Package Electrical Characterization National Semiconductor mainta
|
|
|
Top Searches for this datasheet
Package Electrical Characterization
Package Electrical Characterization
National Semiconductor maintains package group which specializes electrical characterization packages. This group access complete measurement consisting network analyzers, TDR's (time domain reflection), LCRZ meters. addition, this group also involved electrical parameter extraction packages using computer-aided simulation techniques workstations like SUNSPARC10 SUN630MP series. following parameters provided packages: LEAD CAPACITANCE (Cs, package lead capacitance also components. self-capacitance load capacitance other component mutual capacitance. self-capacitance load capacitance, capacitance lead with respect ground conductor ground plane. dependent geometry lead dielectric constant material. self-capacitance parallel self-inductance. Mutual capacitance, lead-to-lead capacitance. LEAD INDUCTANCE (Ls, package lead inductance components. self-inductance other mutual inductance. Self-inductance, lead inductance loop formed subsystem comprising bond wire, package lead, ground conductor ground plane. typically series with resistance subsystem. self-inductance very much function loop length. closer lead ground plane, smaller self-inductance. Mutual inductance, inductance that exists between signal leads result magnetic coupling between leads.
resistance package pins leads, Capacitance including lead-to-lead self- loading capacitance, Inductance including self-inductance mutual inductance. parameters following packages representative either calculated measured values.
Plastic Packages Ceramic Packages (JEDEC) Cerdip SSOP (JEDEC) MDIP PLCC PQFP Table lists typical electrical parameters some packages mentioned earlier. electrical parameters packages that listed, please contact your local National Semiconductor representative.
Note: Since ceramic quad flat package (CQFP) grid array (PGA) packages custom designed depending number ground power planes, electrical parameters each product different. These parameters obtained specific product contacting local National sales representative.
Electrical Equivalent Lead
typical electrical lumped model lead shown Figure
Terms Definitions Used This Databook
LEAD RESISTANCE This resistance cause voltage (IR) drops package. FIGURE
MS011813-1
2000 National Semiconductor Corporation
MS011813
www.national.com
Package Electrical Characterization
Electrical Equivalent Lead
LEAD COUNT Cerdip CPGA MDIP MSOP PLCC PQFP (NARROW) JEDEC (WIDE) JEDEC TQFP TSSOP
Note Capacitance inductance values within 10%.
(Continued)
TABLE Summary Package Electrical Data RESISTANCE INDUCTANCE (nH) 3.5-6 3.8-8 7-16 4-15 INDUCTANCE (nH) CAPACITANCE (pF) 0.5-1 CAPACITANCE (pF)
1-2.5 1.6-5.5
0.6-1.6 0.8-4.1 3-10
0.3-2.1
5-10
0.08
1.5-3 1.4-4.8 2.5-9.5
0.3-1 0.4-1 0.3-0.9 0.5-1.8
0.4-1.4 0.7-1.8 1.2-4.44
4.5-12.5 6.8-19.5
5.2-9.8 7.6-10.0 8-11 8.8-14.6 9.0-11.7 2.0-2.7 2.2-3.1 2.5-4.9 2.2-5.0 1.5-3.5
2.3-4.4 2.3-3.3 3.2-5.2 6.5-9.6 0.8-1.5
0.5-0.8
1.3-2.0 0.9-1.2
0.5-0.9 0.5-0.7
3.0-4.0 2.5-4.5
0.25-0.35 0.3-0.5 0.3-0.5 0.5-0.9 0.5-0.9 0.1-0.3
0.3-0.7
0.3-0.5
0.1-0.3 0.1-0.3
2.5-4.5 3-5.5
0.3-0.6 0.8-1.6 0.1-0.4
0.28
0.6-1.2
1-2.5
0.4-0.7
0.35
Note Bond wire resistance included above data. bond wire resistance typically between m-70
Simulation/Modeling Methodology
simulations done using method-of-moment-based software tool, which solves Maxwell equations lines give matrix inductance matrix capacitance values system conductors. simulations performed assuming ground conductor ground plane layer printed circuit board.
www.national.com
Package Electrical Characterization
Simulation/Modeling Methodology
(Continued)
INDUCTANCE MEASUREMENT inductance measurement done using scheme shown Figure this case, leads bonded attach paddle inductance measured. CAPACITANCE MEASUREMENT measurement scheme measuring capacitance shown Figure capacitance lead measured with respect ground with other leads shorted ground.
MS011813-2
MS011813-3
FIGURE
FIGURE
LIFE SUPPORT POLICY NATIONAL'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT GENERAL COUNSEL NATIONAL SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body, support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user.
National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com www.national.com National Semiconductor Europe Fax: 80-530 Email: europe.support@nsc.com Deutsch Tel: 80-530 English Tel: 80-532 Tel: 80-532 Italiano Tel: 80-534
critical component component life support device system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness.
National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: sea.support@nsc.com
National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507
National does assume responsibility circuitry described, circuit patent licenses implied National reserves right time without notice change said circuitry specifications.
Other recent searches
VF596E - VF596E VF596E Datasheet
TLV320AIC32 - TLV320AIC32 TLV320AIC32 Datasheet
S82K - S82K S82K Datasheet
MSM5299A - MSM5299A MSM5299A Datasheet
KXP74 - KXP74 KXP74 Datasheet
CXP81840A - CXP81840A CXP81840A Datasheet
81848A - 81848A 81848A Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
