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PRELIMINARY DATA TYPE STD4NB40 DS(on) TYPICAL RDS(on) 1.47 E
Top Searches for this datasheetSTD4NB40 PRELIMINARY DATA TYPE STD4NB40 DS(on) TYPICAL RDS(on) 1.47 EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED VERY INTRINSIC CAPACITANCES GATE CHARGE MINIMIZED IPAK TO-251 (Suffix "-1") DESCRIPTION Using latest high voltage MESH OVERLAYprocess, SGS-Thomson designed advanced family power MOSFETs with outstanding performances. patent pending strip layout coupled with Company's proprietary edge termination structure, gives lowest RDS(on) area, exceptional avalanche dv/dt capabilities unrivalled gate charge switching characteristics. APPLICATIONS SWITCH MODE POWER SUPPLIES (SMPS) DC-AC CONVERTERS WELDING EQUIPMENT UNINTERRUPTIBLE POWER SUPPLIES MOTOR DRIVE DPAK TO-252 (Suffix "T4") INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol dv/dt( Parameter Drain-source Voltage Drain- gate Voltage Gate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) Total Dissipation Derating actor Peak Diode Recovery voltage slope Storage emperature Max. perating Junction Temperature Value 14.8 3.7A, di/dt A/µs, V(BR)DSS, TJMAX Pulse width limited safe operating area February 1998 STD4NB40 THERMAL DATA hj-ca Rthj -amb thc- Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature Soldering Purpose oC/W AVALANCHE CHARACTERISTICS Symb Parameter Avalanche Current, Repetitive Not-Repetitive (pulse width limited max, Single Pulse Avalanche Energy (starting Valu Unit ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified) Symb (BR)DSS Parameter Drain-source Breakdown Voltage Test Cond ition Min. Max. Zero Voltage Rating Drain Current (VGS Rating Gate-body Leakage Current Symb GS(th) ID(o Parameter Gate Threshold Voltage Test Cond ition =2.3 Min. 1.47 Max. Static Drain-source Resistance State Drain Current D(on) DS(on) DYNAMIC Symb Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse ransfer Capacitance Test Cond ition D(on) DS(on) =2.3 Min. Max. STD4NB40 ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symb d(on) Parameter Turn-on Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Cond ition (see test circuit, figure =4.7 Min. 14.5 Max. SWITCHING Symb r(Vof Parameter Off-voltage Rise Time Fall Time Cross-over Time Test Cond ition (see test circuit, figure Min. Max. SOURCE DRAIN DIODE Symb Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current 10.5 Test Cond ition Min. Max. di/dt A/µs (see test circuit, figure Pulsed: Pulse duration duty cycle Pulse width limited safe operating area STD4NB40 Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform Fig. Switching Times Test Circuits Resistive Load Fig. Gate Charge test Circuit Fig. Test Circuit Inductive Load Switching Diode Recovery Times STD4NB40 TO-251 (IPAK) MECHANICAL DATA DIM. MIN. 0.45 0.48 15.9 0.95 16.3 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.031 0.64 TYP. MAX. 0.85 0.012 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.039 MIN. 0.086 0.035 0.027 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.031 0.212 0.033 0068771-E STD4NB40 TO-252 (DPAK) MECHANICAL DATA MIN. 0.03 0.64 0.45 0.48 9.35 0.023 TYP. MAX. 0.23 10.1 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.252 0.173 0.368 0.031 0.039 inch TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397 DIM. DETAIL DETAIL 0068772-B STD4NB40 Information furnished believed accurate reliable. However, SGS-THOMSON Microelectronics assumes responsability consequences such information infringement patents other rights third parties which results from use. license granted implication otherwise under patent patent rights SGS-THOMSON Microelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. SGS-THOMSON Microelectronics products authorized critical components life support devices systems without express written approval SGS-THOMSON Microelectonics. 1998 SGS-THOMSON Microelectronics Printed Italy Rights Reserved SGS-THOMSON Microelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Italy Japan Korea Malaysia Malta Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A Other recent searchesSPLC562C - SPLC562C SPLC562C Datasheet SMD914V - SMD914V SMD914V Datasheet MN54AC258-X - MN54AC258-X MN54AC258-X Datasheet MB501LV - MB501LV MB501LV Datasheet 504LV - 504LV 504LV Datasheet CY7C161 - CY7C161 CY7C161 Datasheet CY7C162 - CY7C162 CY7C162 Datasheet BSS84 - BSS84 BSS84 Datasheet ABX0027T - ABX0027T ABX0027T Datasheet
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