High Count (HPC Connectors Clark OBJECTIVE: This specification defines
|
|
|
Top Searches for this datasheet
BUS-12-090 05/18/95
High Count (HPC Connectors Clark OBJECTIVE: This specification defines performance, test, quality reliability requirements product. SCOPE: This specification applicable termination characteristics family products which provides mechanical electrical interconnection daughter mother PCB. GENERAL: This document composed following sections: Paragraph TABLE Title OBJECTIVE SCOPE GENERAL APPLICABLE DOCUMENTS REQUIREMENTS Qualification Material Finish Design Construction ELECTRICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS ENVIRONMENTAL CONDITIONS QUALITY ASSURANCE PROVISIONS Equipment Calibration Inspection Conditions Sample Quantity Description Acceptance Qualification Testing Requalification Testing QUALIFICATION TESTING MATRIX
BUS-12-090 05/18/95
High Count (HPC Connectors Clark APPLICABLE DOCUMENTS: Specifications 4.1.1 4.1.2 Engineering drawings Process drawings
Military Standards 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6 MIL-STD-202F: Test Methods Electronic Electrical Component Parts. MIL-STD-1344A: Test Methods Electrical Connectors MIL-STD-2166: Connectors, Electrical, Compliant MIL-G-45204: Gold Plating (Electrodeposited) MIL-P-81728: SnPb Plating MIL-P-45209: Palladium Alloy Plating
Federal Specifications 4.3.1 QQ-N-290 Nickel Plating QQ-C-533 Beryllium Copper Alloy Copper Strip
Other Standards Specifications 4.4.1 4.4.2 UL94-VO: Flammability UL-STD-498
Berg Specifications 4.5.1 4.5.2 4.5.3 4.5.4 4.5.5 4.5.6 4.5.7 BUS-03-114 BUS-03-113 BUS-03-108 BUS-03-404 BUS-03-405 BUS-03-111 BUS-03-110
BUS-12-090 05/18/95
High Count (HPC Connectors Clark Berg Reports Supporting Data
4.6.1 4.6.2 4.6.3 4.6.4 4.6.5 4.6.6 4.6.7 4.6.8 REQUIREMENTS:
EL-93-07-045 (Qualification Test Matrix) EL-94-04-055 (Compliant Pin) EL-94-05-053 (Compliant Pin) EL-94-08-006 (Solderability) EL-94-08-028 -028A (Pin Torque Strength) EL-94-09-025 (Berg Environmental Sequence Bellcore 3-Gas Central Office) EL-95-02-053 (Normal Force) EL-95-05-042 (Resistance Solder Heat)
IMFG,
Qualification Connectors furnished under this specification shall capable meeting qualification test requirements specified herein.
Material material each component shall specified herein equivalent. 5.2.1 Receptacle Terminal. receptacle terminal shall Beryllium Copper Alloy C17410 other copper alloy specified product drawing. Header Pin. shall Phosphor Bronze Alloy C51000 accordance with ASB-159 other copper alloy specified product drawing. Housing. Housings shall molded using glass-filled Polyphenylene Sulfide. material shall rated accordance with UL-94.
5.2.2
5.2.3
Finish finish applicable components shall specified herein equivalent. 5.3.1 Gold Plating. When gold plating specified, receptacle terminals header pins shall plated with specified minimum thickness shown product drawings) gold over microinches, minimum, nickel. gold deposit shall meet requirements MIL-G-45204, Type Grade nickel deposit shall meet requirements QQ-N-290, Class
BUS-12-090 05/18/95
High Count (HPC Connectors Clark 5.3.2
Plating. When plating specified, terminals pins shall plated with thin gold flash over specified minimum thickness shown product drawings) palladium alloy over microinches, minimum, nickel. palladium allow deposit shall meet requirements MIL-P-45209 nickel deposit shall meet requirements QQ-N-290, Class Sn-Pb Plating. Receptacle tails shall plated with minimum microinches Sn-Pb over minimum microinches nickel. plating shall meet requirements MIL-P-81728.
5.3.3
Design Construction Connectors shall design, construction, physical dimensions specified applicable product drawing.
ELECTRICAL CHARACTERISTICS Contact Resistance, Level (LLCR) level contact resistance shall exceed milliohms milliohms after environmental exposure) when measured accordance with MILSTD-1344A, Method 3002.1. following details shall apply: Method Connection Attach current voltage leads shown Figure Test Voltage millivolts open circuit. Test Current exceed milliamperes.
