| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
CHANNEL 100V 0.021 TO247 STripFETPOWER MOSFET TYPE 55NE10 DS
Top Searches for this datasheetSTW55NE10 CHANNEL 100V 0.021 TO247 STripFETPOWER MOSFET TYPE 55NE10 DS(on) <0.027 TYPICAL RDS(on) 0.021 EXCEPTIONAL dv/dt CAPABILITY 100% AVALANCHE TESTED GATE CHARGE APPLICATION ORIENTED CHARACTERIZATION DESCRIPTION This Power MOSFET latest development STMicroelectronics unique "Single Feature SizeTM" strip-based process. resulting transistor shows extremely high packing density on-resistance, rugged avalanche characteristics less critical alignment steps therefore remarkable manufacturing reproducibility. APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING SOLENOID RELAY DRIVERS MOTOR CONTROL, AUDIO AMPLIFIERS DC-DC DC-AC CONVERTERS AUTOMOTIVE ENVIRONMENT TO-247 INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Drain-source Voltage (VGS Drain- gate Voltage ate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) otal Dissipation Derating Factor dv/dt Peak Diode Recovery voltage slope Storage Temperature Max. Operating Junction Temperature Value di/dt A/µs, V(BR)DSS, TJMAX V/ns Pulse width limited safe operating area January 1999 STW55NE10 THERMAL DATA -case Rthj -amb thc-sink Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature Soldering Purpose 0.83 oC/W AVALANCHE CHARACTERISTICS Symbo Parameter Avalanche Current, Repetitive Not-Repetitive (pulse width limited max) Single Pulse Avalanche Energy (starting Value Unit ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified) Symbo (BR)DSS IGSS Parameter Drain-source Breakdown Voltage Test ditions Min. Typ. Max. Unit Rating Zero Gate Voltage Drain Current Rating Gate-body Leakage Current (VDS Symbo GS(th) DS(on) Parameter Gate Threshold Voltage Static Drain-source Resistance State Drain Current Test ditions 27.5 Min. Typ. 0.021 Max. 0.027 Unit ID(o DS(on DYNAMIC Symbo Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test ditions ID(o DS(on Min. Typ. 4350 Max. Unit STW55NE10 ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symbo d(on) Parameter Turn-on Time Rise Time Total Charge Gate-Source Charge Gate-Drain Charge Test ditions =4.7 (see test circuit, figure Min. Typ. Max. Unit SWITCHING Symbo (Voff) Parameter Off-voltage Rise Fall Cross-over Time Test ditions =4.7 (see test circuit, figure Min. Typ. Max. Unit SOURCE DRAIN DIODE Symbo Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current 10.5 di/dt A/µs (see test circuit, figure Test ditions Min. Typ. Max. 1100 Unit Pulsed: Pulse duration duty cycle Pulse width limited safe operating area Safe Operating Area Thermal Impedance STW55NE10 Output Characteristics Transfer Characteristics Transconductance Static Drain-source Resistance Gate Charge Gate-source Voltage Capacitance Variations STW55NE10 Normalized Gate Threshold Voltage Temperature Normalized Resistance Temperature Source-drain Diode Forward Characteristics STW55NE10 Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform Fig. Switching Times Test Circuits Resistive Load Fig. Gate Charge test Circuit Fig. Test Circuit Inductive Load Switching Diode Recovery Times STW55NE10 TO-247 MECHANICAL DATA MIN. 3.55 15.3 19.7 14.2 34.6 3.65 0.079 0.140 10.9 15.9 20.3 14.8 0.602 0.776 0.559 0.413 1.362 0.217 0.118 0.144 TYP. MAX. MIN. 0.185 0.087 0.016 0.039 0.079 0.118 0.429 0.626 0.779 0.582 inch TYP. MAX. 0.209 0.102 0.031 0.055 0.094 0.134 DIM. P025P STW55NE10 Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specification mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics. logo trademark STMicroelectronics 1998 STMicroelectronics Printed Italy Rights Reserved STMicroelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Italy Japan Korea Malaysia Malta Mexico Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A. http://www.st.com Other recent searchesTI-30X - TI-30X TI-30X Datasheet S1H5 - S1H5 S1H5 Datasheet MAX8790A - MAX8790A MAX8790A Datasheet LA-601 - LA-601 LA-601 Datasheet LA207B - LA207B LA207B Datasheet ICS12 - ICS12 ICS12 Datasheet HSB88YP - HSB88YP HSB88YP Datasheet FAN7529 - FAN7529 FAN7529 Datasheet CC2511 - CC2511 CC2511 Datasheet
Privacy Policy | Disclaimer |