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Static RAM2.1 PRODUCT DESCRIPTION (for qualification) Inform
Top Searches for this datasheetCY7C122 Static RAM2.1 PRODUCT DESCRIPTION (for qualification) Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C122 Static RAM, Separate Cypress Semiconductor 7C122A Aug./1994 What markings Die: Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV): DIE/FAB DESCRIPTION Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: None CMOS, Double Poly, Single Metal 0.8µm SiO2 Cypress Semiconductor Round Rock, Generic Process Technology/Design Rule (µ-drawn): Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process Metal Composition: Metal TiW, SiAl, LTO, Oxynitride PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Epoxy Thermocompression Copper Solder, 85%Sn 15%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Cypress Semiconductor, Jose, Cypress Semiconductor/ Silver Epoxy Gold 22-pin, Plastic side Sumitomo EME-6300H(R) Name/Location Assembly (prime) facility: PAGE CYPRESS SEMICONDUCTOR HERMETIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Paste Ultrasonic Alloy-42 Solder, 63%Sn 37%Pb Aluminum Attach Dim: Attach Material: Wire Material/Size: Cypress Semiconductor Cypress Semiconductor, Jose, Silver Glass Aluminum 1.25 22-pin, Ceramic side Name/Location Assembly (prime) facility: PAGE CYPRESS SEMICONDUCTOR OTHER INFORMATION approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: CY7C122, CY9122, CY91L22, CY93422, CY93L422 Test paramaters options Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink/Date Fab/Assembly site change/Date Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): (140°C/85%RH) Temperature Cycle (-65°C 150°C) Data Retention Bake, Plastic (185°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 130°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Other: Other: Other: Other: Assembly Yield Class Yield Sort/E-test 150°C None None Process Change/Date: Cross Licensee/Licensor >2000V UL-94V0 None None Voltage Rating (per STD-008, Method 3018): PAGE CYPRESS SEMICONDUCTOR PRODUCT INFORMATION QUALIFICATION SIMILARITY Product Family: Division: Static Cypress Bangkok, Thailand Supplier's Part Number Rated Size/ Speed Type Revision Size Design Rule Fabrication Passivatio Mold Type Compound Assembly Line Location Volt Rating Availability (mm/yy) Process Line CY7C122 -xxPC -xxDC -xxDMB -xxPC -xxDC -xxDMB -xxPC -xxDC -xxDMB ADMB ADMB NOTE: 15ns 45ns 15ns 45ns 25ns 45ns 35ns 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 PDIP 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 CDIP 22.4 CDIP 22.4 PDIP 22.4 PDIP 22.4 CDIP 22.4 CDIP 22.4 CDIP 22.4 CDIP 7C122A 0.8µ CMOS CMOS CMOS CMOS Oxynitride Oxynitride Oxynitride Oxynitride Sumitomo Jose, CBI, Thailand Jose, CBI, Thailand Jose, CBI, Thailand Jose, CBI, Thailand >2000V CY9122 7C122A 0.8µ Sumitomo >2000V CY91L22 7C122A 0.8µ Sumitomo >2000V CY93422 7C122A 0.8µ Sumitomo >2000V CY93L422PC "xx" replaces speed grades device. Options 7C122 15ns, 25ns, 35ns, 45ns Military grade starts 25ns (xMB) 7C122 9122 35ns 91L22, 93422, 93L422. PAGE CYPRESS SEMICONDUCTOR DEVICE RELIABILITY SUMMARY Marketing Part: Description: CY7C122 22-pin PDIP 22-pin CDIP Wafer Fab: Assembly: Round Rock, Cypress Bangkok, Thailand High Temperature Dynamic Operating Life Family Data1(HTOL, 5.75V, 150°C), Early Failure Rate Device CY7C185-PC CY7C185-PC CY7C185-PC Assy Lot# 219404141 219404140 219407517 2409204 2409204 2421297 Hours 0/510 0/977 0/3782 Cumulative 0/5269 High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C), Long Term Failrue Rate Device CY7C122-PC Assy Lot# 219407781 2419092 Hours 0/120 Hours 0/120 Cumulative 0/120 High Temperature Dynamic Operating Life Family Data2 (HTOL, 5.75V, 150°C), Long Term Failrue Rate Device CY7C199-PC CY7C199-PC CY7C199-PC CY7C199-PC Assy Lot# 49300989 903223/4 90909 91734 2315366 2233797 2238148 2239275 Hours 0/200 0/124 0/198 0/125 Hours 0/200 0/124 0/198 0/125 1000 Hours 0/200 0/124 0/198 0/125 Cumulative 0/647 High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C), Group Device Assy Lot# 2419092 Hours 0/80 Cumulative 0/80 CY7C122-DMB 219407433 SRAM, Technology, QTP# 93133 256K SRAM, Technology, Reliability Monitor #M33005, M33006, M24001, M32001. PAGE CYPRESS SEMICONDUCTOR Temperature Cycle (Condition -65°C 150°C) Precondition Pressure Cooker Test (PCT, 121°C, 100%RH, 15psig) Device CY7C122-PC Assy Lot# 219407781 2419092 Cycles 0/78 Cumulative 0/78 Temperature Cycle Family Data1 (Condition -65°C 150°C) Device CY7C185-PC Assy Lot# 219404141 2409204 Cycles 0/45 1000 Cycles 0/45 Cumulative 0/45 Pressure Cooker Family Data1 (PCT, Unbiased, 130°C, 100%RH) Precondition Temperature Cycles, Condition (-65°C 150°C) Device CY7C185-PC Assy Lot# 219404141 2409204 Hours 0/45 Cumulative 0/45 High Accelerated Saturation Test1 (HAST, 5.5V, 140°C, 85%RH) Precondition Temperature Cycles, Condition (-65°C 150°C) Device CY7C185-PC Assy Lot# 219404141 2409204 Hours 0/45 Cumulative 0/45 PAGE CYPRESS SEMICONDUCTOR Device Reliability Summary Static CY7C122 Electrostatic Discharge Human Body Model Circuit 883, Method 3015 +2000 Unit -2000 +2000 Unit -2000 +2000 Unit -2000 (Highest Passing Voltage, +100% Guard-banded) Latchup Testing Cypress Internal Latch-up Procedure Tests: (2lots) 0/10 Current Injection 200mA Trigger Socket Temp 125°C Other recent searchesTNY264P - TNY264P TNY264P Datasheet TMS320 - TMS320 TMS320 Datasheet TMS320C54x - TMS320C54x TMS320C54x Datasheet SC3035B-1 - SC3035B-1 SC3035B-1 Datasheet PLX9080 - PLX9080 PLX9080 Datasheet PLX9050 - PLX9050 PLX9050 Datasheet AQW610EH - AQW610EH AQW610EH Datasheet AQW612EH - AQW612EH AQW612EH Datasheet 2SA608 - 2SA608 2SA608 Datasheet
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