The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.    


Datasheet Search Engine   
 
Part # or Description: • 5V RS232 Driver • 2SC5066* • "Real Time Clock" • "USB connector" • "blue led" 5mm • 10 watt zener diode • 2N3055* motorola
 
Search Tip: Try entering the part number only. Include a wildcard (eg. lm317* or 1n4148*)

 

 

SO-8 P-Channel enhancement mode power field effect transistors produce


Datasheet Thumbnail

  

Download PDF



Top Searches for this datasheet



NDS8435 Single P-Channel Enhancement Mode Field Effect Transistor
SO-8 P-Channel enhancement mode power field effect transistors produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process especially tailored minimize on-state resistance provide superior switching performance. These devices particularly suited voltage applications such notebook computer power management other battery powered circuits where fast switching, in-line power loss, resistance transients needed.
Features
-7A, -30V. RDS(ON) 0.028 -10V RDS(ON) 0.045 -4.5V. High density cell design extremely RDS(ON). High power current handling capability widely used surface mount package.
Absolute Maximum Ratings
Symbol VDSS VGSS Parameter Drain-Source Voltage Gate-Source Voltage Drain Current Continuous Pulsed
25°C unless otherwise noted
NDS8435
(Note
Units
Maximum Power Dissipation
(Note (Note (Note
TJ,TSTG
Operating Storage Temperature Range
THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case
(Note (Note
°C/W °C/W
1997 Fairchild Semiconductor Corporation
NDS8435 Rev.
Electrical Characteristics 25°C unless otherwise noted)
Symbol Parameter Conditions Units CHARACTERISTICS BVDSS IDSS IGSSF IGSSR VGS(th) RDS(ON) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current -250 55°C Gate Body Leakage, Forward Gate Body Leakage, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance VDS= VGS, -250 125°C -7.0 125°C -4.5 -5.8 ID(on) Ciss Coss Crss tD(on) tD(off) On-State Drain Current Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn Delay Time Turn Rise Time Turn Delay Time Turn Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge -7.0 VGEN RGEN -4.5, -7.0 DYNAMIC CHARACTERISTICS 1500 -0.7 -1.5 -1.1 0.023 0.038 0.037 -100 -2.2 0.028 0.06 0.045
CHARACTERISTICS (Note
SWITCHING CHARACTERISTICS (Note
NDS8435 Rev.
Electrical Characteristics 25°C unless otherwise noted)
Symbol
Notes: junction-to-case case-to-ambient thermal resistance where case thermal reference defined solder mounting surface drain pins. guaranteed design while determined user's board design.
Parameter
Conditions
-2.1
Units
DRAIN-SOURCE DIODE CHARACTERISTICS MAXIMUM RATINGS Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage -2.1
(Note
-0.8
-1.2
J-TA
J-TA
RDS(ON
Typical using board layouts shown below 4.5"x5" FR-4 still environment: 50oC/W when mounted copper. 105oC/W when mounted 0.04 copper. 125oC/W when mounted 0.006 copper.
Scale letter size paper
Pulse Test: Pulse Width 300µs, Duty Cycle 2.0%.
NDS8435 Rev.
Typical Electrical Characteristics
-10V
DRAIN-SOURCE CURRENT
-6.0 -5.0-4.5
DRAIN-SOURCE ON-RESISTANCE
-4.0
-3.0V
-3.5
DS(on), NORMALIZED
-3.5
-4.0
-4.5 -5.0 -6.0
-3.0
-2.5
-0.5
-1.5 DRAIN-SOURCE VOLTAGE
-2.5
DRAIN CURRENT
Figure On-Region Characteristics.
Figure On-Resistance Variation with Drain Current Gate Voltage.
DRAIN-SOURCE ON-RESISTANCE
DS(ON), NORMALIZED
-10V
DS(on) NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
