HMBD914 HIGH-SPEED SWITCHING DIODE Description HMBD914

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HMBD914 HIGH-SPEED SWITCHING DIODE Description HMBD914

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Spec. HE6538 Issued Date 1997.01.18 Revised Date 2002.10.25 Page
HMBD914
HIGH-SPEED SWITCHING DIODE
Description
HMBD914 designed high-speed switching application hybrid thick-and thin-film circuits. device manufactured silicon epitaxial planar process packed plastic surface mount package.
SOT-23
Features
Small Package (SOT-23) Ultra-high Speed Forward Voltage Fast Reverse Recovery Time
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Power Dissipation Total Power Dissipation (Ta=25°C). Maximum Voltages Currents (Ta=25°C) Repetitive Peak Reverse Voltage. Coinuous Reverse Voltage. Continuous Forward Current. IFSM Peak Forward Surge Current. IFSM Non-Repetitive Peak Forward Current t=1uS IFSM Non-Repetitive Peak Forward Current t=1mS IFSM Non-Repetitive Peak Forward Current t=1S
Characteristics (Ta=25°C)
Characteristic Forward Voltage Reverse Breakdown Voltage Reverse Current Diode Capacitance Reverse Recovery Time Symbol IR(1) IR(2) Condition IF=10mA IR=100uA VR=25V VR=75V VR=0, F=1MHz IF=IR=10mA, RL=100 Measured IR=1mA Unit
HMBD914
HSMC Product Specification
Characteristics Curve
Forward Biased Voltage Forward Current
Spec. HE6538 Issued Date 1997.01.18 Revised Date 2002.10.25 Page
Capacitance Reverse-Biased Voltage
Current-IF (mA)
1000 1500 2000
Capacitance-Cd (pF)
Forward Biased Voltage-V (mV)
Reverse-Biased Voltage-VR
HMBD914
HSMC Product Specification
SOT-23 Dimension
Diagram:
Spec. HE6538 Issued Date 1997.01.18 Revised Date 2002.10.25 Page
Marking:
Rank Code Control Code
3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code:
Style: 1.Anode 2.NC 3.Cathode Typical
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Dimension tolerance based Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBD914
HSMC Product Specification

HMBD914 HIGH-SPEED SWITCHING DIODE Description HMBD914

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