Hazard analyses used determine potential deviations from weaknesses sy

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Hazard analyses used determine potential deviations from weaknesses sy

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SEMI EXAMPLES `WHAT HAZARD ANALYSIS
Hazard analyses used determine potential deviations from weaknesses system design that could pose hazard personnel and/or equipment. Hazard Analyses should identify risks, methods reduce risk, actions needed ensure that equipment operated maintained safely. Process Hazard Analyses include FMEAs, Checklists, `What Analyses. `What hazard analysis, brainstorming techniques, form `What questions used identify possible deviations weaknesses design. Once identified, these concerns their potential consequences evaluated risk. `What hazard analyses used determine system compliance with SEMI requirements verify that single point failure operational error should allow immediate exposure personnel, facilities community hazards directly result injury, death equipment loss." `What Analysis meets SEMI requirements equipment that does greater Class hazardous production materials. This analysis completed supplier validated their third party reviewer supplier their third party reviewer working together. Caution: `What hazard analyses based brainstorming. Their thoroughness accuracy dependent upon composition expertise team performing analysis. addition, `What hazard analyses stops single point failure does investigate system further. (i.e., This method would evaluate series failures potential consequence this series.) Several organizations provide training process hazard analyses; following some examples: Process Safety Institute, Division Associations, Inc. American Institute Chemical Engineers http://www.aiche.org/education Intel Training, Process Hazard Analysis Overview, SAF008012 following table contains illustrations questions. These questions based SEMI requirements risk assessments. Examples `What Analyses Questions: WHAT personnel hazards exist loading/ unloading area? RISK Mechanical Risk Cutting Shearing Crushing METHOD REDUCE RISK Hardwired based interlock system integrated with access door. door locked solenoid during automatic operation that operator cannot open door until movement stops. When door opened, power moving actuators disconnected electro-mechanical relays. NRTL listed light curtain installed opening area that object moving towards hazardous area from outside (i.e., human hand) detected. Once activated, movement modules) stops before operator reaches moving parts. Power supply moving actuators disconnected. placing head adequately covered enclosure, order prevent finger trapping, shearing drawing-in. Pressure regulator limited psi. Specification point pressure regulator. Burst pressure regulator pressure rating components set. ACTION REQUIRED further action required
Overpressure occurs?
Equipment Damage
further action
WHAT vacuum pressure high (near atmospheric) vacuum pressure
vacuum pressure
blockage between pressure switch heater assembly? voltage high?
shutter activated spring fails?
RISK Process error resulting wafer damage Process error resulting wafer damage Process error resulting wafer damage Burn-out heater smoke, potential evacuation Dielectric breakdown, overvoltage supplied components power supply failure Potential personnel exposed Laser
METHOD REDUCE RISK Vacuum presence monitored system inhibits operation high vacuum conditions
ACTION REQUIRED further action
Vacuum presence monitored system inhibits operation vacuum conditions
further action
Vacuum presence monitored system inhibits operation vacuum conditions
further action
airflow switch
Test dielectric withstand; power supplies incorporate internal voltage compensations design
Action required airflow switch must installed further actions
Shutter NRTL approved. Information laser shutter (i.e., spring failure, internal tests) required
personnel contacts electrical components? robot axis overruns hits mechanical bumper? pressure?
Electrical shock
incoming voltage. Interlocked doors other enclosures require tool open. place. Linear encoders, hard stops, servo motors components.
Mechanical Damage
Actions Required -Info Laser Shutter needed -Evaluation completed action. Risk level reduced slight action needed; hazard operators action needed
high pressure?
Process error resulting wafer damage Process error resulting wafer damage
presence monitored system inhibits operation vacuum conditions
System integrates pressure regulator with PSIG maximum. Overpressure fault would generated supply shut down valves
Action needed. Validate system withstand PSIG supply pressure
SEMI S2-00 requirements risk assessments found paragraphs: 6.5, 8.5.1 Note: Fire Protection Risk Assessments must completed party qualified determine evaluate fire hazards potential need controls.

Hazard analyses used determine potential deviations from weaknesses sy

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