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HBT131XA Series Triac, Logic Level Standard Description
Top Searches for this datasheetSpec. HA200209 Issued Date 2002.04.01 Revised Date 2003.06.17 Page HBT131XA Series Triac, Logic Level Standard Description Passivated, sensitive gate triacs plastic envelope, intended general purpose bidirectional switching phase control applications. These devices intended interfaced directly microcontrollers, logic integrated circuits other power gate trigger circuits. TO-92 Quick Reference Data Part HBT131CA HBT131GA VDRM(V) IT(RMS)(A) ITSM Quadrant Configuration Gate Main Terminal Description Main Terminal Symbol Limtiing Values Symbol VDRM, VRRM IT(RMS) ITSM Parameter HBT131CA Repetitive peak off-state voltages HBT131GA Repetitive peak off-state voltages on-state current (full sine wave; Tlead51°C) Non-repetitive peak on-state current (full sine wave; Tj=25°C prior surge, t=20ms) fusing (t=10ms) Repetitive rate rise on-state current after triggering (ITM=1.5A; IG=0.2A; dIG/dt=0.2A/us; (ITM=1.5A; IG=0.2A; dIG/dt=0.2A/us; (ITM=1.5A; IG=0.2A; dIG/dt=0.2A/us; (ITM=1.5A; IG=0.2A; dIG/dt=0.2A/us; Peak gate current Peak gate voltage Peak gate power Average gate power (over 20ms period) Storage temperature Operating junction temperature Min. Max. 0.41 Units A/us A/us A/us A/us dIT/dt PG(AV) Tstg HBT131XA Series HSMC Product Specification HBT131CA HBT131GA Static Characteristics (Tj=25°C, unless otherwise stated, Quadrant) Symbol Parameter Conditions Rank Spec. HA200209 Issued Date 2002.04.01 Revised Date 2003.06.17 Page Unit VD=6V, RL=10, VD=6V, RL=10, GGate Trigger Current VD=6V, RL=10, GVD=6V, RL=10, VD=6V, RL=10, VD=6V, RL=10, GLatching Current VD=6V, RL=10, GVD=6V, RL=10, Holding Current VD=6V, IGT=0.1A On-state Voltage IT=1.2A VD=6V, RL=10, VD=6V, RL=10, GGate Trigger Voltage VD=6V, RL=10, GVD=6V, RL=10, Off-state Leakage VD=VDRM Tj=125°C Current Thermal Resistances Symbol Parameter Conditions full cycle half cycle mounted; lead length=4mm Min. Typ. Max. Unit j-lead Thermal resistance junction lead Thermal resistance junction ambient Dynamic Characteristics (Tj=25°C, unless otherwise stated) Symbol dVD/dt Parameter Critical rate rise off-state voltage Gate controlled turn-on time Conditions VDM=67% VDRM(max); Tj=125°C exponential waveform; RGK=1k ITM=1.5A; VD=VDRM(max) IG=0.1A; dIG/dt=5A/us Min. Typ. Max. Unit V/us HBT131XA Series HSMC Product Specification Characteristics Curve Normalised Gate Trigger Current IGT(Ta)/IGT(25 Versus Temperature T2+/G+ T2-/GT2+/GT2-/G2.5 Spec. HA200209 Issued Date 2002.04.01 Revised Date 2003.06.17 Page Typical Maximum On-State Characteristic IGT/IGT(25 IT/A VT/V Normalised Gate Trigger Voltage VGT(Ta)/VGT(25 Versus Temperature Normalised Holding Current IH(Ta)/IH(25 Versus Temperature T2+/G+ T2-/G- VGT/VGT(25 IL/IL(25 Ta/( Normalised Latching Current IL(Ta)/IL(25 Versus Temperature Maximum On-State Dissipation, Ptot Versus On-State Current, a=conduction angle IL/IL(25 Ptot/w IT(RMS)/A HBT131XA Series HSMC Product Specification TO-92 Dimension Date Code Spec. HA200209 Issued Date 2002.04.01 Revised Date 2003.06.17 Page Marking: Serial Code Rank Code Control Code Style: 1.main terminal 2.Gate 3.main terminal 3-Lead TO-92 Plastic Package HSMC Package Code: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material: Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBT131XA Series HSMC Product Specification Other recent searchesSTD8NM50N - STD8NM50N STD8NM50N Datasheet STF8NM50N - STF8NM50N STF8NM50N Datasheet STP8NM50N - STP8NM50N STP8NM50N Datasheet STU8NM50N - STU8NM50N STU8NM50N Datasheet SML300SUZ12ES - SML300SUZ12ES SML300SUZ12ES Datasheet SLD-67HF1 - SLD-67HF1 SLD-67HF1 Datasheet SCF-0272 - SCF-0272 SCF-0272 Datasheet HIII51008-3 - HIII51008-3 HIII51008-3 Datasheet FR301G - FR301G FR301G Datasheet FR307G - FR307G FR307G Datasheet APT100GF60JU2 - APT100GF60JU2 APT100GF60JU2 Datasheet AN4021 - AN4021 AN4021 Datasheet 2SJ204 - 2SJ204 2SJ204 Datasheet
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