Insulation Resistance insulation resistance unmated connectors shall less than megohms when measured accordance with MIL-STD-202F, Method 302. following details shall apply: Test Voltage volts Electrification Time minutes, unless otherwise specified. Points Measurement Between adjacent contacts.
Dielectric Withstanding Voltage There shall evidence arc-over, insulation breakdown, excessive leakage current milliampere) when unmated connectors tested accordance with MIL-STD-1344A, Method 3001.1. following details shall apply: Test Voltage 1000 volts (DC, 60Hz). Test Duration seconds. Test Condition (760 Torr level). Points Measurement Between adjacent contacts.
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
Current Rating temperature rise above ambient shall exceed degrees point system when contacts powered ampere contact powered 2.25 amperes. following details shall apply: Ambient Conditions Still degrees Reference EIA-364-70.
Capacitance specification requirements shall satisfied when evaluated accordance with Berg Test Specification BUS-03-114 following details. Testing performed using impedance test method with frequency test voltage volt. capacitance measurements taken between signal pins with ground reference, therefore, testing various signal ground ratios required. Measurements made between adjacent pins same with other pins isolated from ground. following Point Measurement utilized obtain given results. POINT MEASUREMENT
Long
Short NOTE:
oMMoo oMMoo oMMoo oMMoo
Point Measurement Unused Signal
Layout pattern represents columns connector which repeated length connector.
average results found listed below: 0.87
1.06
1.15pF
1.24
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
Inductance specification requirements shall satisfied when evaluated accordance with Berg Test Specification BUS-03-113 following details. Testing performed using Test Method with risetime 1000 Pico-seconds. inductance measurements taken each signal ground ratio length [row] connector. Four signal ground ratios tested. ratio tested under conditions order represent worst case ratio possibilities. following Point Measurement utilized obtain given results. POINT MEASUREMENT Condition Condition
Short Long
GMGoG oMooo GMGoG GoMGo oMooo oMooo oMooo oGMoG oMooo oMooo oMooo oMGoo oMooo GMGoG oGMGo GMoGo Point Measurement Unused Signal Terminated ohms Grounded
NOTE:
Layout pattern represents columns connector which repeated length connector.
average results found listed below: Ratio
Condition 15.6 14.1 11.8 Condition 14.5 19.8 10.8 10.5
BUS-12-090 05/18/95
High Count (HPC Connectors Clark Propagation Delay specification requirements shall satisfied when evaluated accordance with Berg Test Specification BUS-03-111 following details. Testing performed using through pulse test method with risetime Pico-Seconds. propagation measurements taken each signal ground ratios length [row] connector. Four signal ground ratios tested. ratio tested under conditions order represent worst case ratio possibilities. following Point Measurement utilized obtain given results:
POINT MEASUREMENT Condition Condition GMGoG oMooo oMooo oMooo oMooo oMooo oMooo GMGoG
Long Short
GMGoG oMooo oMooo oGMGo
GoMGo oGMoG oMGoo GMoGo
Point Measurement Unused Signal Terminated ohms Grounded NOTE: Layout pattern represents columns connector which repeated length connector.
average results found listed below: Ratio Condition Condition
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
Characteristic Impedance specification requirements shall satisfied when evaluated accordance with Berg Test Specification BUS-03-110 following details. Testing performed using Test Method with risetimes 200, 500, 1000 PicoSeconds. impedance measurements taken each signal ground ratio length [row] connector. Four signal ground ratios tested. ratio tested under conditions order represent worst case ratio possibilities. following Point Measurement utilized obtain given results: POINT MEASUREMENT Condition Condition GMGoG oMooo oMooo oMooo
Short Long
oMooo GMGoG oMooo oMooo oMooo oMooo GMGoG oGMGo
GoMGo oGMoG oMGoo GMoGo
Point Measurement Unused Signal Terminated ohms Grounded NOTE: Layout pattern represents columns connector which repeated length connector.
