HT666 EPITAXIAL PLANAR TRANSISTOR Description HT666 des
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Spec. HE6464-B Issued Date 1993.09.07 Revised Date 2000.10.01 Page
HT666
EPITAXIAL PLANAR TRANSISTOR
Description
HT666 designed general purpose amplifier highspeed,medium-power switching applications.
Features
High Frequency Current Gain High Speed Switching Transistor
TO-92
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) BVCBO Collector Base Voltage. BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage. Collector Current.
Characteristics (Ta=25°C)
Symbol BVCBO *BVCEO BVEBO ICBO ICEX IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 *hFE6 Min. Typ. Max. Unit Test Conditions IC=10uA IC=100mA IE=10uA VCB=60V VCB=60V, VEB(off)=3V VEB=3V IC=150mA, IB=15mA IC=500mA, IB=50mA IC=150mA, IB=15mA IC=500mA, IB=50mA VCE=10V, IC=100uA VCE=10V, IC=1mA VCE=10V, IC=10mA VCE=10V, IC=150mA VCE=10V, IC=500mA VCE=1V, IC=150mA IC=20mA VCE=20V, f=100MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HSMC Product Specification
Characteristics Curve
Current Gain
1000 10000
Spec. HE6464-B Issued Date 1993.09.07 Revised Date 2000.10.01 Page
Gain Bandwidth Product Collector Current
Gain Bandwidth Product (MHz)
1000
1000
Collector current (mA)
Collector Current (mA)
Collector-Emitter Saturation Voltage
10.0
Total Power Dissipation Ambient Temperature
Total Power Dissipation (mW)
Saturation Voltage
1000
Collector Current (mA)
Ta-Ambient Temperature
Base-Emitter Saturation Voltage
V(BE) Saturation Voltage
1000
Collector current (mA)
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6464-B Issued Date 1993.09.07 Revised Date 2000.10.01 Page
Marking:
Control Code
Style: Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSMC Product Specification
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