=-7.0A
-10V
125°C
25°C
-55°C
JUNCTION TEMPERATURE (°C)
DRAIN CURRENT
Figure On-Resistance Variation with Temperature.
Figure On-Resistance Variation with Drain Current Temperature.
125°C
GATE-SOURCE THRESHOLD VOLTAGE
-10V
-55°C
-250µA
DRAIN CURRENT
NORMALIZED
25°C
GATE SOURCE VOLTAGE
JUNCTION TEMPERATURE (°C)
Figure Transfer Characteristics.
Figure Gate Threshold Variation with Temperature.
NDS8435 Rev.
Typical Electrical Characteristics (continued)
DRAIN-SOURCE BREAKDOWN VOLTAGE
REVERSE DRAIN CURRENT
1.08 1.06 1.04 1.02 0.98 0.96 0.94
-250µA
DSS, NORMALIZED
125°C
25°C
-55°C
0.01
0.001
JUNCTION TEMPERATURE (°C)
-VSD BODY DIODE FORWARD VOLTAGE
Figure Breakdown Voltage Variation with Temperature.
Figure Body Diode Forward Voltage Variation with Source Current Temperature.
4000
-7.0A
GATE-SOURCE VOLTAGE 2000 CAPACITANCE (pF)
-5.0V
-15V -10V
1000
DRAIN SOURCE VOLTAGE
GATE CHARGE (nC)
Figure Capacitance Characteristics.
Figure Gate Charge Characteristics.
-VDD
d(on)
d(off)
VOUT
PULSE IDTH
INVERTED
Figure Switching Test Circuit.
Figure Switching Waveforms.
NDS8435 Rev.
Typical Electrical Thermal Characteristics (continued)
STEADY-STATE POWER DISSIPATION
-10V
TRANSCONDUCTANCE (SIEMENS)
-55°C 25°C 125°C
4.5"x5" FR-4 Board Still
DRAIN CURRENT
COPPER MOUNTING AREA
Figure Transconductance Variation with Drain Current Temperature.
Figure SO-8 Maximum Steady-State Power Dissipation versus Copper Mounting Area.
STEADY-STATE DRAIN CURRENT
DRAIN CURRENT
-10V
4.5"x5" FR-4 Board Still
0.03
SINGLE PULSE Note 25°C
DRAIN-SOURCE VOLTAGE
COPPER MOUNTING AREA
0.01
Figure Maximum Steady-State Drain Current versus Copper Mounting Area.
TRANSIENT THERMAL RESISTANCE
r(t), NORMALIZED EFFECTIVE
0.05 0.02 0.01 Single Pulse
Figure Maximum Safe Operating Area.
.0001
r(t) Note
P(pk)
Duty Cycle, .001
TIME (sec)
Figure Transient Thermal Response Curve.
Note: Thermal characterization performed using conditions described note Transient thermal response will change depending circuit board design.
NDS8435 Rev.
SO-8 Tape Reel Data Package Dimensions
SOIC(8lds) Packaging Configuration: Figure
Packaging Description:
ROST DEVICES
ROST ADIO
NUMB PEEL STREN _gms
Antistatic Cover Tape
Label
SOIC-8 parts shipped tape. carrier tape made from dissipative (carbon filled) polycarbonate resin. cover tape multilayer film (Heat Activated Adhesive nature) primarily composed polyester film, adhesive layer, sealant, anti-static sprayed agent. These reeled parts standard option shipped with 2,500 units 330cm diameter reel. reels dark blue color made polystyrene plastic (antistatic coated). Other option comes units 177cm diameter reel. This some other options further described Packaging Information table. These full reels individually barcode labeled placed inside standard intermediate (illustrated figure 1.0) made recyclable corrugated brown paper. contains reels maximum. these boxes placed inside barcode labeled shipping which comes different sizes depending number parts shipped.
Static Dissipative Embossed Carrier Tape
F63TNR Label Customized Label
F852 9959 F852 9959 F852 9959 F852 9959
SOIC (8lds) Packaging Information Packaging Option Packaging type Reel/Tube/Bag Reel Size Dimension (mm) Weight unit (gm) Weight Reel (kg) Note/Comments Standard flow code) 2,500 343x64x343 5,000 0.0774 0.6060 L86Z Rail/Tube 530x130x83 30,000 0.0774 F011 4,000 343x64x343 8,000 0.0774 0.9696 D84Z 184x187x47 1,000 0.0774 0.1182