average results found listed below: Ratio Condition Risetime 86.6 72.0 1000 64.3 58.7 56.5 1000 54.1 1000 1000 61.1 57.5 54.6 62.1 57.6 54.4
77.2 76.3 74.2 69.3 66.1 63.4 62.7 60.4 58.1 68.1 82.3 105.0 61.5 70.6 81.6 57.3 63.1 68.8 70.8 63.1 57.8 64.9 59.2 55.0 80.2 66.7 59.5 70.2 61.1 56.4 74.2 63.4 57.9 78.2 65.6 59.2
Condition
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
Cross Talk (Single Active) specification requirements shall satisfied when evaluated accordance with Berg Test Specification BUS-03-108 following details. Testing performed using Matching Test Method with risetimes 200, 500, 1000 Pico-Seconds. points measurement picked give worst case conditions [i.e. greatest distance from ground pins]. following Point Measurement utilized obtain given results: POINT MEASUREMENT Condition Condition GoGoG ooooo ooooo oAQoo oAQoo ooooo ooooo GoGoG
Long Short
GoGoG ooQAo ooooo oGoGo
GAQGo oGooG ooGoo GooGo
Point Measurement Unused Signal Terminated ohms Grounded Quiet NOTE: Layout pattern represents columns connector which repeated length connector.
average results found listed below: Ratio Risetime Near Cross Talk 13.8% 8.3% 5.4% 16.0% 11.5% 8.0% 11.2% 7.4% 4.5% 14.4% 9.3% 5.4% Cross Talk 7.0% 4.8% 3.2% 9.3% 7.8% 5.8% 4.2% 3.2% 2.2% 4.8% 3.8% 2.2%
Condition
1000 1000 1000 1000
Condition
BUS-12-090 05/18/95
High Count (HPC Connectors Clark 6.10
Cross Talk (Multiple Active) specification requirements shall satisfied when evaluated accordance with Berg Test Specification BUS-03-108 following details. Testing performed using Matching Test Method with risetimes 200, 500, 1000 Pico-Seconds. points measurement picked give worst case conditions [i.e. greatest distance from ground pins]. following Point Measurement utilized obtain given results: POINT MEASUREMENT Condition Condition GoGoG AAQAA oAAAo AAAAA AAAAA oAAAo AAQAA GoGoG
Long Short
GAGAG GAQGA AQAA AGAAG AAAA AAGAA oGAGo GAAGA
Point Measurement Unused Signal Terminated ohms Grounded Quiet NOTE: Layout pattern represents columns connector which repeated length connector.
average results found listed below: Ratio Risetime Near Cross Talk Cross Talk
Condition 104.0% 94.0% 76.0% 66.0% 1000 44.0% 38.0% Condition 1000 1000 126.0% 126.0% 98.0% 96.0% 62.0% 58.0% 74.0% 50.0% 28.0% 48.0% 32.0% 18.0%
40.0% 16.7% 24.6% 12.3% 1000 13.8% 6.9% MECHANICAL CHARACTERISTICS
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
Mating/Unmating Force force mate receptacle connector compatible header shall exceed grams (3.5 ounces) contact. unmating force shall less than grams (.75 ounces) contact. following details shall apply: Cross Head Speed inch minute Lubrication None Utilize free floating fixtures Reference MIL-STD-1344A, Method 2013.1
Normal Force contact normal force shall less than grams (nor greater than grams) when tested accordance with Berg Test Specification BUS-03-404. Individual Contact Insertion/Withdrawal Force insertion force shall exceed grams (2.98 ounces) when maximum gauge inserted. After three insertions with maximum gauge, withdrawal force shall less than grams (.49 ounces) when measured using minimum gauge. Figure gauge descriptions. Gauges shall lubricated with solution Isopar Testing shall accordance with Berg Test Specification BUS-03-405. Contact Retention Individual contacts shall withstand axial load pounds minimum applied rate inches/minute without dislodging from housing cavity. Reference MILSTD-1344A, Method 2007.1. Individual Insertion/Retention Force force required insert individual compliant into plated through hole printed circuit board rate inches/minute shall exceed pounds. retention force axial direction opposite that insertion shall less than pounds. Torque Strength There shall damage pin, LLCR shall exceed milliohms, when tested accordance with MIL-STD-202F, Method 211A. following details shall apply: Test Method Torque in-oz
BUS-12-090 05/18/95
High Count (HPC Connectors Clark ENVIRONMENTAL CONDITIONS After exposure following environmental conditions accordance with specified test procedure and/or details, product shall show physical damage shall meet electrical mechanical requirements paragraphs specified Table Test Sequences. Unless specified otherwise, assemblies shall mated during exposure. Thermal Shock MIL-STD-202F, Method 107G. Test Condition (25, 1-hour cycles) Temperature Range Between +125 degrees Time Each Temperature minutes Transfer Time minutes, maximum
