HTL145 EPITAXIAL PLANAR TRANSISTOR Description HTL145 d
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Spec. HE6454 Issued Date 1993.02.24 Revised Date 2003.08.14 Page
HTL145
EPITAXIAL PLANAR TRANSISTOR
Description
HTL145 designed high voltage power switching applications especially telephone telecommunication circuits.
Absolute Maximum Ratings
TO-92
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C). Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage. VCEO Collector Emitter Voltage Collector Current
Electrical Characteristics (Ta=25°C)
Symbol BVCBO BVCEO ICBO ICER IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *hFE1 *hFE2 *hFE3 Min. Typ. Max. Unit Test Conditions IC=100uA IC=1mA VCB=500V VCE=200V VEB=6V IC=20mA, IB=2mA IC=100mA, IB=4mA IC=20mA, IB=2mA VCE=10V, IC=1mA VCE=10V, IC=20mA VCE=10V, IC=80mA VCE=20V, IE=10mA VCB=20V, f=1MHZ
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HTL145
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
10000
Spec. HE6454 Issued Date 1993.02.24 Revised Date 2003.08.14 Page
Saturation Voltage Collector Current
VCE=10V
Saturation Voltage (mV)
1000
VCE(sat) IC=10IB
VCE(sat) IC=4IB
1000
1000
Collector Current (mA)
Collector Current (mA)
Sturation Voltage Collector Current
10000
Capacitance Reverse-Biased Voltage
Saturation Voltage (mV)
Capacitance (Pf)
1000
VBE(sat) IC=10IB
1000
Collector Current (mA)
Reverse Biased Voltage
Safe Operating Area
1000 PT=100ms PT=1s PT=1ms
Collector Current (mA)
1000
Forward Voltage
HTL145
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6454 Issued Date 1993.02.24 Revised Date 2003.08.14 Page
Marking:
Control Code
Style: 1.Emitter 2.Base 3.Collector
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTL145
HSMC Product Specification
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