HI350 EPITAXIAL PLANAR TRANSISTOR Description HI350 des

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HI350 EPITAXIAL PLANAR TRANSISTOR Description HI350 des

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Spec. HE9008 Issued Date 1996.04.12 Revised Date 2002.07.16 Page
HI350
EPITAXIAL PLANAR TRANSISTOR
Description
HI350 designed line operated audio output amplifier, switch mode power supply drivers other switching applications.
Absolute Maximum Ratings (Ta=25°C)
TO-251
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Power Dissipation Total Power Dissipation (Tc=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage. -300 BVCEO Collector Emitter Voltage. -300 BVEBO Emitter Base Voltage. Collector Current. -500
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *hFE Min. -300 -300 Typ. Max. -100 -100 Unit Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-0.1mA, IC=0 VCB=-300V VEB=-3V, IC=0 VCE=-10V, IC=-50mA
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HI350
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 VCE=10V 1000 VCE(sat) IC=10IB
Spec. HE9008 Issued Date 1996.04.12 Revised Date 2002.07.16 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
1000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Safe Operating Area
10000
1000
Collector Current (mA)
PT=1ms PT=100ms PT=1s
1000
Forward Voltage
HI350
HSMC Product Specification
TO-251 Dimension
Marking:
Spec. HE9008 Issued Date 1996.04.12 Revised Date 2002.07.16 Page
Date Code
Control Code
Style: 1.Base 2.Collector 3.Emitter
3-Lead TO-251 Plastic Package HSMC Package Code: Typical
Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835
Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20
Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165
Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50
Notes: 1.Dimension tolerance based Spec. dated May. 24,1995.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HI350
HSMC Product Specification

HI350 EPITAXIAL PLANAR TRANSISTOR Description HI350 des

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