HI3055 EPITAXIAL PLANAR TRANSISTOR Description HI3055 d

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HI3055 EPITAXIAL PLANAR TRANSISTOR Description HI3055 d

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Spec. HE9004 Issued Date 1994.01.25 Revised Date 2001.05.31 Page
HI3055
EPITAXIAL PLANAR TRANSISTOR
Description
HI3055 designed general purpose amplifier switching applications.
Absolute Maximum Ratings (Ta=25°C)
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Power Dissipation Total Power Dissipation (Tc=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage Collector Current Base Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO ICEX ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 Min. Typ. Max. Unit Test Conditions IC=200mA, IE=0 IC=10mA, IB=0 IE=10mA, IC=0 VCB=70V, IE=0 VCE=70V, VEB(off)=1.5V VCE=30V, IB=0 VEB=5V, IC=0 IC=4A, IB=400mA IC=10A, IB=3.3A VCE=4V, IC=4A VCE=4V, IC=4A VCE=4V, IC=10A VCE=10V, IC=500mA, f=1MHz
*Pulse Test Pulse Width 380us, Duty Cycle2%
HI3055
HSMC Product Specification
TO-251 Dimension
Marking
HSMC Logo
Spec. HE9004 Issued Date 1994.01.25 Revised Date 2001.05.31 Page
Product Series Rank
Part Number Date Code
Mark
Style 1.Base 2.Collector 3.Emitter
3-Lead TO-251 Plastic Package HSMC Package Code *:Typical
Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835
Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20
Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165
Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50
Notes 1.Dimension tolerance based Spec. dated May. 24,1995.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931
HI3055
HSMC Product Specification

HI3055 EPITAXIAL PLANAR TRANSISTOR Description HI3055 d

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