FEATURES: Convert surface mount VQFP packages footprint. Reduce costs

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FEATURES: Convert surface mount VQFP packages footprint. Reduce costs

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Part 1110087 VQFP Adapter
FEATURES: Convert surface mount VQFP packages footprint. Reduce costs using less expensive packages replace footprints existing designs. Pins mechanically fastened soldered board using Aries' patented process, creating reliable electrical connection rugged contact. Consult factory panelized form mounting consigned chips. SPECIFICATIONS: Adapter body FR-4 with ounce minimum Copper traces. Pads bare Copper protected with Entek® Enthone Omikron® white eliminate coplanarity concerns solder bridges associated with solder leveling. Pins Brass Alloy hard C36000 ASTM-B16-85. plating 200µ [5.08µm] min. 93/7 Tin/Lead MIL-P-81728 over 100µ [2.54µm] min. Nickel QQ-N-290. Operating temperature=221°F [105°C]. MOUNTING CONSIDERATIONS: Suggested hole size=.028 .003 [.71 .08] dia. Will plug into standard sockets.
Specify Part 1110087 -or1110087-P panelized form when ordering Specify Part Number 144-PGM13095-30 wire wrap socket
DIMENSIONS: INCHES [MILLIMETERS]
Row-to-row: Pin-to-pin: others:
Tolerances: .003 .08] .003 .08] non-cumulative .005 [.13] unless otherwise specified
X-RAY VIEW SIDE ASSIGNMENT
NORTH AMERICA Frenchtown, TEL: (908) 996-6841 FAX: (908) 996-3891
(QFP) SIDE
REV.C PRINTOUTS THIS DOCUMENT DATE SHOULD CONSIDERED UNCONTROLLED
http://www.arieselec.com info@arieselec.com
UK/IRELAND/GB TEL: 0249 FAX: 1653 600493 uking@arieselec.com
EUROPE/MAINLAND/HOLLAND TEL: FAX: 18040 europe@arieselec.com

FEATURES: Convert surface mount VQFP packages footprint. Reduce costs

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