These N-Channel enhancement mode power field effect transistors produc

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NDP6051 NDB6051 N-Channel Enhancement Mode Field Effect Transistor
These N-Channel enhancement mode power field effect transistors produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process been especially tailored minimize on-state resistance, provide superior switching performance, withstand high energy pulses avalanche commutation modes. These devices particularly suited voltage applications such automotive, DC/DC converters, motor controls, other battery powered circuits where fast switching, in-line power loss, resistance transients needed.
Features
RDS(ON) 0.022 VGS= Critical electrical parameters specified elevated temperature. Rugged internal source-drain diode eliminate need external Zener diode transient suppressor. 175°C maximum junction temperature rating. High density cell design extremely RDS(ON). TO-220 TO-263 (D2PAK) package both through hole surface mount applications.
Absolute Maximum Ratings
Symbol VDSS VDGR VGSS Parameter Drain-Source Voltage
25°C unless otherwise noted
NDP6051 0.67
NDB6051
Units
Drain-Gate Voltage (RGS Gate-Source Voltage Continuous Nonrepetitive Drain Current Continuous Pulsed
Total Power Dissipation 25°C Derate above 25°C
W/°C
TJ,TSTG
Operating Storage Temperature Range Maximum lead temperature soldering purposes, 1/8" from case seconds
1997 Fairchild Semiconductor Corporation
NDP6051 Rev.
Electrical Characteristics 25°C unless otherwise noted)
Symbol Parameter Conditions Units DRAIN-SOURCE AVALANCHE RATINGS (Note BVDSS IDSS IGSSF IGSSR VGS(th) RDS(ON) ID(on) Single Pulse Drain-Source Avalanche Energy Maximum Drain-Source Avalanche Current
CHARACTERISTICS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current 125°C Gate Body Leakage, Forward Gate Body Leakage, Reverse VGS, 125°C Static Drain-Source On-Resistance 125°C On-State Drain Current Forward Transconductance 0.018 0.03 -100
CHARACTERISTICS (Note Gate Threshold Voltage 0.022 0.04
DYNAMIC CHARACTERISTICS
Ciss Coss Crss
tD(on) tD(off)
Input Capacitance Output Capacitance Reverse Transfer Capacitance
1220
SWITCHING CHARACTERISTICS (Note Turn Delay Time Turn Rise Time Turn Delay Time Turn Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge RGEN
NDP6051 Rev.
Electrical Characteristics 25°C unless otherwise noted)
Symbol Parameter Conditions Units DRAIN-SOURCE DIODE CHARACTERISTICS Maximum Continuos Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage (Note 125°C Reverse Recovery Time Reverse Recovery Current dIF/dt A/µs
THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient 62.5 °C/W °C/W
Note: Pulse Test: Pulse Width Duty Cycle 2.0%.
NDP6051 Rev.
Typical Electrical Characteristics
DRAIN-SOURCE CURRENT
DS(on) NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
6.0V
DRAIN-SOURCE VOLTAGE
DRAIN CURRENT
Figure On-Region Characteristics.
Figure On-Resistance Variation with Gate Voltage Drain Current.
DRAIN-SOURCE ON-RESISTANCE
1.75 1.25 0.75
DRAIN-SOURCE ON-RESISTANCE
2.25 1.75 1.25 0.75
DS(ON) NORMALIZED
DS(on) NORMALIZED
125°C
25°C -55°C
JUNCTION TEMPERATURE (°C)
DRAIN CURRENT
Figure On-Resistance Variation with Temperature.
Figure On-Resistance Variation with Drain Current Temperature.
GATE-SOURCE THRESHOLD VOLTAGE
DRAIN CURRENT
-55°C 125°C
25°C
GS(th), NORMALIZED
250µA
GATE SOURCE VOLTAGE
JUNCTION TEMPERATURE (°C)
Figure Transfer Characteristics.
Figure Gate Threshold Variation With Temperature.
NDP6051 Rev.
Typical Electrical Characteristics (continued)
1.15 NORMALIZED DRAIN-SOURCE BREAKDOWN VOLTAGE
REVERSE DRAIN CURRENT
250µA
125°C 25°C
1.05
-55°C
0.01
0.95
0.001
JUNCTION TEMPERATURE (°C)
0.0001
BODY DIODE FORWARD VOLTAGE
Figure Breakdown Voltage Variation with Temperature.
Figure Body Diode Forward Voltage Variation with Current Temperature.
3000 2000 CAPACITANCE (pF)
GATE-SOURCE VOLTAGE
Ciss Coss
1000
Crss
DRAIN SOURCE VOLTAGE
GATE CHARGE (nC)
Figure Capacitance Characteristics.
Figure Gate Charge Characteristics.
d(on)
d(off)
VOUT
INVERTED
PULSE WIDTH
Figure Switching Test Circuit.
Figure Switching Waveforms.
NDP6051 Rev.
Typical Electrical Characteristics (continued)
gFS, TRANSCONDUCTANCE (SIEMENS)
DS=10V
-55°C 25°C
DRAIN CURRENT
125°C
SINGLE PULSE 25°C
DRAIN CURRENT
DRAIN-SOURCE VOLTAGE (V))
Figure Transconductance Variation with Drain Current Temperature.
Figure Maximum Safe Operating Area.
TRANSIENT THERMAL RESISTANCE
r(t), NORMALIZED EFFECTIVE
r(t) °C/W
0.05 P(pk)
0.05 0.03 0.02 0.01 0.01
0.02 0.01 Single Pulse
Duty Cycle, ,TIME 1000
0.02
0.05
Figure Transient Thermal Response Curve.
NDP6051 Rev.

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