Characteristics Test Method Unless otherwise specified, test measureme

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Characteristics Test Method Unless otherwise specified, test measureme

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Perfomance Characteristics (Multilayer Varistors) (Electrical)
Characteristics Test Method Unless otherwise specified, test measurements (initial/after tests) shall made temperature relative humidity %RH. results obtained doubted further test shall carried temperature 20±2 relative humidity %RH. maximum voltage that applied continuously specified operating temperature range. Voltage between terminals with specified measuring current 100µA applied called 100µA. measurement shall made fast possible avoid heat affection. Capacitance shall measured kHz±10 2.0Vrms with application bias voltage. maximum energy within varistor voltage change when single impulse current applied. Maximum Peak Current within varistor voltage change when standard impulse current 8/20µs applied times with interval minutes. change 100µA shall measured after specified pulse applied 1000 times with inteval seconds room temperature. Pulse Life
Standard Test Condition
Max. Allowable Voltage
Varistor Voltage
Capacitance Maximum Energy Maximum Peak Current
meet specified value.
100µA/V100µA
Temperature Coefficient Varistor Voltage Temperature Coefficient Capacitance
Coefficient indicating dependency characteristics temperature. This shown change 100µA per/degres ambient temperature This shown maximum capacitance change ambient temperature from
±0.3%/
Design Specifications subject change without notice. factory technical specifications before purchase and/or use. Whenever doubt about safety issues arises from this product, please inform immediately technical consultation.
(Mechanical)
Characteristics Test Methods After securing specimen body with tweezers dipping specified soldering flux, specimen shall completely immersed soldering bath having temperature 230±5 seconds. then specimen shall visually examined. specified soldering flax solder following: Soldering Flux: Ethanal solution rosin about weight Solder: Eutectic solder After preheating specimen according following conditions Table-1, specimen shall completely immersed into soldering bath having temperature 270±5 3±0.5 seconds then stored room temperature 24±2 hours. There after change V100µA mechanical damage shall examined. Table-1
Step Temperature Period (seconds)
Solderability
Approximately terminals shall covered with solder uniformly
Resistance Soldering Heat
remarkable mechanical damage (ex. crack) 100µA/V100µA ±10%
(Environmental)
Characteristics Test Methods Solder specimen testing shown Fig.1. Condition specimen each temperature from step this order period shown table specifications. Before measurement after test, specimen shall left stand room temperature 24±2 hours. change V100µA mechanical damage shall examined.
Step Temperature Room Temp. +85±2 Room Temp. Period (minutes)
Temperature Cycle
remarkable mechanical damage (ex. crack) 100µA/V100µA ±10%
cycles
Damp Heat Load
Solder specimen testing shown Fig.1. specimen shall applied continuously Maximum Allowable Voltage specified conditions specified period then stored room temperature normal humidity 24±2 hours. Thereafter, change V100µA mechanical damage shall examined. Ambient condition 40±2 Period 500+24/0 hours Solder specimen testing shown Fig.1. specimen shall applied continuously Maximum Allowable Voltage specified conditions specified period then stored room temperature normalhumidity 24±2hours. Thereafter, change V100µA mechanical damage shall examined. Ambient temp. 85±2 Period 500+24/0 hours
remarkable mechanical damage (ex. crack) 100µA/V100µA ±10%
High Temperature Load (Dry Heat Load)
remarkable mechanical damage (ex. crack) 100µA/V100µA ±10%
Material Glass epoxy/PC board Thickness 1.6mm
Copper foil (0.035mm thickness) Solder resist
Unit:mm
Design Specifications subject change without notice. factory technical specifications before purchase and/or use. Whenever doubt about safety issues arises from this product, please inform immediately technical consultation.
87654321 87654321 87654321
Packaging Standard Packing Quantity
Style Size Code Thickness
Paper taping Pitch 5000 pcs./reel
Embossed taping Pitch 2000 pcs./reel
Bulk 1000 pcs./bag 1000 pcs./bag
(0805)
1.00 1.45
Reel
Paper Taping
Size Code
Symbol
Dim. 1.65 3.50 1.75 2.00 (mm) (0805) ±0.20 ±0.2 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1 max. max.
Embossed Taping
Symbol Dim. f180 f60.0±0.5 13.0±0.5 21.0±0.8 2.0±0.5 9.0±0.3 1.3±0.2 (mm)
Size Code
Symbol
Dim. 1.55 2.35 3.50 1.75 2.00 (mm) (0805) ±0.20 ±0.20 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1 max. max.
Leader Part Taped Tape
Leader part
Recommended Land Dimensions
Land Dimensions
Size Code
Flow Soldering
Reflow Soldering
12(0805)
Design Specifications subject change without notice. factory technical specifications before purchase and/or use. Whenever doubt about safety issues arises from this product, please inform immediately technical consultation.
Application Note
Storage Conditions
store varistor under high temperature high humidities. Store temperature from room temperature below below 70%RH, within months. Before using varistor long period, confirm solderability. Avoid atmospheres full corrosive gases (hydrogen sulfied, sulfurous acid, chlorine, ammonia, etc.) Avoid direct sunlight condensation. Reflow Soldering Large temperature gradients such rapid heating cooling process cause electrical failures mechanical damage varistor. essential that soldering process shall controlled following recomended conditions. Preheating mounted varistor shall preheated sufficiently untill surface temperature them Soldering mounted varistor shall heated under specified "Resistance Soldering Heat" (temperature.:Max.270 Cooling Ater soldering, mounted varistor shall granually cooled room ambient temperature preventing mechanical damages such craking varistor Hand Soldering varistor been specified characteristics when mounted flow soldering reflow soldering. certificated "Hand Soldering". Soldering Flux Solder Soldering Flux content halogen flux shall less, Rosin-based non-activated Soldering flux recommended. Solder eutectic solder (Sn:63, Pb:37) recommended.
Soldering Conditions
Flow soldering flow soldering process. abnormal large thermal mechanical stresses, caused "Temperature Gradient" between mounted varistor melted solder soldering bath, might applied directly varistor, resulting failures damages varistor. essential that soldering process shall controlled following recomended conditions. Preheating mounted varistor shall preheated sufficiently that "Temperature Gradient" between varistor melted solder shall below. Immersion Soldering Bath varistor shall immersed into soldering bath seconds below.
Design Specifications subject change without notice. factory technical specifications before purchase and/or use. Whenever doubt about safety issues arises from this product, please inform immediately technical consultation.

Characteristics Test Method Unless otherwise specified, test measureme

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