HSC945 EPITAXIAL PLANAR TRANSISTOR Description HSC945 d
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Spec. HE6517 Issued Date 1995.02.11 Revised Date 2002.12.16 Page
HSC945
EPITAXIAL PLANAR TRANSISTOR
Description
HSC945 designed using driver stage amplifier speed switching applications.
Absolute Maximum Ratings
TO-92
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current. Base Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE1 *hFE2 Min. Typ. Max. Unit Test Conditions IC=100uA, IE=0 IC=1mA. IB=0 IE=10uA. IC=0 VCB=60V, IE=0 VEB=5V, IB=0 IC=100mA, IB=10mA VCE=6V, IC=0.1mA VCE=6V, IC=1mA VCE=6V, IC=10mA, f=100MHz VCB=10V, f=1MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification hFE2
Rank Range 135-270 200-400 300-600
HSC945
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 1000 VCE(sat) @IC=10IB
Spec. HE6517 Issued Date 1995.02.11 Revised Date 2002.12.16 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
VCE=6V
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage Collector Current
1000
Voltage Collector Current
Saturation Voltage (mV)
VBE(sat) IC=10IB
VBE(sat) IC=10IB
Voltage (mV)
Collector Current-IC (mA)
Collector Current (mA)
Capacitance Reverse-Biased Voltage
Cutoff Frequency Collector Current
1000
Cutoff Frequency (MHz).
Capacitance (Pf)
VCE=5V
Reverse Biased Voltage
Collector Current (mA)
HSC945
HSMC Product Specification
Spec. HE6517 Issued Date 1995.02.11 Revised Date 2002.12.16 Page
Safe Operating Area
10000 PT=1ms 1000 PT=100ms
PD-Ta
Power Dissipation-PD (mW)
Collector Current (mA)
PT=1s
Forward Voltage (mV)
Ambient Temperature-Ta(
HSC945
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6517 Issued Date 1995.02.11 Revised Date 2002.12.16 Page
Marking:
Rank Control Code
Style: 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSC945
HSMC Product Specification
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