F852 9959
SOIC-8 Unit Orientation
343mm 342mm 64mm Standard Intermediate Label F63TNR Label sample
LOT: CBVK741B019 FSID: FDS9953A QTY: 2500 SPEC:
F63TNLabel F63TN Label Label
(F63TNR)3
D/C1: D9842 D/C2:
QTY1: QTY2:
SPEC REV: CPN: N/F:
SOIC(8lds) Tape Leader Trailer Configuration: Figure
Carrier Tape Cover Tape
Components Trailer Tape 640mm minimum empty pockets Leader Tape 1680mm minimum empty pockets
July 1999, Rev.
SO-8 Tape Reel Data Package Dimensions, continued
SOIC(8lds) Embossed Carrier Tape Configuration: Figure
User Direction Feed
Dimensions millimeter type SOIC(8lds) (12mm)
6.50 +/-0.10
5.30 +/-0.10
12.0 +/-0.3
1.55 +/-0.05
1.60 +/-0.10
1.75 +/-0.10
10.25
5.50 +/-0.05
+/-0.1
+/-0.1
+/-0.10
0.450 +/0.150
+/-0.3
0.06 +/-0.02
Notes: dimensions determined with respect EIA/Jedec RS-481 rotational lateral movement requirements (see sketches
maximum Typical component cavity center line
0.5mm maximum
maximum component rotation
0.5mm maximum
Sketch (Side Front Sectional View)
Component Rotation
Sketch (Top View)
Typical component center line
Sketch (Top View)
Component lateral movement
SOIC(8lds) Reel Configuration: Figure
Component Rotation
Measured
detail
Diameter Option
detail
Diameter Option
Measured DETAIL
Dimensions inches millimeters
Tape Size
12mm
Reel Option
7.00 177.8 13.00
0.059 0.059
+0.020/-0.008 +0.5/-0.2 +0.020/-0.008 +0.5/-0.2
0.795 20.2 0.795 20.2
2.165 7.00
0.488 +0.078/-0.000 12.4 +2/0 0.488 +0.078/-0.000 12.4 +2/0
0.724 18.4 0.724 18.4
(LSL-USL)
0.469 0.606 11.9 15.4 0.469 0.606 11.9 15.4
12mm
1998 Fairchild Semiconductor Corporation
July 1999, Rev.
SO-8 Tape Reel Data Package Dimensions, continued
SOIC-8 Code
Scale letter size paper
Dimensions shown below inches [millimeters]
Part Weight unit (gram): 0.0774
September 1998, Rev.
TRADEMARKS
following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks.
Quiet SeriesFAST® FASTrGTOHiSeCDISCLAIMER
SeriesSuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8
TinyLogicUHCVCX
FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices critical component component life support device system whose failure perform systems which, intended surgical implant into reasonably expected cause failure life body, support sustain life, whose support device system, affect safety failure perform when properly used accordance with instructions provided labeling, effectiveness. reasonably expected result significant injury user. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design.
Preliminary
First Production
Identification Needed
Full Production
Obsolete
Production
This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only.

Other recent searches


PD-20240 - PD-20240   PD-20240 Datasheet
MP2104 - MP2104   MP2104 Datasheet
IS42SM81600E - IS42SM81600E   IS42SM81600E Datasheet
IS42SM16800E - IS42SM16800E   IS42SM16800E Datasheet
IS42SM32400E - IS42SM32400E   IS42SM32400E Datasheet
IS42RM81600E - IS42RM81600E   IS42RM81600E Datasheet
IS42RM16800E - IS42RM16800E   IS42RM16800E Datasheet
IS42RM32400E - IS42RM32400E   IS42RM32400E Datasheet
IS42SMxxx - IS42SMxxx   IS42SMxxx Datasheet
IS42RMxxx - IS42RMxxx   IS42RMxxx Datasheet
IPB017N06N3 - IPB017N06N3   IPB017N06N3 Datasheet
IMX35RMAD - IMX35RMAD   IMX35RMAD Datasheet
CP20251 - CP20251   CP20251 Datasheet
AM3N-S - AM3N-S   AM3N-S Datasheet

 

Privacy Policy | Disclaimer
© 2012 Datasheet Archive