Packaging Trends Needs electronic equipment Optimized System

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Packaging Trends Needs electronic equipment Optimized System

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PACKAGE TRENDS
Packaging Trends
Needs electronic equipment
Optimized System Integration
Performance Multiple functions High speed High output Outline Small Thin Light Assembly Automation Systematization High density
Packaging trends
Package trends
Narrow pitch Multiple pins Miniaturization (Chip Scale Package) (Multi Chip Package) (Flip Chip)
Board trends
System-optimized design
Joint design with users (Packaging Co-Design)
Fine-pitch multi-layer boards Low-thermal expansion High elasticity Buildup Low-cost small thin boards Cards, modules
Simultaneous reflow soldering multiple Mixed mounting High-precision mounting High-density mounting
Mounting technique trends
Trends Package Outlines
Pin-insertion type Reduced size Higher count
Area array package
Surface-mount type Reduced thickness TSOP SSOP
TQFP TFBGA (CSP)
TBGA
Bare Chip
System Configuration Package Evolution Relationship
TFBGA (CSP) TSSOP SSOP Smaller size less weight Head Actuator 3-phase Spindle Motor HLQFP
Exposed heat-spreader type
TQFP HTQFP LQFP
High count higher density Lower thermal resistance
*FCA Flip Chip Attachment
DRAM PSRAM SRAM Cache
Amp. COMBO Driver Spindle Motor Driver
ENDEC
High count higher density
Interface Controller
HTSSOP HTQFP
Exposed die-pad type
Lower thermal resistance
Interface
LQFP TQFP HQFP
HSOI/HSOP HQFP
(Back-exposed type) (Wide heat-radiation lead type)
Example System Configuration
CBIC
MPAK-5
Down converter
IF-IC
User logic (Modem-Rx)
+User logic (Modem-Tx)
LQFP,TQFP
TFBGA (CSP)
(MMIC)
CMPAK SMPAK
Speech CODEC
VSELP PSI-CELP
Antenna switch
(Discrete)
User logic (channel CODEC)
PLL-IC
TQFP TFBGA(CSP)
(pin diode) Quadrature modulation
module
Memory
(ROM/RAM)
driver
TQFP
TFBGA (CSP)
TSOP(II)
Package Mounting Area Count
family
Package mounting area (mm2)
1000
family family
TFBGA (CSP)
count
1000
Package Mounting Height Count
Maximum mounting height (mm)
family EIAJ/JEDEC classification (maximum mounting height) family profile (1.7 Thin (1.2 Very thin (1.0 TFBGA (CSP)
family
1000
count
Package Weight Comparison
Weight
40-pin class
168-pin class
TQFP
Pin-insertion type
TFBGA (CSP) TSOP
Thin surfacemount type TFBGA (CSP) type
Surface-mount type
Package Volume Trend
Volume (cm3)
PC/PDAs Digital Cellular/PDC Terminals
Packages TQFP TSOP 1980
TFBGA (CSP) TFBGA (CSP)
0.01 1970
year
1990
2000
Standardizing Organizations Package Outlines
Electronic Industries Association (Washington, D.C) International Electrotechnical Commission (Geneva) SC47D Meets once year Domestic committee U.S.A. Japan
Electronic Industries Association Japan (Tokyo)
EIAJ
JEDEC
Joint Electron Device Engineering Council Mechanical Stds. (JC-11) Meets four times year
Special Technical Committee Semiconductor Device Packages (EE-13)
Meets once month
JC-11/EE-13 joint meeting (JWG-2) Meets once year
1-10
Representative Reliability Test Standards
EIAJ (Electronic Industries Association Japan)
ED-4701: Environmental endurance test methods semiconductor devices
(International Electrotechnical Commission)
Publication 60068 Basic environment testing Publication 60749 Semiconductor devices mechanical climatic test methods
(Military Standard)
MIL-STD-202F: Test methods electronic electrical component parts MIL-STD-750C: Test method standard semiconductor devices MIL-STD-883E: Test method standard microcircuits
Notes: C7021 (environmental endurance test methods discrete semiconductor devices)and C7022 (environmental endurance test methods semiconductor integrated circuits) were phased 1997
1-11
Hitachi's Position regarding Semiconductor Environmental Problems
Policy Support worldwide environmental regulations environmental protection activities governments business. Cooperate with laboratories solve technical problems. Maintain improve environmental safeguard levels. Regulatory trends Worldwide Trend protection Advancement total abolition ozone layer schedule expansion applied substances specified Montreal protocol. Materials Total abolition schedule Specified chloro-fluorocarbons 2000 DEC.'95 1.1.1-Trichloroethane 2000 DEC.'95 HCFC -2020 Final labeling rule U.S. Environmental Protection Agency (EPA) Products containing class-I manufactured with class-I require labeling. Status Hitachi semiconductors from environmental protection viewpoint Countermeasures manufacturing process (jig cleaning, etching, etc.) Specified chloro-fluorocarbons (class-I) Total abolition Apr.1993 Labeling required Hitachi 1.1.1-Trichloroethane (class-I) 14001 (environmental ISO): Approved sites Semiconductor Integrated Circuits Group
semiconductors
1-12
Lead Semiconductor Products Alternative Materials
Candidates
Package Current technology (Sn-Pb)
mass production some small packages.
Alternative materials Pre-Plated Frame Plating/Dipping Sn-Bi Sn-Bi Sn-Bi Sn-Bi
Sn-Bi Alloy 230°C (current).
Subjects interest customers
Note
MPAK DPAK, etc. TO-XX (TRS etc.) DO-XX (Di) Dipping (Power Plating
Heat resistance improvement Schedule sample mass production will informed future.
Sn-alloy Sn-alloy Sn-alloy Evaluation cooperation with customers
Solder bumps
(Sn-Ag-Cu)
SMD: Surface-mount device. THD: Through-hole device.
1-13

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