The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.    


Datasheet Search Engine   
 
Part # or Description: • 5V RS232 Driver • 2SC5066* • "Real Time Clock" • "USB connector" • "blue led" 5mm • 10 watt zener diode • 2N3055* motorola
 
Search Tip: Try entering the part number only. Include a wildcard (eg. lm317* or 1n4148*)

 

 

HMM4148 SURFACE MOUNT SWITCHING DIODES Description HMM4


Datasheet Thumbnail

  

Download PDF



Top Searches for this datasheet



Spec. :Preliminary Data Issued Date 1999.05.01 Revised Date 1999.09.01 Page
HMM4148
SURFACE MOUNT SWITCHING DIODES
Description
HMM4148 designed high-speed switching application hybrid thick-and thin-film circuits.
Absolute Maximum Ratings
Operating temperature range applies unless otherwise specified Characteristics Symbol Value Reverse Voltage Peak Reverse Voltage Rectified Current(Average) Half Wave Rectification with Resistive Load Tamb=25°C f50Hz IFSM Surge Forward Current t<1s Tj=25°C Ptot Power Dissipation Tamb=25°C Junction Temperature Storage Temperature Range +200 Unit
Characteristics Tj=25°C)
Characteristics Forward Voltage IF=10mA Leakage Current VR=20V =75V =20V, Tj=150°C Reverse Breakdown Voltage tested with 100us Pulses Capacitance Voltage Rise when Switching Tested with 50mA Forward Pulses Tp=0.1us, Rise Time<30ns, fp=5~100kHz Reverse Recovery Time From IF=-IR=10mA IRR=-1mA, VR=6V, RL=100 Thermal Resistance Function Ambient Rectification Efficiency f=100MHz, VRF=2V Symbol V(BR)R Ctot RthA 0.45 Unit
0.35 K/mW
HSMC Product Specification
Characteristics Curve
Spec. :Preliminary Data Issued Date 1999.05.01 Revised Date 1999.09.01 Page
HSMC Product Specification
Dimension
Spec. :Preliminary Data Issued Date 1999.05.01 Revised Date 1999.09.01 Page
Cathode Mark
LL-34 Mini-Melf SOD-80C Inches Min. Max. 0.0512 0.0591 0.0118 0.0197
*:Typical
Millimeters Min. Max. 1.30 1.50 0.30 0.50
Inches Min. Max. 0.0118 0.0197 0.1260 0.1417
Millimeters Min. Max. 0.30 0.50
Notes 1.Dimension tolerance based Spec. dated Sep. 30,1999
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification

Other recent searches


XC68HC05JP6 - XC68HC05JP6   XC68HC05JP6 Datasheet
WEDPN8M64V-XB2X - WEDPN8M64V-XB2X   WEDPN8M64V-XB2X Datasheet
TPS2375 - TPS2375   TPS2375 Datasheet
TPS2376 - TPS2376   TPS2376 Datasheet
TPS2377 - TPS2377   TPS2377 Datasheet
FAE397-A11 - FAE397-A11   FAE397-A11 Datasheet
DSP96002 - DSP96002   DSP96002 Datasheet
DSP56F80x - DSP56F80x   DSP56F80x Datasheet

 

Privacy Policy | Disclaimer
© 2012 Datasheet Archive