition Temperature Cycles, Condition (-65°C 150°C) Device CY7C185-PC Assy Lot# 219404141 2409204 Hours 0/45 Cumulative 0/45
PAGE
CYPRESS SEMICONDUCTOR
Device Reliability Summary
Static CY7C122 Electrostatic Discharge Human Body Model Circuit 883, Method 3015 +2000 Unit -2000 +2000 Unit -2000 +2000 Unit -2000 (Highest Passing Voltage, +100% Guard-banded)
Latchup Testing Cypress Internal Latch-up Procedure Tests: (2lots) 0/10 Current Injection 200mA Trigger Socket Temp 125°C

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