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HTL294D EPITAXIAL PLANAR TRANSISTOR Description HTL294D
Top Searches for this datasheetSpec. Preliminary Data Issued Date 2001.03.01 Revised Date 2001.03.29 Page HTL294D EPITAXIAL PLANAR TRANSISTOR Description HTL294D designed application that requires high voltage. Features High Breakdown Voltage: 400(Min.) IC=1mA High Current: IC=300mA 25°C Absolute Maximum Ratings Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage -400 VCEO Collector Emitter Voltage -400 VEBO Emitter Base Voltage Collector Current -250 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO ICES IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *hFE1 *hFE2 *hFE3 Min. -400 -400 Typ. Max. -0.2 -300 -500 -750 Unit Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-400V, IE=0 VCE=-400V, IC=0 VEB=-6V, VBE=0 IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-10mA, IB=-1mA VCE=-10V, IC=-1mA VCE=-10V, IC=-20mA VCE=-10V, IC=-80mA VCE=-20V, IE=-10mA, f=1MHz VCB=-20V, f=1MHz, IE=0 *Pulse Test Pulse Width 380us, Duty Cycle2% HTL294D HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 10000 Spec. Preliminary Data Issued Date 2001.03.01 Revised Date 2001.03.29 Page Sasturation Voltage Collector Current Saturation Voltage (mV) 1000 VCE(sat) IC=20IB VCE=10V VCE(sat) IC=10IB 1000 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage Collector Current 1000 Capacitance Reverse-Biased Voltage VBE(sat) IC=10IB Saturation Voltage (mV) Capacitance (pF) 1000 Collector Current-IC (mA) Reverse Biased Voltage Safe Operating Area Power Derating PT=1mS PD(W) Power Dissipation Collector Current-IC PT=100mS PT=1S 0.01 1000 Forward Biased Voltage-VCE Ambient Temperature HTL294D HSMC Product Specification TO-126ML Dimension Marking Spec. Preliminary Data Issued Date 2001.03.01 Revised Date 2001.03.29 Page HSMC Logo Part Number Date Code Product Series Rank Marking Style 1.Emitter 2.Collector 3.Base 3-Lead TO-126ML Plastic Package HSMC Package Code *:Typical Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes 1.Dimension tolerance based Spec. dated Mar. 6,1995. 2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 HTL294D HSMC Product Specification Other recent searchesREJ03D0871-0201 - REJ03D0871-0201 REJ03D0871-0201 Datasheet Q51-X1092 - Q51-X1092 Q51-X1092 Datasheet Q53-X1092 - Q53-X1092 Q53-X1092 Datasheet MDC5101 - MDC5101 MDC5101 Datasheet DCS1800 - DCS1800 DCS1800 Datasheet GP2S30 - GP2S30 GP2S30 Datasheet DDS-506-006 - DDS-506-006 DDS-506-006 Datasheet ADS7871 - ADS7871 ADS7871 Datasheet
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