Humidity, Steady State MIL-STD-202F, Method 103B. Relative Humidity Temperature degrees Test Condition hours)
Environmental Sequence: (Samples exposed mated) Phase Thermal Shock, 364-32, Condition Test Duration 100, 1-hour cycles Temperature Range Between degrees Time Each Temperature minutes Transfer Time minutes, maximum
Phase Humidity, 364-31, Method (omit step Test Duration hours Temperature degrees
BUS-12-090 05/18/95
High Count (HPC Connectors Clark Phase High Temperature Life, 364-17, Method Condition Test Duration hours Temperature degrees
Industrial Mixed Flowing (IMFG) Battelle Procedure. Class Duration days mated
Vibration MIL-STD-202F, Method 204D. Condition Vibration Amplitude 0.06" +/-15G Frequency Range 2000 hertz Sweep Time Duration minutes sweep, hours along each three orthogonal axes hours total). Mounting Rigidly mount assemblies discontinuities greater than nano seconds
Mechanical Shock MIL-STD-202F, Method 213B. Condition (100G, millisecond sawtooth) Shocks shocks both directions along each three orthogonal axes total). Mounting Rigidly mount assemblies discontinuities greater than nano seconds
Durability Standard laboratory procedure applicable specific product. Number Cycles cycles Cycling Rate inches minute
Solderability MIL-STD-202F, Method 208F. Steam aging hours Contact areas evaluated shall meet Method requirements.
Resistance Solder Heat MIL-STD-202F, Method 210B. Test Condition There shall evidence physical mechanical damage.
BUS-12-090 05/18/95
High Count (HPC Connectors Clark 8.10 Sequential Industrial Mixed Flowing Battelle Procedure. Step Step Step Step Perform durability cycles Subject header only days, Class Subject mated header receptacle days, Class Perform durability cycles
QUALITY ASSURANCE PROVISIONS Equipment Calibration test equipment inspection facilities used performance test shall maintained calibration system accordance with MIL-C-45662 9000. Inspection Conditions Unless otherwise specified herein, inspections shall performed under following ambient conditions: Temperature: degrees Relative Humidity: Barometric Pressure: Local ambient
Sample Quantity Description Each test group consist assemblies described drawing Figure Header Test Board Assembly further described Berg drawing Figure Receptacle Test Board Assembly further described Berg drawing Figure Additional graphic dimensional detail available supporting component drawings which identified drawings 50240 50241.
Acceptance 9.4.1 Electrical mechanical requirements placed test samples indicated paragraphs shall established from test data using appropriate statistical techniques shall otherwise customer specified, samples tested accordance with this product specification shall meet stated requirements.
BUS-12-090 05/18/95
High Count (HPC Connectors Clark 9.4.2
Failures attributed equipment, test setup, operator error shall disqualify product. product failure occurs, corrective action shall taken samples resubmitted qualification. Qualification Testing Qualification testing shall performed sample units produced with equipment procedures normally used production. test sequence shall shown Table
Requalification Testing following conditions occur, responsible product engineer shall initiate requalification testing consisting applicable parts qualification test matrix, Table 9.6.1 significant design change made existing product which impacts product form, function. Examples significant changes shall include, limited changes plating material composition thickness, contact force, contact surface geometry, insulator design, contact base material, contact lubrication requirements. significant change made manufacturing process which impacts product form, function. significant event occurs during production requiring corrective action taken relative product design manufacturing process.
9.6.2
9.6.3
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark
BUS-12-090 05/18/95
High Count (HPC Connectors Clark REVISION RECORD PAGE DESCRIPTION Release V50667 DATE 05/18/95
Other recent searches
VCO-104 - VCO-104 VCO-104 Datasheet
Si7309DN - Si7309DN Si7309DN Datasheet
PG24FAS23 - PG24FAS23 PG24FAS23 Datasheet
EL5192C - EL5192C EL5192C Datasheet
CXG1115AER - CXG1115AER CXG1115AER Datasheet
54ACT16544 - 54ACT16544 54ACT16544 Datasheet
74ACT16544 - 74ACT16544 74ACT16544 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
